2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)最新文献_第2页

The influence of filler particle shapes on adhesive joints in microwave applications 微波应用中填料颗粒形状对粘接接头的影响

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020174

J. Felba, K. Friedel, B. Guenther, A. Moscicki, H. Schafer

{"title":"The influence of filler particle shapes on adhesive joints in microwave applications","authors":"J. Felba, K. Friedel, B. Guenther, A. Moscicki, H. Schafer","doi":"10.1109/POLYTR.2002.1020174","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020174","url":null,"abstract":"Electrical conduction of adhesive joint is provided by the metal content. High conductivity requires high metallic content. Isotropic electrically conductive adhesives are usually manufactured with filler concentration sufficiently greater than percolation threshold to guarantee low resistance with allowance for manufacturing tolerances. But we have found that it is not sufficient in a case of microwave applications. In this work we have measured the quality factor of resonant circuit at the frequency of 3.5 GHz, which was made as stripline circuit including the measured joints. Adhesives were formulated on the base of two kinds of resin with four type of silver filler. Filler materials differ from each other as regards the shape of particles and their dimensions. It was stated that kind of silver filler, the interaction of filler/type of resin as well as the state of the surface of adhesive layer plays important role in the case of solder replacement with electrically conductive adhesives in microwave electronics.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114401295","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive 热方面的GaAs功率场效应晶体管连接使用各向同性导电胶

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020180

M. Mayer, J. Nicolics, G. Hanreich, M. Mundlein

{"title":"Thermal aspects of GaAs power FET attachment using isotropically conductive adhesive","authors":"M. Mayer, J. Nicolics, G. Hanreich, M. Mundlein","doi":"10.1109/POLYTR.2002.1020180","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020180","url":null,"abstract":"GaAs power transistors are preferred to Si transistors for wireless communication due to their superior high frequency performance. However, the lower thermal conductivity of GaAs (44 W/mK compared to 150 W/mK of Si at 300 K) requires a careful thermal design. For optimizing radio frequency (RF) performance and device reliability GaAs power transistors need the development of advanced large signal models taking into account the dependencies of electrical characteristics from the local temperature distribution within the gate and the heterojunction structure. However, the temperature distribution within the chip (die) is significantly influenced by the packaging and die attach technique. In our case an isotropically conductive adhesive ICA with a silver content of more than 90 percent (cured) was used for mounting the chip. In this paper the influence of bonding failures and thermal qualities of the ICA bonding layer on the temperature distribution in the gate structure of a GaAs heterojunction power transistor is investigated For this purpose a thermal simulation tool developed at our institute (TRESCOM II) is applied For proving the validity of the simulation some results are compared with those established experimentally at distinct measuring points. We found that in spite of using an adhesive with a high thermal conductivity, its value has a significant impact on the peak temperatures but is not known well enough. In order to obtain a good agreement in this comparison and to increase the reliability of the simulated results, the thermal conductivity of the ICA was experimentally determined using a carbon dioxide laser. The experimental procedure and the results of this measurement are also described.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"64 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133232296","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

The effects of temperature and humidity aging on the contact resistance of novel electrically conductive adhesives 温度和湿度老化对新型导电胶粘剂接触电阻的影响

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020219

G. van Wuytswinkel, G. Dreezen, G. Luyckx

{"title":"The effects of temperature and humidity aging on the contact resistance of novel electrically conductive adhesives","authors":"G. van Wuytswinkel, G. Dreezen, G. Luyckx","doi":"10.1109/POLYTR.2002.1020219","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020219","url":null,"abstract":"Conductive Surface Mount Adhesives (CSMAs) are an alternative to traditional solders used in the electronics industry. CSMAs provide an environmentally friendly alternative to conventional Sn/Pb metal solders offering additional attractive technical advantages including low temperature processing, fine pitch capability and better resistance to thermal cycling. The two major limitations of CSMAs have been their instability on common electronic metals such as copper and Sn/Pb solder and their performance under impact testing. Recent experimental work published by National Starch Corporate Research in collaboration with Georgia Institute of Technology has shown that the unstable contact resistance of CSMAs on copper and solder is due to electrochemical corrosion of these metals under adverse conditions. Based on the above fundamental understandings, Emerson & Cuming have been developing some new and unique formulas which exhibit exceptional contact resistance stability on previously unstable metal surfaces including OSP copper, Sn/Pb alloys and even 100 percent tin. Much progress has also been made in the area of mechanical performance. Recent advances in contact resistance stability have been incorporated along with the advances in impact performance to create novel materials. This paper examines the effects of thermoshock testing, high temperature aging and humidity aging on the contact resistance and the adhesion of these new formulas.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116996395","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

