{"title":"ASTM D 5470 TIM材料试验","authors":"Kevin Hanson","doi":"10.1109/STHERM.2006.1625205","DOIUrl":null,"url":null,"abstract":"The ASTM D 54701 standard is currently being revised to cover a test method for the measurement of thermal impedance and calculation of an apparent thermal conductivity for thermal interface materials (TIM) ranging from liquid compounds to hard solids. Modifications to the procedure include the use of mechanical stops to control the specimen thickness under test and an in situ thickness measurement to monitor the specimen thickness if the thickness dimension of the specimen can change during the test. Rigid materials that will not coalesce together require the preparation of specimens of different thickness to obtain the multiple thermal impedance measurements needed to calculate the thermal conductivity. The revised method does not call out a specific clamping pressure to be used for all material types but instead specifies that the clamping pressure required is either that which is sufficient to contact the mechanical stops or to coalesce multiple layers together without damaging the test specimens. Measuring the 3 primary properties - the heat flow through the test specimen, the temperature difference across it, and the thickness of the specimen under test - is still stressed","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"ASTM D 5470 TIM material testing\",\"authors\":\"Kevin Hanson\",\"doi\":\"10.1109/STHERM.2006.1625205\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The ASTM D 54701 standard is currently being revised to cover a test method for the measurement of thermal impedance and calculation of an apparent thermal conductivity for thermal interface materials (TIM) ranging from liquid compounds to hard solids. Modifications to the procedure include the use of mechanical stops to control the specimen thickness under test and an in situ thickness measurement to monitor the specimen thickness if the thickness dimension of the specimen can change during the test. Rigid materials that will not coalesce together require the preparation of specimens of different thickness to obtain the multiple thermal impedance measurements needed to calculate the thermal conductivity. The revised method does not call out a specific clamping pressure to be used for all material types but instead specifies that the clamping pressure required is either that which is sufficient to contact the mechanical stops or to coalesce multiple layers together without damaging the test specimens. Measuring the 3 primary properties - the heat flow through the test specimen, the temperature difference across it, and the thickness of the specimen under test - is still stressed\",\"PeriodicalId\":222515,\"journal\":{\"name\":\"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium\",\"volume\":\"1 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-03-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/STHERM.2006.1625205\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/STHERM.2006.1625205","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
摘要
ASTM D 54701标准目前正在修订,以涵盖热界面材料(TIM)的热阻抗测量和表观导热系数计算的测试方法,范围从液体化合物到硬固体。对程序的修改包括使用机械停止来控制被测试样的厚度,如果试样的厚度尺寸在测试过程中发生变化,则使用原位厚度测量来监测试样的厚度。不会聚结在一起的刚性材料需要制备不同厚度的试样,以获得计算导热系数所需的多次热阻抗测量。修订后的方法没有要求对所有材料类型使用特定的夹紧压力,而是规定所需的夹紧压力要么是足以接触机械止点的压力,要么是在不损坏试件的情况下将多层粘合在一起的压力。测量3个主要特性——通过试样的热流、温差和被测试样的厚度——仍然是有应力的
The ASTM D 54701 standard is currently being revised to cover a test method for the measurement of thermal impedance and calculation of an apparent thermal conductivity for thermal interface materials (TIM) ranging from liquid compounds to hard solids. Modifications to the procedure include the use of mechanical stops to control the specimen thickness under test and an in situ thickness measurement to monitor the specimen thickness if the thickness dimension of the specimen can change during the test. Rigid materials that will not coalesce together require the preparation of specimens of different thickness to obtain the multiple thermal impedance measurements needed to calculate the thermal conductivity. The revised method does not call out a specific clamping pressure to be used for all material types but instead specifies that the clamping pressure required is either that which is sufficient to contact the mechanical stops or to coalesce multiple layers together without damaging the test specimens. Measuring the 3 primary properties - the heat flow through the test specimen, the temperature difference across it, and the thickness of the specimen under test - is still stressed