2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)最新文献_第4页

Manufacturing and reliability of flexible integrated module boards 柔性集成模块板的制造与可靠性

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020186

T. Waris, R. Saha, J. Kivilahti

引用次数: 6

Laser processing of flexible substrates 柔性基板的激光加工

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020207

P. Gordon, R. Berényi, Z. Nyitrai

引用次数: 5

Applicability of coating techniques for the production of organic field effect transistors 涂层技术在生产有机场效应晶体管中的适用性

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020212

A. Manuelli, A. Knobloch, A. Bernds, W. Clemens

引用次数: 2

Modelling electrical conductivity of anisotropic chemical adhesives [for flat panel interconnections] 各向异性化学粘合剂的电导率建模[用于平板互连]

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020175

S. Charruau

{"title":"Modelling electrical conductivity of anisotropic chemical adhesives [for flat panel interconnections]","authors":"S. Charruau","doi":"10.1109/POLYTR.2002.1020175","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020175","url":null,"abstract":"This paper addresses the electrical resistance of anisotropic chemical adhesives used for connecting flexible driver circuits onto liquid crystal display glass. This work is a part of the FLEXIL European project devoted to \"fine pitch (54 micrometers) interconnects on flexible printed circuits\". The frame of the matter developed in this report deals with modeling the electrical behavior of anisotropic conductive adhesive film made of glue filled by small spherical metal particles needed for flat panels interconnections. A theoretical modeling of the electrical behavior has been developed in the frame of a resistive transmission line analysis. This theoretical study has been completed by the computation of electrical resistance of a stand alone spherical particle stressed between two conductive plates. This has been applied to estimate the number of really connected particles into the conductive glue of interconnections between copper leads of a flexible tape and the ITO traces drawn on the glass of a liquid crystal display. This number of conductive particles is directly related to the quality of anisotropic chemical adhesive bonding process. In summary, this report addresses the electrical performances of the anisotropic chemical adhesive technology in the frame of its LCD display assembly application that gives the way of an analysis which is not obviously limited to the mentioned displays.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123505192","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

Development of low temperature processable core material for embedded inductor 嵌入式电感器低温可加工芯材的研制

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020191

C.K. Liu, P. L. Cheng, Y.W. Law, I. Chong, D. Lam

{"title":"Development of low temperature processable core material for embedded inductor","authors":"C.K. Liu, P. L. Cheng, Y.W. Law, I. Chong, D. Lam","doi":"10.1109/POLYTR.2002.1020191","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020191","url":null,"abstract":"The inductance of low temperature processable particulate filled polymer matrix composite inductors is constrained by the limited magnetic properties of the polymer matrix. The microstructural and electrical properties of inductors made from amorphous nickel-zinc-iron oxide matrix filled with polycrystalline nickel zinc ferrite (NZF) fillers are investigated in this study. NZF has high resistance, and is essential for high frequency application to reduce eddy current loss. Planar spiral NZF-composite (with 20/spl nu/% fillers) inductors were fabricated on glass wafer substrate and heated treated at different temperatures. The electrical properties of the inductors were characterized at frequencies in the MHz range. The inductance is found to increase between 10%-20% for composite inductor after heated at 300/spl deg/C for 1 hour. The increase is comparable to those reported previously for polymer ferrite composite inductors, albeit the polymer version has significantly higher filler content (90 wt%) while the current NZF-composite filler content is markedly less (10-20%). This indicates that the increase is associated with improvement of the matrix's properties. The changes in matrix microstructures were characterized by X-ray diffraction. The increase in inductance and associated electrical properties are then explained based on the observed microstructural changes. The increase in matrix inductance indicates that the current approach has strong potential in giving a large enhancement in inductance when high filler content is used.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114667851","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

New methods of DNA oligomer - binding and detection in the DNA microarray technology DNA微阵列技术中DNA寡聚物结合与检测的新方法

