嵌入式系统的损耗感知编译器定向寄存器赋值

Fahad Ahmed, M. Sabry, David Atienza Alonso, L. Milor
{"title":"嵌入式系统的损耗感知编译器定向寄存器赋值","authors":"Fahad Ahmed, M. Sabry, David Atienza Alonso, L. Milor","doi":"10.1109/ISQED.2012.6187471","DOIUrl":null,"url":null,"abstract":"Although constant technology scaling has resulted in considerable benefits, smaller device dimensions, higher operating temperatures and electric fields have also contributed to faster device aging due to wearout. Not only does this result in the shortening of processor lifetimes, it leads to faster wearout resultant performance degradation with operating time. Instead of taking a reactive approach towards reliability awareness, we propose a pre-emptive route toward wearout mitigation. Given the significant thermal and stress variation across the components of microprocessors, in this work we focus on one of the most likely candidates for overheating and hence reliability failures, the register file. We propose different wearout-aware compiler-directed register assignment techniques that distribute the stress induced wearout throughout the register file, with the aim of improving the lifetime of the register file, with negligible performance overhead. We compare our results with a state-of-the-art thermal-aware compilation scheme to show the clear advantage our proposed wearout-aware scheme has over thermal-aware schemes in terms of lifetime improvement that can reach up to 20% for Bias Temperature Instability.","PeriodicalId":205874,"journal":{"name":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","volume":"52 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-03-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Wearout-aware compiler-directed register assignment for embedded systems\",\"authors\":\"Fahad Ahmed, M. Sabry, David Atienza Alonso, L. Milor\",\"doi\":\"10.1109/ISQED.2012.6187471\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Although constant technology scaling has resulted in considerable benefits, smaller device dimensions, higher operating temperatures and electric fields have also contributed to faster device aging due to wearout. Not only does this result in the shortening of processor lifetimes, it leads to faster wearout resultant performance degradation with operating time. Instead of taking a reactive approach towards reliability awareness, we propose a pre-emptive route toward wearout mitigation. Given the significant thermal and stress variation across the components of microprocessors, in this work we focus on one of the most likely candidates for overheating and hence reliability failures, the register file. We propose different wearout-aware compiler-directed register assignment techniques that distribute the stress induced wearout throughout the register file, with the aim of improving the lifetime of the register file, with negligible performance overhead. We compare our results with a state-of-the-art thermal-aware compilation scheme to show the clear advantage our proposed wearout-aware scheme has over thermal-aware schemes in terms of lifetime improvement that can reach up to 20% for Bias Temperature Instability.\",\"PeriodicalId\":205874,\"journal\":{\"name\":\"Thirteenth International Symposium on Quality Electronic Design (ISQED)\",\"volume\":\"52 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-03-19\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Thirteenth International Symposium on Quality Electronic Design (ISQED)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISQED.2012.6187471\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Thirteenth International Symposium on Quality Electronic Design (ISQED)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISQED.2012.6187471","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8

摘要

尽管不断的技术扩展带来了相当大的好处,但更小的设备尺寸、更高的工作温度和电场也会导致设备因磨损而更快老化。这不仅会缩短处理器的生命周期,还会导致更快的损耗,从而导致性能随着操作时间的推移而下降。我们提出了一种减少磨损的先发制人的方法,而不是采取被动的方法来提高可靠性。考虑到微处理器组件的显著热和应力变化,在这项工作中,我们将重点关注最可能导致过热和可靠性故障的候选者之一,即寄存器文件。我们提出了不同的损耗感知编译器定向寄存器分配技术,这些技术将应力引起的损耗分布到整个寄存器文件中,目的是提高寄存器文件的生命周期,而性能开销可以忽略不计。我们将我们的结果与最先进的热感知编译方案进行比较,以显示我们提出的磨损感知方案在寿命改善方面比热感知方案具有明显的优势,可达到20%的偏置温度不稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Wearout-aware compiler-directed register assignment for embedded systems
Although constant technology scaling has resulted in considerable benefits, smaller device dimensions, higher operating temperatures and electric fields have also contributed to faster device aging due to wearout. Not only does this result in the shortening of processor lifetimes, it leads to faster wearout resultant performance degradation with operating time. Instead of taking a reactive approach towards reliability awareness, we propose a pre-emptive route toward wearout mitigation. Given the significant thermal and stress variation across the components of microprocessors, in this work we focus on one of the most likely candidates for overheating and hence reliability failures, the register file. We propose different wearout-aware compiler-directed register assignment techniques that distribute the stress induced wearout throughout the register file, with the aim of improving the lifetime of the register file, with negligible performance overhead. We compare our results with a state-of-the-art thermal-aware compilation scheme to show the clear advantage our proposed wearout-aware scheme has over thermal-aware schemes in terms of lifetime improvement that can reach up to 20% for Bias Temperature Instability.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信