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2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems最新文献

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Bead-Immobilized Molecular Beacons for High Throughput SNP Genotyping Via a Microfluidic System 微流控系统用于高通量SNP基因分型的珠状固定化分子信标
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805379
R. Sochol, A. Mahajerin, B. Casavant, P. Singh, M. Dueck, L. Lee, L. Lin
{"title":"Bead-Immobilized Molecular Beacons for High Throughput SNP Genotyping Via a Microfluidic System","authors":"R. Sochol, A. Mahajerin, B. Casavant, P. Singh, M. Dueck, L. Lee, L. Lin","doi":"10.1109/MEMSYS.2009.4805379","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805379","url":null,"abstract":"This paper reports the first demonstration of single nucleotide polymorphism (SNP) genotyping via molecular beacon probes immobilized on polystyrene microbead substrates within a dynamic microfluidic system. Additionally, we present an optimized bead immobilization technique, micropost array trapping (¿PAT), for high-density and high-throughput arraying of beads. Quantitative detection was achieved at room temperature for three label-free DNA oligonucleotide sequences based on the genome of the Hepatitis C Virus (HCV) in humans. SNP detection technology is integral for the realization of personalized medicine and genetic disease identification, and this system offers a promising technique for fast, sensitive, and cost-effective SNP genotyping.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122602023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Fabrication of Biodegradable Microcapsules Utilizing 3D, Surface Modified PDMS Microfluidic Devices 利用三维、表面改性PDMS微流控装置制备可生物降解微胶囊
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805477
C. Liao, Y. Su
{"title":"Fabrication of Biodegradable Microcapsules Utilizing 3D, Surface Modified PDMS Microfluidic Devices","authors":"C. Liao, Y. Su","doi":"10.1109/MEMSYS.2009.4805477","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805477","url":null,"abstract":"We have successfully demonstrated the fabrication of biodegradable and magnetic microcapsules utilizing PDMS double emulsification devices. Specially designed 3D microfluidic channels with surface modified by a self-aligned photo-grafting process are employed to shape immiscible fluids into monodisperse W/O/W emulsions. By varying the outer and inner fluid flow-rates, the overall and core sizes of the resulting double emulsions can be adjusted accordingly. Biodegradable materials and surface-treated ¿-Fe2O3 nanoparticles are dispersed uniformly in the middle organic phase, and solidified into magnetic microcapsules once the solvent is extracted. In the prototype demonstration, microcapsules made up of poly(L-lactic acid), trilaurin and phosphocholine (DOPC) are successfully fabricated. As such, the proposed PDMS micro-devices could potentially serve as versatile encapsulation tools, which are desired for a variety of biological and pharmaceutical applications.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"383 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131762537","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stretchable Yarn of Display Elements 显示元件的可拉伸纱线
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805560
S. Takamatsu, Kiyoshi Matsumoto, I. Shimoyama
{"title":"Stretchable Yarn of Display Elements","authors":"S. Takamatsu, Kiyoshi Matsumoto, I. Shimoyama","doi":"10.1109/MEMSYS.2009.4805560","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805560","url":null,"abstract":"We developed the processing technique to form three-dimensionally coiled yarns of display elements from microfabricated organic displays on flat plastic foils in order to realize stretchable electronics. Three dimensional fabrics like sweaters have been much attention as elastic substrates for stretchable electronic devices, but the deposition and patterning of functional materials on the fabric are incompatible to planar process technique of MEMS. To solve this problem, we propose the fabrication technique where firstly display components are constructed on flat plastic foils and the foils are, then, processed to form them into coiled yarns. In detail of the process, organic electrochromic displays are fabricated on the releasable parylene films above the glass. The foils with displays are cut into yarns with dicing cutters and released from the glass. To make yarns stretchable, the resultant foils are spirally rolled around elastic core fibers, forming helical coiled structure. The stretch ratio of the fabricated yarn is tuned with its pitch angle, ranging from 1 to 2. Finally, we demonstrate the projection of the selected one pixel out of 4 pixels both before and after the yarn is stretched at its ratio of 1.3.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"967 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132593540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
