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2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems最新文献

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Thermal Analysis and Characterization of a High Q Film Bulk Acoustic Resonator (FBAR) as Biosensers in Liquids 液体中用作生物传感器的高Q薄膜体声谐振器(FBAR)的热分析与表征
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805539
Xu Zhang, Wencheng Xu, A. Abbaspour-Tamijani, J. Chae
{"title":"Thermal Analysis and Characterization of a High Q Film Bulk Acoustic Resonator (FBAR) as Biosensers in Liquids","authors":"Xu Zhang, Wencheng Xu, A. Abbaspour-Tamijani, J. Chae","doi":"10.1109/MEMSYS.2009.4805539","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805539","url":null,"abstract":"This paper presents the thermal analysis and characterization of a zinc oxide (ZnO) based film bulk acoustic resonator (FBAR) having a high quality factor (Q) in liquid environments for biosensing applications. Q of up to 120, an improvement of at least 8× greater than state-of-the-art devices in liquids, are achieved by integrating microfluidic channels with heights comparable to the acoustic wavelength in FBAR. In order to achieve temperature stability in the highly sensitive FBAR sensor, we analyze sources of thermal effects and characterize FBAR in a Pierce oscillator. Measurements show a temperature coefficient of oscillation frequency (TCF) of -112 ppm/K for the uncompensated circuit. We show that this thermal drift can be reduced to less than 1ppm/K by applying a properly chosen bias to the oscillator, which suggests the possibility of a feedback approach to achieve thermal stability.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"149 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133549409","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
High Sensitivity Micro-Thermal Conductivity Detector for Gas Chromatography 气相色谱高灵敏度微热导检测器
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805369
B. Kaanta, H. Chen, G. Lambertus, W. Steinecker, O. Zhdaneev, X. Zhang
{"title":"High Sensitivity Micro-Thermal Conductivity Detector for Gas Chromatography","authors":"B. Kaanta, H. Chen, G. Lambertus, W. Steinecker, O. Zhdaneev, X. Zhang","doi":"10.1109/MEMSYS.2009.4805369","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805369","url":null,"abstract":"Design, fabrication and testing of a micro thermal conductivity detector (¿TCD) with a detection limit of 260 parts per billion (hexane in helium), no excess dead-volume, low power consumption, fast response time (150 ¿sec) and low sensitivity to flow rate is described herein. Significantly, this ¿TCD is shown to have a linear response and high sensitivity across a 104-fold concentration range; to the best of our knowledge this linearity and sensitivity has not been previously shown for a¿TCD. The thermal conduction properties of several configurations are examined to identify their influence on performance.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116131881","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 44
Micro Coriolis Mass Flow Sensor with Integrated Capacitive Readout 集成电容读出的微型科氏质量流量传感器
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805419
J. Haneveld, T. Lammerink, M. D. de Boer, R. Wiegerink
{"title":"Micro Coriolis Mass Flow Sensor with Integrated Capacitive Readout","authors":"J. Haneveld, T. Lammerink, M. D. de Boer, R. Wiegerink","doi":"10.1109/MEMSYS.2009.4805419","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805419","url":null,"abstract":"We have realized a micromachined micro Coriolis mass flow sensor with integrated capacitive readout to detect the extremely small Coriolis vibration of the sensor tube. A special comb-like detection electrode design eliminates the need for multiple metal layers and sacrificial layer etching methods. Using differential readout signals significantly reduces the influence of parasitic capacitances. In addition, the sensing electrodes have been realized on a suspended tube structure which will allow for tuning of the electrode separation by a DC current. First measurements using water, ethanol and white gas indicate that true mass flow is measured by the sensor and that sensor output is linear with mass flow. The measurement error is currently in the order of 2% of the full scale of 1.2 ml/hr for all measured liquids (which corresponds to 1.2 g/hr in the case of water).","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"152 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125895363","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 29
Fabrication of Near Net Shape Alumina Nickel Composite Micro Parts using Aqueous Suspension 水悬浮液制备近净形氧化铝镍复合材料微零件
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805484
H. Hassanin, K. Jiang