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020192

A. Győrffy

{"title":"New methods of DNA oligomer - binding and detection in the DNA microarray technology","authors":"A. Győrffy","doi":"10.1109/POLYTR.2002.1020192","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020192","url":null,"abstract":"Widely used molecular-chips of today are expression type DNA-microarrays. These chips are not commonly used in clinical practice due to the high cost, the need for extensive laboratory devices and due to not well clarified results. Therefore the need for simple mass-production methods is constantly growing. In our work we have developed a new DNA immobilisation method for DNA binding on polypyrrole modified gold electrode. After immobilisation of biotin labeled DNA on electrode the detection was performed through streptavidin-texas red dye binding. The unlabeled DNA probes were detected using bis benzimide dye. For the visualisation of the DNA in detection we used confocal fluorescence microscope. We investigated the influence of the polymerisation time to thickness and quality of the polymer film and the influence of the quantity of DNA for detection and immobilisation. In our conception we targeted to build a clinically applicable chip, to be used for the identification of PCR amplified DNAs for known mutations of inherited diseases in the future.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"32 2 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116127006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Examination of solar cells and encapsulations of small experimental photovoltaic modules 检查太阳能电池和小型实验光伏组件的封装

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020197

V. Šály, M. Ružinský, J. Packa, P. Redi

引用次数: 9

Simulation of the aging behavior of isotropic conductive adhesives 各向同性导电胶粘剂老化性能的模拟

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020185

M. Mundlein, G. Hanreich, J. Nicolics

{"title":"Simulation of the aging behavior of isotropic conductive adhesives","authors":"M. Mundlein, G. Hanreich, J. Nicolics","doi":"10.1109/POLYTR.2002.1020185","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020185","url":null,"abstract":"Although, in numerous studies the changes of contact resistance during accelerated aging under elevated temperature and humidity were observed there is still a lack of understanding of degradation mechanisms. Some models illustrate connections between the contact behavior and parameters of the conductive filler. In addition to these considerations in our paper we describe the macroscopic behavior by considering the microscopic resistance change between the conductive particles themselves and between particles and contact pads. For this purpose, we calculated the electrical contact resistance with a two dimensional numeric simulation. Herein the conductive particles are modeled by randomly distributed ellipses placed between two parallel electrodes comparable to silver flakes as known from metallographic cross sections of our contact samples. The voltage and current distribution and the contact resistance as well are calculated by transforming this model into a resistor network. During a forced aging process different opposite effects occur in an adhesive joint. One effect is the increase of entire resistance due to a degradation of the interparticle contact. Another effect is the decrease of resistance caused by a post curing of the resin during aging of the adhesive joint. This behavior was experimentally determined in a previous investigation. In accordance to these effects we simulate the aging process of the joint by introducing different time dependencies of the interparticle resistance. The goal of this study is to provide a deeper understanding of the changes of the macroscopic contact behavior due to different environmental impacts.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121461811","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Design of epoxy resins for UV laser cure UV激光固化环氧树脂的设计

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020187

H. Bayer

引用次数: 3

A lamination technique of LCP/Cu for electronic packaging 电子封装用LCP/Cu层压技术

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020205

T. Suga, A. Takahashi, M. Howlader, K. Saijo, S. Oosawa

{"title":"A lamination technique of LCP/Cu for electronic packaging","authors":"T. Suga, A. Takahashi, M. Howlader, K. Saijo, S. Oosawa","doi":"10.1109/POLYTR.2002.1020205","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020205","url":null,"abstract":"Liquid crystalline polymer (LCP) is expected to be used for the lamination of electronic circuit boards because of its excellent mechanical and electric properties, such as a low dielectric constant and dimensional stability. However, it has not been widely used yet due to the weak interaction between LCP and Cu. Roughened surfaces of Cu foil that could deteriorate the electrical property are being used in conventional lamination process in order to improve the bonding strength. Surface activated bonding (SAB) of Cu/LCP based on a surface cleaning process by physical bombardment in vacuum has been performed to achieve the strong bonding. A peel strength of 800/spl sim/900 g/cm of the laminate prepared by SAB process is achieved, and the surface roughness of the interface between LCP and Cu is controlled to be less than 100 nm. In this experiment, additional treatment including Cu deposition on LCP and annealing after bonding is applied in order to obtain strong bonding. The effects of these treatments are investigated with the discussion of bonding mechanism.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117038377","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 15