2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)最新文献_第3页

Reduced temperature flip-chip technologies on flexible display substrates using adhesives 使用粘合剂在柔性显示基板上降低温度的倒装芯片技术

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020189

J. Vanfleteren, B. Vandecasteele, Steven Raevens, J. Maattanen, Pasi Perttula

引用次数: 2

Realization of a stackable package using chip in polymer technology 基于聚合物技术的可堆叠封装芯片的实现

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020202

A. Ostmann, A. Neumann, S. Weser, E. Jung, L. Bottcher, H. Reichl

{"title":"Realization of a stackable package using chip in polymer technology","authors":"A. Ostmann, A. Neumann, S. Weser, E. Jung, L. Bottcher, H. Reichl","doi":"10.1109/POLYTR.2002.1020202","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020202","url":null,"abstract":"The coming generations of portable products require significant improvement of the packaging technologies, mainly due to increasing signal frequencies and the demand for higher density of functions. State of the art are organic substrates with micro-via build-up layers, equipped on both sides with discrete passive and active components. The space requirement of active chips can be already reduced to a minimum by implementing CSPs (chip size packages) or flip chips. A further miniaturization however requires a 3-dimensional integration of active and passive components. Additionally the signal frequencies will increase to several GHz in high speed digital applications. In order to maintain signal integrity, much shorter and impedance-matched interconnects between chips and passive components are required. In this paper a new approach will be described which allows both extreme dense 3-dimensional integration and very short interconnects. This approach, called \"Chip in Polymer\" is based on the integration of thin components into build-up layers of printed circuit boards.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"24 3 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131207355","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 37

Low-transmission-loss modified cyanate ester materials for high-frequency applications 用于高频应用的低传输损耗改性氰酸酯材料

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020193

D. Fujimoto, Y. Mizuno, N. Takano, S. Sase, H. Negishi, T. Sugimura

{"title":"Low-transmission-loss modified cyanate ester materials for high-frequency applications","authors":"D. Fujimoto, Y. Mizuno, N. Takano, S. Sase, H. Negishi, T. Sugimura","doi":"10.1109/POLYTR.2002.1020193","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020193","url":null,"abstract":"Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"10 5","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113939688","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 1

High volume printing technologies for the production of polymer electronic structures 用于生产聚合物电子结构的大批量印刷技术

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020204

A. Huebler, U. Hahn, W. Beier, N. Lasch, T. Fischer

引用次数: 32

Application of adhesives in MEMS and MOEMS assembly: a review 黏合剂在MEMS和MOEMS组装中的应用综述

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020178

F. Sarvar, D. Hutt, D. Whalley

{"title":"Application of adhesives in MEMS and MOEMS assembly: a review","authors":"F. Sarvar, D. Hutt, D. Whalley","doi":"10.1109/POLYTR.2002.1020178","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020178","url":null,"abstract":"This paper presents a review of the recent literature on the use of adhesives in MEMS packaging applications. The aim of this review has been to establish the current applications of adhesives in MEMS and MOEMS assembly and to investigate the limitations and future requirements of these materials. The review has shown that while there is a wealth of information available on the packaging of MEMS devices, there is very limited detail available within the public domain regarding the specific uses of adhesives and in particular exactly which products are in use. The paper begins with an overview of the uses of adhesives in MEMS packaging, subdivided into sections on structural adhesives, adhesives for optical applications and other applications. The paper then describes methods for adhesive dispensing and issues with adhesive use which affect the reliability of the package. The reliability of MEMS devices assembled using adhesives is a challenging issue, being more than a simple combination of electrical, mechanical and material reliability. Many failure modes in MEMS devices can be attributed to the adhesives used in the assembly; for example, thermal expansion mismatches can cause stress in the die attach, while outgassing from epoxies can cause failure of sealed devices and contamination of optical surfaces.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"89 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128055386","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 51

Uricase enzyme types immobilized in poly-N-methylpyrrole for biosensor applications 聚n -甲基吡咯固定化脲酶类型用于生物传感器

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020195

H. Santha, R. Dobay, G. Harsányi

{"title":"Uricase enzyme types immobilized in poly-N-methylpyrrole for biosensor applications","authors":"H. Santha, R. Dobay, G. Harsányi","doi":"10.1109/POLYTR.2002.1020195","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020195","url":null,"abstract":"The suitability of three different enzymes (from porcine liver, from Candida Utilis, from Bacillus Fastidiosus) have been investigated and significant differences have been found. The results indicate, that beside specific activity also the molecular structure of the enzymes must be taken into account by a biosensor application. A new type of electronically-conducting-polymer based enzymatic uric acid biosensor has been investigated. The layout of the substrate, which consists of 4 electrode surfaces (Working1, Working2, Reference, Counter) was prepared by thick film technology on sintered alumina ceramic sheets. Dodecyl sulfate doped poly-N-methyl-pyrrole layer was used for enzyme immobilization. This polymer film can incorporate the enzyme in one step during the process of the electropolymerization. By the applied bipotentiostatic measurement method the two working electrodes (with and without the enzyme) are identically prepared and polarized and the currents in the two circuits are measured simultaneously. The concentration of the uric acid is calculated from the current difference.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132755253","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Novel ultra-high dielectric constant polymer based composite for embedded capacitor application 嵌入式电容器用新型超高介电常数聚合物基复合材料

