Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium最新文献_第2页

Thermal resistance measurement of LEDswith multi-chip packages 多芯片封装led的热阻测量

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625226

L. Kim, M. Shin

引用次数: 8

Thermal management of an led light engine for airborne applications 机载led光引擎的热管理

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625225

R. Wilcoxon, D. Cornelius

引用次数: 17

Hot spot cooling using embedded thermoelectric coolers 热点冷却采用嵌入式热电冷却器

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625219

G. J. Snyder, Marco Soto, Randy Alley, David Koester, Bob Conner Nextreme

引用次数: 117

Thermal performance of thermoelectric cooler (tec) integrated heat sink and optimizing structure for low acoustic noise / power consumption 热电冷却器(tec)的热性能集成散热器和优化结构，以降低噪音/功耗

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625220

M. Ikeda, T. Nakamura, Y. Kimura, H. Noda, I. Sauciuc, H. Erturk

引用次数: 11

Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators 三维体积硅微制冷机掺杂浓度优化

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625234

Yan Zhang, G. Zeng, A. Shakouri, Peng Wang, Bao Yang, A. Bar-Cohen

{"title":"Optimization of doping concentration for three-dimensional bulk silicon microrefrigerators","authors":"Yan Zhang, G. Zeng, A. Shakouri, Peng Wang, Bao Yang, A. Bar-Cohen","doi":"10.1109/STHERM.2006.1625234","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625234","url":null,"abstract":"We designed and fabricated a three-dimensional (3D) silicon microrefrigerator, which demonstrates a cooling power density over 200W/cm with only ~1degC cooling. The high cooling power density is mainly due to the high thermal conductivity and heat spreading effects. These devices have potential application in hot-spots management to reduce the chip peak temperature and realize on chip thermal management. A finite element model is developed to study and optimize these 3D devices. The simulation results showed that the optimized doping concentration to achieve the maximum cooling for these 3D silicon microrefrigerators (5e18 cm-3) is different from the conventional ID device, where S2sigma achieves the maximum at the doping of 5e19 cm-3. At its optimized doping concentration, these silicon microrefrigerators could reach a maximum cooling of 3degC. Further studies prove that this deviation is due to the nonidea factors inherent within the device, e.g. semiconductor-metal contact resistance, Joule-heating from probe contact resistance etc. Thus to optimize the real device, it is necessary to chose a full model considering all the nonideal factors","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133113912","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Advanced DBC (direct bonded copper) substrates for high power and high voltage electronics 用于大功率和高压电子设备的先进DBC(直接键合铜)衬底

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625233

J. Schulz-Harder

引用次数: 12

Experimental study on a hybrid liquid/air cooling system 液/空混合冷却系统的实验研究

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625199

D. Xiong, K. Azar, B. Tavassoli

{"title":"Experimental study on a hybrid liquid/air cooling system","authors":"D. Xiong, K. Azar, B. Tavassoli","doi":"10.1109/STHERM.2006.1625199","DOIUrl":"https://doi.org/10.1109/STHERM.2006.1625199","url":null,"abstract":"A high capacity hybrid liquid/air cooling system is proposed and partially tested in this paper. The cooling system is a compact sized package, including a forced thermal spreader with a small pump, a manifold minichannel air heat sink and an air mover. The forced thermal spreader can greatly reduce the spreading thermal resistance and bring more uniform temperature distribution on the top surface. The manifold minichannel air heat sink has a very low thermal resistance while keeping reasonable pressure drop. The heat is first transported from the chip to the liquid inside the forced thermal spreader, and then the liquid spreads to the surface of the heat sink, via circulating in the microchannels and minichannels inside the spreader. Following that, by uniquely designed manifold heat sink, the heat is transferred into ambient environment. The cooling system inherits the advantages from both liquid and air, and at the same time, it avoids problems from liquid cooling like size, leakage and high thermal resistance of air cooling side of the overall loop. A prototype has been manufactured and tested to verify the design","PeriodicalId":222515,"journal":{"name":"Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2006-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130104740","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Evaporator/boiler design for thermosyphons utilizing segregated hydrofluoroether working fluids 利用分离氢氟醚工作流体的热虹吸管蒸发器/锅炉设计

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625209

P. Tuma

引用次数: 28

Challenges in thermal interface material testing 热界面材料测试方面的挑战

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625204

C. Lasance, C. Murray, D. Saums, M. Renez

引用次数: 63

Prediction of thermal performance degradation of air-cooled fine-pitch fin array heat sinks due to fouling 风冷细间距翅片阵列散热器因结垢导致热性能退化的预测

Twenty-Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium Pub Date : 2006-03-14 DOI: 10.1109/STHERM.2006.1625198

A. Nabi, P. Rodgers, A. Bar-Cohen

引用次数: 5