2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)最新文献

{"title":"Double-layer no-flow underfill materials and process","authors":"Zhuqing Zhang, C. Wong","doi":"10.1109/POLYTR.2002.1020188","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020188","url":null,"abstract":"No-flow underfill has been invented and practiced in the industry for a few years. However, due to the interfering of silica fillers with solder joint formation, most no-flow underfills are not filled with silica fillers and hence have a high coefficient of thermal expansion (CTE), which is undesirable for high reliability. In a novel invention, a double-layer no-flow underfill is implemented to the flip-chip process and allows fillers to be incorporated into the no-flow underfill. The effects of bottom layer underfill thickness, bottom layer underfill viscosity, and reflow profile on the solder wetting properties are investigated in a design of experiment (DOE) using quartz chips. It is found that the thickness and viscosity of the bottom layer underfill are essential to the wetting of the solder bumps. CSP components are assembled using the double-layer no-flow underfill process. Silica fillers of different sizes and weight percentages are incorporated into the upper layer underfill. With high viscosity bottom layer underfill, up to 40 wt% fillers can be added into the upper layer underfill and do not interfere with solder joint formation.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117071652","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Reliability of adhesive joints in dual interface smart cards","authors":"M. Holmberg, J. Lenkkeri, M. Lahti, B. Wiik","doi":"10.1109/POLYTR.2002.1020182","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020182","url":null,"abstract":"In dual interface smart cards the adhesive joints between the micro module and card body are critical points for the reliability. There are many issues, which affect the reliability of the joints. The choice of the electrically conductive adhesive is one of the key aspects. In this study three different anisotropically conductive adhesive films and one isotropically conductive adhesive paste has been tested by several methods including e.g. bending, torsion, thermal and humidity tests. The Matlab model has been developed for studying the factors influencing the reliability of adhesive joints in smart cards for thermal cycling and cyclic bending type deformations. Assuming viscoelastic behaviour for the adhesive material and Coffin Manson type failure criterium for the joints the model is able to give information about the effects of different parameters on the durability of the adhesive joints. The experiments carried out show that there are very large differences in reliability between different types of adhesives. For anisotropically conductive adhesives the type of connection pads in the card body is also very important. The connections made with isotropically conductive adhesive are very resistant for bending deformations of the card.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129861063","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Colour spectrum measurement of polyaniline film","authors":"G. Ballun","doi":"10.1109/POLYTR.2002.1020198","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020198","url":null,"abstract":"The electrochromic changes of the polyaniline films during the switching from reduced to fully oxidated forms have been studied by the in situ measurement of the colour spectrum. Two-beam spectrometer is used during the protonation-deprotonation processes in electrochemical cell designed for this measurement. Colour transmission of different grade of polyaniline film layers changes were observed in different electrolyte solutions, temperature and applied voltage (e.g. redox state).","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124745497","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Polytronics for biotronics: unique possibilities of polymers in biosensors and bioMEMS ?","authors":"G. Harsányi, H. Santha","doi":"10.1109/POLYTR.2002.1020215","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020215","url":null,"abstract":"In recent years, sensing polymeric materials have gained a wide theoretical interest and practical application in biomedicine both in sensors and in bio-MEMS. They can be used for very different purposes and may offer unique possibilities. The paper give a broad summary of the polymer films used in these type applications. Polymers offer a lot of advantages for medical and biosensor technologies: they are relatively low cost materials, their fabrication techniques are quite simple, they can be deposited on various types of substrates using methods compatible with all microelectronic and micro fabrication technologies, as well as the wide choice of their molecular structure and the possibility to build in side chains, charged or neutral particles or even grains of specific behavior into the bulk material or on its surface region enables producing films with various physical and chemical properties including also sensing behavior.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130062051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"All-polymer field effect transistors","authors":"M. Schrodner, S. Sensfuss, H. Roth, R.-I. Stohn, W. Clemens, A. Bernds","doi":"10.1109/POLYTR.2002.1020208","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020208","url":null,"abstract":"Polymer field effect transistors (PFETs) were made from polymeric semiconductors, insulators and electrodes on flexible polymeric substrates. The authors present recent results of all-polymer FETs with conjugated polymers like poly(3-alkylthiophenes) as active semiconducting material. Highly resolved electrodes were patterned by lithography of conducting polymers. The on/off ratios exceed 1000 by far. The logic capability of the PFETs could be demonstrated by the realisation of inverters.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114019126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Development of fine pitch (54 /spl mu/m) flip chip on flex interconnection process","authors":"J. Maattanen, P. Palm, Y. de Maquille, N. Bauduin","doi":"10.1109/POLYTR.2002.1020201","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020201","url":null,"abstract":"Lighter, smaller, faster and cheaper are the magic words used to describe the trends in modern electronics. The miniaturization is a must in the market of the portable devices. Beside of the mobile phones there are several other application areas like smart cards, smart cloths, portable minicomputers, cameras, entertainment electronics and so on. The big challenge is to find the most effective technology to produce all those devices with competitive prices. The key factor is the interconnection technology. The environmental factors like lead and halogen free production are other challenges that must be taken into account This paper presents the development of fine pitch (54 /spl mu/m) flip chip on flex (FCOF) interconnection. There are several factors affecting to the reliability of the high density interconnection like the flex material, the bumping of the test chips, the bonding equipment and the anisotropically conductive adhesive used to make the connection. During the development phase it was noticed that by a careful testing and by making right selections it is possible to find working combination of materials and processes for high density interconnection. To insure the reliability, the samples were tested using thermal shock tests (-40C/spl rlhar2/+125C) and 85C/85R.H. humidity test. Cross section samples were made to analyze the possible failure mechanism of failed contacts. Two different types of test devices were used. The contact resistance was measured with four-point method and the series resistance with Daisy chain method. The results area part of development project supported by European Union.