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020210

Y. Rao, C. Wong

{"title":"Novel ultra-high dielectric constant polymer based composite for embedded capacitor application","authors":"Y. Rao, C. Wong","doi":"10.1109/POLYTR.2002.1020210","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020210","url":null,"abstract":"Embedded capacitor technology can increase the silicon efficiency of the electronic packaging, improve electrical performance, and reduce electronic assembly cost compared with traditional discrete capacitor technology. Developing a suitable material that satisfies electrical, reliability and processing requirements is one of the major challenges of incorporating capacitors into a printed wiring board (PWB) for demanding wireless, RF portable telecommunication products. A novel epoxy-based composite with ultra high dielectric constant (/spl epsi//sub r//spl sim/1000) has been developed in this work. The previous record of /spl epsi//sub r/=150 was only recently reported. To the best of our knowledge, this is the highest k value of the polymer-based composite ever reported. High dielectric constant is obtained by increasing the concentration of conductive filler close to but not exceed the percolation threshold within the polymer matrix. This novel ultra high k material also has low dielectric loss (< 0.02), good adhesion and perfect multi-chip-module laminate (MCM-L) process compatibility. This novel composite is the perfect material candidate for the integral embedded capacitor applications for next generation electronic products.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"106 5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130054424","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Alternating current electrical properties of island aluminum thin films on polyimide substrates 聚酰亚胺基板上岛铝薄膜的交流电性能

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020199

Fan Wu, J. Morris

引用次数: 0

Isotropically conductive adhesives for high power electronics applications 大功率电子应用的各向同性导电胶粘剂

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020179

K. Olsson, D. Johansson, S. Lil, K. Ovesen, J. Liu

{"title":"Isotropically conductive adhesives for high power electronics applications","authors":"K. Olsson, D. Johansson, S. Lil, K. Ovesen, J. Liu","doi":"10.1109/POLYTR.2002.1020179","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020179","url":null,"abstract":"A lot of research efforts have been carried out to investigate and improve mechanical and electrical properties and reliability of electrically conductive adhesive (ECA) materials. A few of the studies have been directed towards evaluating ECAs for high power electronics applications. The objective of this study was focused on evaluation and characterization of isotropically conductive adhesives (ICAs). Three commercial silver-filled epoxy ICAs, one formulated silver-filled epoxy ICA in this study, and a 96.5 Sn 3.5 Ag solder paste as reference were used as interconnecting materials. The ICAs were stencil printed on ceramic substrates and components with Sn- or Ag/Pd-plated terminations were mounted by pick-and-place equipment. ICA joints were cured by reflow process. Mechanical and electrical properties of the joints were measured Temperature cycling (-40 to 125/spl deg/C, 300 cycles), heat storage (125/spl deg/C, 550 h) and humidity test (85/spl deg/C/85% RH, 550 h) were performed to assess reliabilities of the joints. Microstructures of the joints were observed by optical microscopy and scanning electron microscopy (SEM). The results indicated that most of the evaluated commercial and formulated ICAs were capable to carrying 6A current in linear behavior. The metallization of component terminations strongly affected performances of the ICA joints. The ICAs tested in this study had very good shear strength, especially ICA C. Postcure is important to achieve the possibly better performance of the ICAs. Two ICAs tested in this study showed possible signs of silver migration and further investigations are needed to claret this point.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116778461","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

Theoretical and experimental aspects in the depositing process of solder and adhesive pastes in surface mount technology 从理论和实验两个方面研究了表面贴装技术中焊料和黏合剂的沉积过程

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI: 10.1109/POLYTR.2002.1020200

A. Marin, P. Svasta, D. Simion-Zanescu

{"title":"Theoretical and experimental aspects in the depositing process of solder and adhesive pastes in surface mount technology","authors":"A. Marin, P. Svasta, D. Simion-Zanescu","doi":"10.1109/POLYTR.2002.1020200","DOIUrl":"https://doi.org/10.1109/POLYTR.2002.1020200","url":null,"abstract":"The paper contributes to a detailed comparison of some materials, like solder pastes and conductive adhesives, used in the assembling technology process of the electronic components, on interconnecting supports. The study dealt also with the analyze of different geometrical configurations, in the depositing processes of the above-mentioned materials. The goal is to determine an optimum correlation of the functional parameters, for the depositing process, in realizing prototype and low manufacturing series applications. The study is focused only on the technology process in depositing materials, for interconnecting components and electronic modules, the other steps in the technological flow being considered only like input and output data. From all known technological processes, it was selected the one adapted to our purpose and it were established the necessary physical and technical parameters. By these means, we have studied the physical properties of the materials, pointing out their characteristics and the influence of these ones on the depositing process. It were made critical observations, concerning the validity of the proposed models and it were pointed out the further researches that we must conduct, in order to obtain better practical results.","PeriodicalId":166602,"journal":{"name":"2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114495519","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0