Performance analysis of polymer based antenna-coils for RFID 射频识别用聚合物天线线圈的性能分析

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020194

S. Cichos, J. Haberland, H. Reichl

{"title":"Performance analysis of polymer based antenna-coils for RFID","authors":"S. Cichos, J. Haberland, H. Reichl","doi":"10.1109/POLYTR.2002.1020194","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020194","url":null,"abstract":"Transponder-labels, -tags or -modules of inductively coupled RFID (Radio Frequency Identification)-systems commonly consist of a substrate with an appropriate transponder-chip or transponder-module mounted on top. The antenna coil is structured on this substrate, usually made of PET, PVC or polyimide and usually consists of a wound wire or etched copper or aluminium structures. As a low cost alternative, conductive polymeric thick film pastes can be used for the production of antenna coils for inductively coupled transponders. These pastes are applied by screen printing or dispensing. In mass production the consequence is a reduction of material costs and processing time. Most popular fillers of the conductive polymer pastes are silver flakes which get connected during the curing process. The conductivities of these compounds are lower in comparison with copper or aluminium. Therefore, the transponder coils made of conductive polymer pastes have substantially higher ohmic losses which influence the functionality of RFID transponders. In this paper, the minimum operating magnetic field strength and powering range of the transponder is considered in detail. A selected reference design with the size of a smart card inlay (47 /spl times/ 74 mm/sup 2/) is used.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121089822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 63

Thick film coating materials and fast conformal coating processes - a contradiction? 厚膜涂层材料与快速保形涂层工艺——矛盾?

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020203

M. Suppa, C. Schauer

{"title":"Thick film coating materials and fast conformal coating processes - a contradiction?","authors":"M. Suppa, C. Schauer","doi":"10.1109/POLYTR.2002.1020203","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020203","url":null,"abstract":"Conformal coatings are of strongly growing importance to the manufacturers of electronics. Users have realised that the reliability and life span of electronic products can be considerably improved and increased by applying these speciality coatings. However, the processing can be troublesome and a number of these products have strong limitations with respect to their application under severe climatic conditions, especially in thick film applications. This paper discusses the following questions: What are the main product \"families\" available in the field of conformal coatings, what are their advantages and disadvantages, where are their limitations? What are the fields of application for thick film coatings? To what degree can conventional conformal coatings be used for thick film applications ranging from approx. 200 to 2000 /spl mu/m, what are the alternatives, how are these products processed and what equipment is needed? What experiences have been gathered with newly formulated thick film conformal coatings combining UV cure functionality (enabling instant handling and offering immediate protection) and a subsequent cure with ambient moisture to achieve maximum insulation and protective properties? How do these systems work, what are their capabilities and properties regarding chemical and mechanical resistance as well as their dielectrical performance and how do they behave underneath components compared to conventional conformal coatings (e.g. encapsulation of residual solvents and the \"shadowing phenomenon\" with UV-curable products as well as capillary effects)? How are these \"dual cure\" or \"twin cure\" conformal coatings processed As a comparison, problem-oriented solutions with new solvent-free silicone coatings applied as thick film coatings are introduced and discussed additionally. The technologically special position of silicones is briefly presented and elucidated.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115524678","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 5

