2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)最新文献

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Using of solderable conductive pastes in PCB prototyping 可焊导电浆料在PCB成型中的应用

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020177

A. Marín, P. Svasta, C. Ionescu, N. Codreanu

引用次数: 0

Accelerated life testing in microelectronics and photonics, its role, attributes, challenges, pitfalls, and its interaction with qualification tests 微电子和光子学中的加速寿命测试，它的作用，属性，挑战，陷阱，以及它与资格测试的相互作用

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-06-07 DOI: 10.1117/12.469620

E. Suhir

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引用次数: 72

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) 第二届国际IEEE微电子和光子学聚合物和粘合剂会议。POLYTRONIC 2002。会议记录(Cat.)No.02EX599)

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 1900-01-01 DOI: 10.1109/POLYTR.2002.1020173

{"title":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","authors":"","doi":"10.1109/POLYTR.2002.1020173","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020173","url":null,"abstract":"The following topics are dealt with: adhesive joints in microwave applications; electrical conductivity of anisotropic chemical adhesives; conductive adhesive fillets for double sided PCBs; solderable conductive pastes; application of adhesives in MEMS, and MOEMS assembly; isotropically conductive adhesives; reliability; epoxy resins for UV laser cure; double-layer no-flow underfill materials and process; encapsulant characterization tools for process setup and failure analysis; low temperature processable core material for embedded inductor; triazine containing polymers for use in integrated optics; fine pitch flip chip on flex interconnection process; stackable package using chip in polymer technology; high volume printing technologies; lamination technique for electronic packaging; laser processing of flexible substrates; all-polymer field effect transistors and organic thin film transistors; ultra-high dielectric constant polymer based composite; and vacuum molded flip chip packaging technology.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"57 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116666464","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

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