{"title":"Process-variation aware mapping of real-time streaming applications to MPSoCs for improved yield","authors":"D. Mirzoyan, B. Akesson, K. Goossens","doi":"10.1109/ISQED.2012.6187472","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187472","url":null,"abstract":"As technology scales, the impact of process variation on the maximum supported frequency (FMAX) of individual cores in a MPSoC becomes more pronounced. Task allocation without variation-aware performance analysis can result in a significant loss in yield, defined as the number of manufactured chips satisfying the application timing requirement. We propose variation-aware task allocation for real-time streaming applications modeled as task graphs. Our solutions are primarily based on the throughput requirement, which is the most important timing requirement in many real-time streaming applications. The three main contributions of this paper are: 1) Using data flow graphs that are well-suited for modeling and analysis of real-time streaming applications, we explicitly model task execution both in terms of clock cycles (which is independent of variation) and seconds (which does depend on the variation of the resource), which we connect by an explicit binding. 2) We present two approaches for optimizing the yield. The approaches give different results at different costs. 3) We present exhaustive and heuristic algorithms that implement the optimization approaches. Our variation-aware mapping algorithms are tested on models of real applications, and are compared to the mapping methods that are unaware of hardware variation. Our results demonstrate yield improvements of up to 50% with an average of 31%, showing the effectiveness of our approaches.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"115 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123976259","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Fahad Ahmed, M. Sabry, David Atienza Alonso, L. Milor
{"title":"Wearout-aware compiler-directed register assignment for embedded systems","authors":"Fahad Ahmed, M. Sabry, David Atienza Alonso, L. Milor","doi":"10.1109/ISQED.2012.6187471","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187471","url":null,"abstract":"Although constant technology scaling has resulted in considerable benefits, smaller device dimensions, higher operating temperatures and electric fields have also contributed to faster device aging due to wearout. Not only does this result in the shortening of processor lifetimes, it leads to faster wearout resultant performance degradation with operating time. Instead of taking a reactive approach towards reliability awareness, we propose a pre-emptive route toward wearout mitigation. Given the significant thermal and stress variation across the components of microprocessors, in this work we focus on one of the most likely candidates for overheating and hence reliability failures, the register file. We propose different wearout-aware compiler-directed register assignment techniques that distribute the stress induced wearout throughout the register file, with the aim of improving the lifetime of the register file, with negligible performance overhead. We compare our results with a state-of-the-art thermal-aware compilation scheme to show the clear advantage our proposed wearout-aware scheme has over thermal-aware schemes in terms of lifetime improvement that can reach up to 20% for Bias Temperature Instability.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122693301","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Optimization of importance sampling Monte Carlo using consecutive mean-shift method and its application to SRAM dynamic stability analysis","authors":"Takeshi Kida, Y. Tsukamoto, Y. Kihara","doi":"10.1109/ISQED.2012.6187551","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187551","url":null,"abstract":"With the scaling of MOSFET dimensions and the lowering of supply voltage, more precise estimation of minimum operating voltage (Vmin) of SRAM at 6-sigma level is needed. In this paper, we propose a method based on the importance sampling (IS) Monte Carlo simulation to elaborately predict Vmin for future technology node below 22 nm generation. By executing Monte Carlo (MC) simulation with consecutive mean-shift method we propose, it is shown that the most probable failure point (MPFP) is effectively and steadily derived within 0.01σ accuracy without depending on the way of random number generation. The proposed method is applied to static and dynamic behaviors of SRAM. Through the comparison with the results obtained by conventional IS method, we clarify that the method proposed is more suitable for future SRAM characterization.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123365722","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A novel robust signaling scheme for high-speed low-power communication over long wires","authors":"M. Dave, M. Baghini, D. Sharma","doi":"10.1109/ISQED.2012.6187491","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187491","url":null,"abstract":"This paper describes a new capacitively coupled driver and a receiver with a new analog equalizer for high-speed low-power communication over long on-chip wires. The proposed signaling scheme improves upon state of the art capacitively driven interconnect based scheme for enhanced robustness and energy efficiency of the signaling scheme. The proposed signaling scheme has been designed in 90nm CMOS process. Simulations indicate that the proposed scheme can transmit and receive data at the rate of 3.22Gbps over a 10mm long channel while consuming only 0.107pJ/bit. This is the lowest reported energy/bit for high-speed on-chip communication over long on-chip wires. Monte Carlo and process corner simulations show that the proposed scheme allows up to 3Gbps of data rate even in the presence of intra-die and inter-die process variations.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129851993","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Ho-lin Chang, Hsiang-Cheng Lai, Tsu-Yun Hsueh, W. Cheng, Mely Chen Chi
{"title":"A 3D IC designs partitioning algorithm with power consideration","authors":"Ho-lin Chang, Hsiang-Cheng Lai, Tsu-Yun Hsueh, W. Cheng, Mely Chen Chi","doi":"10.1109/ISQED.2012.6187486","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187486","url":null,"abstract":"We present an effective algorithm to partition a circuit into k layers under power density constraints for 3D IC designs. Our algorithm utilizes a multilevel structure and a successive 3D aware two-way partition method to minimize the number of signal TS Vs and area overhead. A layer swapping technique is used to improve total number of signal TSVs and power TSVs. Finally, a zero-gain cell move technique is used to refine the area overhead. Our test cases are 4 industrial circuits provided in the IC/CAD 2011 contest in Taiwan [1]. Experimental results show that our results are better than those of all teams in the contest. In addition, we study the impact on signal TSVs of an extended hMetics method, simultaneous k-way partition, and successive two-way partition for k layer 3D ICs. The results show that the successive two-way partition method is superior to the other methods both in number of TSVs and run time.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130189334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