New triazine containing polymers for use in integrated optics 集成光学用新型含三嗪聚合物

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020196

C. Dreyer, J. Schneider, M. Bauer, N. Keil, H. Yao, C. Zawadzki

{"title":"New triazine containing polymers for use in integrated optics","authors":"C. Dreyer, J. Schneider, M. Bauer, N. Keil, H. Yao, C. Zawadzki","doi":"10.1109/POLYTR.2002.1020196","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020196","url":null,"abstract":"The amount of data transferred via the internet redoubles every eight month, this results in a strong increasing demand on bandwidth. Today glass fiber is the medium of choice for long range transmission, but for an optical network a lot of devices, such as multiplexer, splitter, attenuators etc. are needed. Typically such waveguide-based devices are produced by using silica, but in contrast to the inorganic waveguides polymers provide a lot of advantages, such as lower production costs, temperature insensitive devices and switches with low switching power. Developed in the late sixties as base materials for printed circuit boards polycyanurate ester resins are a relatively new class of polymers. They have a high thermostability and amazing mechanical properties. Our past work was focussed on highly fluorinated polycyanurate systems for use as waveguide materials in integrated optics. Low optical losses of less than 0.3 dB/cm @ 1550 nm were obtained and working optical prototypes were developed also. Our actual work is focused on related polymeric systems, which should remedy some disadvantages of the neat polycyanurates. Because of its outstanding thermomechanical properties and its excellent polishing ability, we extended the use of triazine-containing polymers as substrate materials for optical waveguiding devices. This paper is focused on the development of alternate triazine-containing polymeric substrates, the production of athermal integrated optical devices and the adjustment of the substrate-properties. For these specific devices polyacrylate systems are used as waveguiding materials.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"256 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131697752","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Conductive adhesive fillets for double sided PCBs 双面pcb的导电胶粘片

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020176

R. Kisiel, A. Markowski, Marcin Lubiak

引用次数: 6

In-situ moire measurement of adhesive flip-chip bonded assembly under thermal cycling condition 热循环条件下胶粘剂倒装片粘接组件的原位云纹测量

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020184

S. Ham, W. Kwon, K. Paik, Soon-Bok Lee

{"title":"In-situ moire measurement of adhesive flip-chip bonded assembly under thermal cycling condition","authors":"S. Ham, W. Kwon, K. Paik, Soon-Bok Lee","doi":"10.1109/POLYTR.2002.1020184","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020184","url":null,"abstract":"The use of flip-chip technology has many advantages over other approaches for high-density electronic packaging. Adhesive flip-chip bonding using ACFs (anisotropic conductive films) or ACPs (anisotropic conductive pastes) is one of the major flip-chip technologies, which has short chip-to-substrate interconnection length, high productivity, and miniaturization of package. Therefore, many researchers and makers are interested in this adhesive flip-chip bonding scheme. In addition, the understanding of thermal deformation has been recognized as the key for a reliable design of adhesive flip-chip bonding assembly. In this study, thermal deformations of adhesive bonded flip-chip-on-board package during thermal cycling were investigated using in-situ high sensitivity moire interferometry. For temperature cycling, a small-sized thermal chamber having an optical window was used with Portable Engineering Moire Interferometer. The warpage of the silicon chip were measured during two thermal cycles between 25/spl deg/C and 125/spl deg/C. When the temperature of the assembly was increased to higher than the glass transition temperature (T/sub g/), the warpage of the chip is fully diminished and the warpage was characterized by the T/sub g/ regardless of previous temperature history. From the test results, it was shown that the in-situ moire interferometry scheme is effective and powerful tool to characterize the thermal deformation of microelectronics assembly using adhesive.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125785859","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Quantitative analysis of resistance of printed resistors 印刷电阻电阻的定量分析

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020213

P. L. Cheng, T. W. Law, Chenmin Liu, I. Chong, D. Lam

{"title":"Quantitative analysis of resistance of printed resistors","authors":"P. L. Cheng, T. W. Law, Chenmin Liu, I. Chong, D. Lam","doi":"10.1109/POLYTR.2002.1020213","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020213","url":null,"abstract":"Surface-mounted resistors on an electronic circuit board are inexpensive and accurate, but resistors embedded in circuit boards can attain the same accuracy only after costly post-deposition trimming. Improved low cost methodologies of resistor fabrication are needed for cost effective embedding of resistors into polymeric substrates. Polymer Thick Film Resistors (PTFRs) are low temperature processable, low cost resistors with a wide resistivity range. The electrical resistance variation of these resistors is approximately /spl plusmn/10% after deposition and additional trimming procedure to tune the resistances to meet specifications. This adds to the cost and complicates the fabrication process when the resistors are embedded. In this study, the influences of PTFRs geometries on the resistance tolerances were investigated. Results indicated that the accuracy of stencil printed resistors was markedly higher than the screen-printed resistors. The screen-printed resistor edge geometries were observed to be rough. FEM analyses revealed that the resistance tolerances were associated with edge roughness. Remedies to the variations were proposed and the relationship between resistance tolerances and aperture orientations was also outlined.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128251655","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Organic thin film transistors with printed gate electrodes 带有印刷栅电极的有机薄膜晶体管

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020209

U. Zschieschang, H. Klauk, M. Halik, G. Schmid, W. Radlik, W. Weber

引用次数: 6