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"22 Suppl 1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127007023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Encapsulant characterization - valuable tools for process setup and failure analysis","authors":"K. Becker, T. Braun, M. Koch, D. Vogel, R. Aschenbrenner, H. Reichl, Hans-Werner Hagedorn, J. Neumann-Rodekirch","doi":"10.1109/POLYTR.2002.1020190","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020190","url":null,"abstract":"The selection of the optimum material for an encapsulation application can be a challenging task, as typically the datasheets do only provide general information, e.g. CTE below glass transition temperature or Young's modulus at room temperature. The reason is that a full material characterization is rather sumptuous, due to the wide variety of material parameters possibly relevant. There are parameters for process setup and evaluation as rheological behavior and reaction behavior and there are application specific parameters as e.g. thermal conductivity, degradation temperature or media resistance. Therefore the determination and definition of relevant methods and parameters are important as results must be comparable. This is especially true as sample preparation and testing is time and cost intensive. Within the BMBF-sponsored project PUMA, a test schedule was set up to fully characterize various underfill encapsulants and to check relevance of material parameters for process development and package reliability. In summary this paper proposes test methods suited for encapsulant characterization, so material measuring techniques can be homogenized, results are comparable and material selection is facilitated.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"69 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127749767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Challenge of vacuum molded flip chip packaging technology","authors":"K. Chai, E. Wu, J. Tong","doi":"10.1109/POLYTR.2002.1020218","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020218","url":null,"abstract":"To be the solution of higher throughput, uniform outline and level up reliability performance of mature capillary underfill packaging, molded underfill technology is studied by assembly houses, equipment vendors and material manufactures for years and is expected to be the major assembly method of flip chip package in the future. Vacuum molding flip chip packaging technology is one developed by lots of molding equipment vendors from various molded underfill theories, and the key issues are the uncompleted fill under the die and the flush at vacuum position(s). Finer filler (less than 10 /spl mu/m particle size) compound is used for the small gap between chip and substrate & the clearance of flip chip bumps, but we still need to ensure that there is no air be trapped under the die during molding process. Vacuum parameter and position are also very important to avoid the uncompleted fill and material flush from air vent areas. Siliconware is now developing such technology as an alternative solution of capillary underfill flip chip packaging. The test vehicle and vacuum processing technology development by tuning the parameters and modifying the mold chase design will be simply introduced here, and the reliability test is going to confirm the package performance.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"176 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116130365","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Behaviour of electroconductive polyaniline films used in highly sensitive ammonia sensors","authors":"F. Hajdú","doi":"10.1109/POLYTR.2002.1020217","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020217","url":null,"abstract":"Electroconductive polymer based gas sensors have been investigated focusing on the resistance changes when exposing them to an ammonia atmosphere. At first, the resistance increase of these devices in air after manufacturing then, the changes in resistance after exposing them to ammonia of different concentration were examined. These phenomena and also the curing method of the polymer film prepared by electrochemical polymerisation are described and examined here. The main topic of this paper is what kind of problems we must face during signal processing of the responses given by this type of device when designing an accurate concentration measuring system.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127186167","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Effects of moisture and temperature ageing on reliability of interfacial adhesion with black copper oxide surface","authors":"M. Lebbai, O. Lam, Jang‐Kyo Kim","doi":"10.1109/POLYTR.2002.1020183","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020183","url":null,"abstract":"This paper reports the recent studies on adhesion performance of copper alloy substrate with bare surface, black oxide coating and black oxide with debleeding treatment. The interfacial adhesion of substrate with polyimide tape and glob top resin were measured after autoclave test (or pressure cooker test, PCT), temperature ageing and thermal cycles based on the button shear and tape peel tests. The failure mechanisms were studied from the fracture surface analysis. Moisture absorption and desorption studies at different aging time were carried out to understand the property changes due to moisture. The results show that the black oxide coating improved significantly the interfacial bond strength in the dry condition. The mechanical interlocking mechanism provided by the fibrillar copper oxide was mainly responsible for it. The interfacial bond strengths for all substrates remained almost unchanged after thermal ageing at 150/spl deg/C for 8 h. Thermal cycles between -50/spl deg/C and 150/spl deg/C for 500 and 1000 thermal cycles exhibited generally a negligible influence or decreased slightly the interfacial adhesion. The hygrothermal ageing at 121/spl deg/C/100% RH in an autoclave (i.e. PCT) resulted in large reductions in interfacial bond strength after the initial 48 h ageing and tended to level off with further ageing. Fracture analysis of tape peeled bare copper substrates after 500 cycles of thermal loading revealed a transition of failure mechanism from adhesive to cohesive failure. In contrast, the failure mechanism remained unchanged for oxide-coated substrates. The implications arising from the button shear and tape peel tests are different because of the different fracture modes involved. According to the available data discussed above, the PCT is regarded as the most severe test affecting the adhesion performance. Presence of oxide coating minimized the moisture absorption rate when compared to the bare copper surface.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"388 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130012757","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}