{"title":"Fabrication of Near Net Shape Alumina Nickel Composite Micro Parts using Aqueous Suspension","authors":"H. Hassanin, K. Jiang","doi":"10.1109/MEMSYS.2009.4805484","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805484","url":null,"abstract":"Ultra thick alumina-nickel composite micro parts were successfully fabricated using a combination of micromoulding soft lithography and colloidal powder processing of Al2O3-Ni suspension. The softlithographic method involves a deep UV lithography of SU-8, followed by the replication of Polydimethylsiloxane (PDMS), shaping the green by filling PDMS moulds with the composite paste. Next, drying, demoulding and finally sintering using TiO2 as a sintering aid. The rheological properties have been characterized for the preparation of dispersed slurry. The optimal parameters have been achieved at pH=2; concentration of dispersant= 0.004 g/ml; solid loading= 65 wt%. After sintering, dense and free standing Al2O3-Ni composite micro parts have been achieved. Well dispersed nickel particles are found in the composite components. This approach provides a useful way to produce MEMS ceramic composites with tuneable properties by changing the amount of nickel in the matrix.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126095906","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Development of Skewed Drie Process and its Application to Electrostatic Tilt Mirror 倾斜传动工艺的发展及其在静电倾斜镜上的应用
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805576
M. Nakada, K. Takahashi, T. Takahashi, A. Higo, H. Fujita, H. Toshiyoshi
{"title":"Development of Skewed Drie Process and its Application to Electrostatic Tilt Mirror","authors":"M. Nakada, K. Takahashi, T. Takahashi, A. Higo, H. Fujita, H. Toshiyoshi","doi":"10.1109/MEMSYS.2009.4805576","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805576","url":null,"abstract":"We present a newly developed skewed-DRIE (deep reactive ion etch) process through a silicon wafer. Maximum skew angle of 25 degrees with respect to the wafer surface was obtained with a 360 micron thick silicon substrate. This technique was used to build the slanted counter electrode of 60 degrees for an electrostatic torsion mirror. Pull-in voltage was 100 volts, which was lower than that of a vertically etched counter electrode.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123485745","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Development of Multi-User Multi-Chip SOI CMOS-MEMS Processes 多用户多芯片SOI CMOS-MEMS工艺的开发
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805479
K. Takahashi, M. Mita, M. Nakada, D. Yamane, A. Higo, H. Fujita, H. Toshiyoshi
{"title":"Development of Multi-User Multi-Chip SOI CMOS-MEMS Processes","authors":"K. Takahashi, M. Mita, M. Nakada, D. Yamane, A. Higo, H. Fujita, H. Toshiyoshi","doi":"10.1109/MEMSYS.2009.4805479","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805479","url":null,"abstract":"This paper presents a new method of integrating multiple MEMS designs with 40V class CMOS driver circuits in a multi-user-multi-chip manner. The multi-chip multi-user CMOS-MEMS process was done at 35 mm × 35 mm SOI chip. More than six different designs of SOI-bulk micromachined actuators including the pitch-tunable gratings were monolithically integrated onto the pre-fabricated high-voltage level-shifter circuits. We measured electro mechanical characteristics of the grating light valve integrated with high-voltage level-shifter and successfully demonstrated 1MHz operation.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129144272","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Integration of Skeletal Muscle Cell onto Si-MEMS and its Generative Force Measurement 骨骼肌细胞在Si-MEMS上的集成及其生成力测量
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805404
K. Shimizu, H. Sasaki, H. Hida, H. Fujita, K. Obinata, M. Shikida, E. Nagamori
{"title":"Integration of Skeletal Muscle Cell onto Si-MEMS and its Generative Force Measurement","authors":"K. Shimizu, H. Sasaki, H. Hida, H. Fujita, K. Obinata, M. Shikida, E. Nagamori","doi":"10.1109/MEMSYS.2009.4805404","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805404","url":null,"abstract":"We propose skeletal muscle cells as a new material for Bio-MEMS actuator, and developed the fabrication process to integrate it onto Si-MEMS devices. As the first trial of the integration of the skeletal muscle cells onto the Si-MEMS device, we used a cantilever-based force measurement Si-MEMS device for evaluating the generative force of the muscle cells. Murine skeletal muscle cell line C2C12 myoblasts were patterned on the device by using poly-N-isopropylacrylamide as a sacrificed layer. The cell-patterned device was immersed into the cell culture medium and cultivated for 7 days. The results of the immunological staining of the muscle specific protein, ¿-actinin, confirmed that the patterned myoblasts successfully differentitated into myotubes on the device. Then, we applied the electrical stimulation to the myotubes, evaluated the active tension generated from the myotubes, and revealed that its tetanic value was approximately 1.2 ¿N.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"52 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129166314","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Robust Wafer-Level Thin-Film Encapsulation of Microstructures using Low Stress PECVD Silicon Carbide 利用低应力PECVD碳化硅实现微结构的晶圆级薄膜封装