B. Kaur, Sandeep Vundavalli, S. Manhas, S. Dasgupta, B. Anand
{"title":"An accurate current source model for CMOS based combinational logic cell","authors":"B. Kaur, Sandeep Vundavalli, S. Manhas, S. Dasgupta, B. Anand","doi":"10.1109/ISQED.2012.6187549","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187549","url":null,"abstract":"A current source model (CSM) is presented for CMOS logic cells, which can be used for accurate analysis of delay in CMOS VLSI circuits. In current technology, CS model can be considered as an accurate model for modern static timing and noise analysis. By using the combinational CS model for CMOS logic cell, different values of parasitic capacitances are correctly evaluated. Output voltage waveform is designed by considering the logic cell as load. The output voltage of the CMOS inverter by using CS model is compared with HSPICE simulated output voltage waveform of an inverter. Analysis for output voltage waveform of CS model is accurate as near as approximately 98% to the HSPICE simulated waveform. By using the CS model, different parasitic capacitances are also being evaluated. Variations of these parasitic capacitances are also being evaluated for different values of input and output voltages.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"95 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124729508","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Process induced mechanical stress aware poly-pitch optimization for enhanced circuit performance","authors":"N. Alam, B. Anand, S. Dasgupta","doi":"10.1109/ISQED.2012.6187570","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187570","url":null,"abstract":"This paper investigates the circuit performance improvement through poly-pitch scaling in strain engineered devices. We use tensile contact etch stop liner(t-CESL), compressive contact etch stop liner(c-CESL), embedded SiC and SiGe as stress sources in NMOS and PMOS devices. It is observed that poly-pitch optimization delivers ~18% and ~13% reduction in delay of an inverter driving FO4 and FOl loads respectively. We observe that, in the presence of process induced mechanical stress; the optimum poly-pitch depends upon the size of the driver and the load. Finally, we present a model for choosing optimum poly-pitch for enhanced circuit performance while taking care of the power constraint.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124157177","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Takashi Sato, H. Awano, Hirofttmi Shimizu, Hiroshi Tsutsui, H. Ochi
{"title":"Statistical observations of NBTI-induced threshold voltage shifts on small channel-area devices","authors":"Takashi Sato, H. Awano, Hirofttmi Shimizu, Hiroshi Tsutsui, H. Ochi","doi":"10.1109/ISQED.2012.6187510","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187510","url":null,"abstract":"Performance variability of miniaturized devices has become a major obstacle for designing electronic systems. Temporal degradation of threshold voltages and its variation are going to be an additional concerns to ensure their reliability. In this paper, based on measurement results on large number of devices, we present statistical properties of device degradation and recovery. The measurement data is obtained by using a device-array circuit suitable for efficiently collect statistical data on degradations and recoveries of very small channel-area devices. Stair-like change of threshold voltages found in our measurement suggests that charge trapping and emission may play a key role in the device degradation process.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126815357","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Efficient electro-thermal co-analysis on CPU+GPU heterogeneous architecture","authors":"Huang Kun, Yang Xu, Guoxing Zhao, Zuying Luo","doi":"10.1109/ISQED.2012.6187519","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187519","url":null,"abstract":"Since supply voltage and temperature (V&T) directly influence IC performance and reliability, electro-thermal (ET) analysis including power/ground (P/G) analysis and thermal analysis is very important in IC design. On the observation that temperature's influence on leakage current (ET coupling effect) and supply voltage's influence on power consumption, this work proposes a novel iteration-based ET co-analysis method that simultaneously solves V&T and then with them to refresh power consumption for the next round of V&T solving. Different from present methods that regard the P/G analysis and thermal analysis as independent processes without interaction, the ET co-analysis method takes their interaction into the consideration, which leads to more practical results. Since both P/G analysis and thermal analysis are very time-consuming, this work further employs multi-thread and GPU parallel computing techniques to speed up the ET co-analysis based on a parallel computing system of CPU+GPU heterogeneous architecture (PCS_CGHA). Experimental results show that compared with our method, present ET analysis methods will give too pessimistic or optimistic results W/O considering ET coupling effect. And our efficient method on PCS_CGHA provides 44 times speedup over the naive analysis method with no acceleration.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"2012 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127395317","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"An ultra-low voltage digitally controlled low-dropout regulator with digital background calibration","authors":"Yongtae Kim, Peng Li","doi":"10.1109/ISQED.2012.6187488","DOIUrl":"https://doi.org/10.1109/ISQED.2012.6187488","url":null,"abstract":"In this paper, we describe a novel ultra-low voltage digitally controlled low-dropout (LDO) voltage regulator offering digitally controllable dynamic voltage scaling (DVS) for near/sub-threshold applications. We eliminate the reference voltage in conventional LDOs and adopt the reference clock that enables the proposed LDO to be controlled digitally. The analog components are replaced by digital counterparts which are able to operate at near/sub-threshold regime. Additionally, a digital background calibration scheme is proposed to minimize the regulated voltage errors due to process, voltage, and temperature (PVL) variations. The proposed LDO has been designed in a 90-nm regular Vt CMOS process and the active area is 0.038-mm2. The LDO can regulate the output voltage from 260-mV to 440-mV, while the input supply voltage is from 380-mV to 500-mV. It delivers 3-mA load current at a 500-mV input and the quiescent current is 30.8-μA. The current and power efficiencies reach 99.0% and 87.1%, respectively. Furthermore, the regulated output voltage of the proposed LDO is tunable digitally in run-time with various step sizes.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127005728","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}