{"title":"全植入式神经微系统的超紧凑集成","authors":"G. E. Perlin, K. Wise","doi":"10.1109/MEMSYS.2009.4805360","DOIUrl":null,"url":null,"abstract":"A new approach to microsystem integration to replace conventional area-consuming platform architectures with an overlay integration cable is presented. A parylene cable carrying interconnect lines is used to integrate a 3-D array of silicon microelectrodes with a custom-designed signal conditioning chip to realize a neural recording microsystem in its most compact form. This low-profile integrated front-end was implanted in a guinea pig and used to obtain discriminable neural activity.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"99 3","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"22","resultStr":"{\"title\":\"Ultra-Compact Integration for Fully-Implantable Neural Microsystems\",\"authors\":\"G. E. Perlin, K. Wise\",\"doi\":\"10.1109/MEMSYS.2009.4805360\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new approach to microsystem integration to replace conventional area-consuming platform architectures with an overlay integration cable is presented. A parylene cable carrying interconnect lines is used to integrate a 3-D array of silicon microelectrodes with a custom-designed signal conditioning chip to realize a neural recording microsystem in its most compact form. This low-profile integrated front-end was implanted in a guinea pig and used to obtain discriminable neural activity.\",\"PeriodicalId\":187850,\"journal\":{\"name\":\"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems\",\"volume\":\"99 3\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-03-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"22\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/MEMSYS.2009.4805360\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MEMSYS.2009.4805360","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Ultra-Compact Integration for Fully-Implantable Neural Microsystems
A new approach to microsystem integration to replace conventional area-consuming platform architectures with an overlay integration cable is presented. A parylene cable carrying interconnect lines is used to integrate a 3-D array of silicon microelectrodes with a custom-designed signal conditioning chip to realize a neural recording microsystem in its most compact form. This low-profile integrated front-end was implanted in a guinea pig and used to obtain discriminable neural activity.
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