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805338
V. Rajaraman, L. Pakula, H. Pham, P. Sarro, P. French
{"title":"Robust Wafer-Level Thin-Film Encapsulation of Microstructures using Low Stress PECVD Silicon Carbide","authors":"V. Rajaraman, L. Pakula, H. Pham, P. Sarro, P. French","doi":"10.1109/MEMSYS.2009.4805338","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805338","url":null,"abstract":"This paper presents a new low-cost, CMOS-compatible and robust wafer-level encapsulation technique developed using a stress-optimised PECVD SiC as the capping and sealing material, imparting harsh environment capability. This technique has been applied for the fabrication and encapsulation of a wide variety of surface- and thin-SOI microstructures that included microcavities, RF switches and various accelerometers. Advantages of our technique are its versatility, smaller footprint, reduced chip thickness and process complexity, post-CMOS batch processing capability and added functionality due to the possibility of integrating additional electrodes for MEMS. Besides fabrication details, this work also discusses related design aspects for large-area MEMS and demonstrates the encapsulation results. Successfully encapsulation of device geometries as large as 955×827¿m2 has been achieved.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130500595","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
Biosensor based on All-Polymer Resonant Microbeams 基于全聚合物谐振微光束的生物传感器
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805378
S. Schmid, P. Wagli, C. Hierold
{"title":"Biosensor based on All-Polymer Resonant Microbeams","authors":"S. Schmid, P. Wagli, C. Hierold","doi":"10.1109/MEMSYS.2009.4805378","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805378","url":null,"abstract":"We present all-polymer resonant microbeams which can detect the adsorption of streptavidin and DNA on the surface in aqueous solution with a high selectivity. The polymer surface allows the direct functionalization with the receptor biomolecules without intermediate Au-layer. The highly sensitive resonant microbeams offer a low-cost system for disposable and label-free biosensing applications. Minimal analyte (streptavidin) concentrations of 0.025¿g/ml were detected causing an oscillation frequency shift of 1.9%. 0.13 nmol/ml of 17-mer single-stranded DNA could be selectively detected causing a frequency change of 0.9%.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126441019","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 6
Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding 真空晶圆级封装二维光学扫描仪阳极键合
2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems Pub Date : 2009-03-27 DOI: 10.1109/MEMSYS.2009.4805544
H. Tachibana, K. Kawano, H. Ueda, H. Noge
{"title":"Vacuum Wafer Level Packaged Two-Dimensional Optical Scanner by Anodic Bonding","authors":"H. Tachibana, K. Kawano, H. Ueda, H. Noge","doi":"10.1109/MEMSYS.2009.4805544","DOIUrl":"https://doi.org/10.1109/MEMSYS.2009.4805544","url":null,"abstract":"Vacuum wafer-level packaged two-dimensional optical scanners actuated by vertical electrostatic combs have been developed. A 1 mm-diameter gimbal mirror with high frequency deflection and a surrounding 2.5 × 3 mm movable frame with low frequency deflection are fabricated in a SOI wafer. Wafer-level packaging with anodically bonded borosilicate glass substrates on both sides together with non-evaporable getters fixed on the lower glass substrate allows hermetic sealing in high vacuum. The gimbal mirror and the movable frame are both deflected mechanically ± 12 deg. at a resonant frequency of 25.1 kHz with a driving voltage of 18 V, and at a resonant frequency of 78.6 Hz with a driving voltage of 10 V, respectively. The internal pressure of the device is 20 Pa.","PeriodicalId":187850,"journal":{"name":"2009 IEEE 22nd International Conference on Micro Electro Mechanical Systems","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2009-03-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121554792","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 27
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