Micro-scale liquid cooling system for high heat flux processor cooling applications

G. Upadhya, M. Munch, P. Zhou, J. Horn, D. Werner, M. Mcmaster
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引用次数: 20

Abstract

The requirements for thermal management in high performance computers are rapidly outpacing the capabilities of the best commercial heat sinks, including those with integrated heat pipes. The problem lies in three compounding trends: a) higher total chip power, b) higher local heat flux in chip hotspots, and c) smaller system enclosures. Pumped liquid cooling is a promising alternative, but this approach requires innovation and careful design to cool a high heat flux chip within a targeted system volume. To address this problem, Cooligy has developed a new pumped liquid, microscale cooling system for use in high heat flux applications. The cooling system features a microstructure heat exchanger for high heat flux removal capability, a reliable mechanical pump for delivering fluid with the required flow rate and pressure, and an efficient liquid-air radiator heat exchanger. The microstructure heat exchanger is optimally designed to handle high heat flux on a high-performance microprocessor and the mechanical pump is compact, and demonstrates high reliability. In this paper, an example of high heat flux processor cooling using the new micro-scale liquid cooling system developed at Cooligy is described, for a workstation processor cooling application. The liquid cooling system is in high volume production
用于高热流密度处理器冷却应用的微尺度液体冷却系统
高性能计算机对热管理的需求正在迅速超过最好的商业散热器的能力,包括那些集成热管的散热器。问题在于三个复合趋势:a)更高的芯片总功率,b)更高的芯片热点局部热流,以及c)更小的系统外壳。泵送液体冷却是一种很有前途的替代方案,但这种方法需要创新和精心设计,以在目标系统体积内冷却高热流密度芯片。为了解决这个问题,Cooligy开发了一种用于高热流密度应用的新型泵送液体微尺度冷却系统。冷却系统的特点是具有高热流通量去除能力的微结构换热器,可靠的机械泵以所需的流速和压力输送流体,以及高效的液体-空气散热器换热器。微结构换热器经过优化设计,可在高性能微处理器上处理高热流密度,机械泵结构紧凑,可靠性高。本文描述了一个使用Cooligy开发的新型微尺度液冷系统进行高热流密度处理器冷却的例子,该系统用于工作站处理器冷却应用。液体冷却系统大批量生产
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