An Electrically-Driven, Large-Deflection, High-Force, Micro Piston Hydraulic Actuator Array for Large-Scale Microfluidic Systems 一种用于大型微流体系统的电驱动、大偏转、高力、微活塞液压执行器阵列
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805424
Hanseup Kim, K. Najafi
{"title":"An Electrically-Driven, Large-Deflection, High-Force, Micro Piston Hydraulic Actuator Array for Large-Scale Microfluidic Systems","authors":"Hanseup Kim, K. Najafi","doi":"10.1109/MEMSYS.2009.4805424","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805424","url":null,"abstract":"This paper describes a proof-of-concept all-electrical individually-addressable micro piston actuator array that produces high displacement and force by utilizing hydraulic amplification and electrostatic control. This new class of actuator arrays can remove a critical hurdle, pneumatic control ports to lab-on-chips, and achieve fully-integrated, large-scale, and all-electrical microfluidic systems. The fabricated actuator consists of a 3×3 array of 2×2mm2 membranes and produces maximum deflections of 35, 23, and 11 ¿m when hydraulicallydriven by piezoelectric actuation at 100, 80, 60V, respectively. The corresponding hydraulic amplification ratios are 3.2, 3, and 2.5, respectively. The array functions up to a frequency of 2Hz without failing, while allowing control over individual actuators by utilizing electrostatic latching at 100V. The active device part measures as 8.4×8.4×0.65mm3.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133343964","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 22
Piezoelectric PZT Thin Films in the 100nm Range: A Solution for Actuators Embedded in Low Voltage Devices 100nm范围的压电PZT薄膜:嵌入在低压器件中的执行器的解决方案
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805458
E. Defay, G. Le Rhun, F. Perruchot, P. Rey, A. Suhm, M. Aid, L.J. Liu, S. Pacheco, M. Miller
{"title":"Piezoelectric PZT Thin Films in the 100nm Range: A Solution for Actuators Embedded in Low Voltage Devices","authors":"E. Defay, G. Le Rhun, F. Perruchot, P. Rey, A. Suhm, M. Aid, L.J. Liu, S. Pacheco, M. Miller","doi":"10.1109/MEMSYS.2009.4805458","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805458","url":null,"abstract":"This paper reports the piezoelectric properties of sputtered and sol gel PZT thin films investigated in a low thickness range (100-250nm). Piezoelectric-elastic bimorphs including very thin PZT films were realized and the maximum reachable deflection at 5V was characterized. The depoling effect experienced by the PZT versus the maximum post process temperature is also discussed which leads to the motivation of developing low thickness range PZT thin films. Elastic-piezoelectric bimorphs were realized and exhibited deflection higher than 5¿m at 5V. Moreover, these bimorphs showed only a 10% decrease of the deflection after 5 billions cycles.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133382390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
Frequency Drift Compensation in Mass-Sensitive Chemical Sensors based on Periodic Stiffness Modulation 基于周期刚度调制的质量敏感化学传感器频率漂移补偿
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805374
K. S. Demirci, Jae Hyeong Seo, S. Truax, L. Beardslee, Y. Luzinova, B. Mizaikoff, O. Brand
{"title":"Frequency Drift Compensation in Mass-Sensitive Chemical Sensors based on Periodic Stiffness Modulation","authors":"K. S. Demirci, Jae Hyeong Seo, S. Truax, L. Beardslee, Y. Luzinova, B. Mizaikoff, O. Brand","doi":"10.1109/MEMSYS.2009.4805374","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805374","url":null,"abstract":"The successful compensation of frequency drift in a mass-sensitive chemical microsensor is demonstrated. The proposed compensation method uses a periodic stiffness modulation, generated by a second feedback loop, to monitor the microresonator's quality factor (Q-factor). The Q-factor is solely obtained from frequency measurements and monitored along with the measurand-induced frequency shift during normal closed-loop sensor operation. This simultaneous measurement of Q-factor and frequency shift enables the compensation of frequency drift induced by environmental disturbances using the extracted Q-factor. The feasibility of drift compensation has been demonstrated by implementing the compensation scheme into a closed-loop chemical sensing system and performing gas-phase chemical measurements.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"115 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133684736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Parylene-Pocket Chip Integration 聚苯乙烯口袋芯片集成
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805491
R. Huang, Y. Tai
{"title":"Parylene-Pocket Chip Integration","authors":"R. Huang, Y. Tai","doi":"10.1109/MEMSYS.2009.4805491","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805491","url":null,"abstract":"In this paper, we present a novel packaging technique that utilizes a simple, flexible parylene (chip) pocket on silicon substrate with metal pads. This pocket can house an IC chip or a discrete component inside and provide electrical connections to it. On the other hand, recent achievement in silicon probes implantation in the parietal cortex enables technological advances in neural prosthesis research. However, most of these technologies suffer from high signal-to-noise ratio and expensive integration scheme with IC chips or lack thereof. As a demonstration, this work uses this technique to produce an 8-shank silicon probe array integrated with a fully functional 16-channel amplifier CMOS chip.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115073708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Thin Film Transistor (TFT) Sensing Elements Fabricated in Surface Micromachined Polymermems for a Differential Calorimetric Flow Sensor 薄膜晶体管(TFT)传感元件在表面微加工聚合物mems制造的差热流量传感器
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805449
S. Tsang, K. Simard, I. Foulds, H. Izadi, K. Karim, M. Parameswaran
{"title":"Thin Film Transistor (TFT) Sensing Elements Fabricated in Surface Micromachined Polymermems for a Differential Calorimetric Flow Sensor","authors":"S. Tsang, K. Simard, I. Foulds, H. Izadi, K. Karim, M. Parameswaran","doi":"10.1109/MEMSYS.2009.4805449","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805449","url":null,"abstract":"This paper presents the first process to allow the embedding of amorphous silicon thin film transistors in surface micromachined polymerMEMS. The presented polymerMEMs fabrication technique embeds hydrogenated amorphous silicon thin film transistors (¿-Si:H TFT) into polyimide for active sensing. An out-of-plane differential calorimetric flow sensor has been fabricated using this method to demonstrate the feasibility of this fabrication process. The calorimetric flow sensor uses the ¿-Si:H TFTs as active sensing elements and has a linear unamplified sensitivity of 2.2mV/(cm/s). This paper provides details for the fabrication process and reports on the design and functional results of calorimetric flow sensor fabricated by embedding ¿-Si:H TFTs into polymerMEMS.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115551935","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Tunable Scanning Fiber Optic MEMS-Probe for Endoscopic Optical Coherence Tomography 用于内窥镜光学相干层析成像的可调谐扫描光纤mems探针
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805555
K. Aljasem, A. Seifert, H. Zappe
{"title":"Tunable Scanning Fiber Optic MEMS-Probe for Endoscopic Optical Coherence Tomography","authors":"K. Aljasem, A. Seifert, H. Zappe","doi":"10.1109/MEMSYS.2009.4805555","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805555","url":null,"abstract":"A novel 3D probe for endoscopic optical coherence tomography (OCT) based on tunable and movable MEMS components is presented. A tunable micro-lens and a 2D scanning micro-mirror are integrated into a probe to enable two-dimensional movement with simultaneous dynamic focusing of a beam onto a target. The tunable system is based on a pneumatically actuated micro-lens for the axial movement of the focus position concomitantly with the depth scan of the OCT, whereas an electrostatically actuated micro-mirror is integrated to obtain the 2D lateral scan of the beam. High resolution imaging at high scan rates is expected for the entire scan depth using this concept. Probe design, assembly, and integration into an OCT system are discussed.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"121 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114522738","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Low-Cost Microfluidic Single-Use Valves and On-Board Reagent Storage using Laser-Printer Technology 使用激光打印机技术的低成本微流体一次性阀和机载试剂存储
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805413
J. Garcia-Cordero, F. Benito‐Lopez, D. Diamond, J. Ducrée, A. Ricco
{"title":"Low-Cost Microfluidic Single-Use Valves and On-Board Reagent Storage using Laser-Printer Technology","authors":"J. Garcia-Cordero, F. Benito‐Lopez, D. Diamond, J. Ducrée, A. Ricco","doi":"10.1109/MEMSYS.2009.4805413","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805413","url":null,"abstract":"We report for the first time the laser-printer-based fabrication of vapor-and pressure-resistant microfluidic single-use valves and their implementation on a centrifugal microfluidic \"lab-on-a-disc platform\". As an extension of this technology, we implemented long-term storage of liquids for up to one month with no signs of evaporation. This simple technology is compatible with a range of polymer microfabrication technologies and should facilitate the design and fabrication of fully integrated and automated lab-on-a-chip cartridges that require pressure-resistant valves or long-term reagent storage.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116586119","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
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