用于高频应用的低传输损耗改性氰酸酯材料

D. Fujimoto, Y. Mizuno, N. Takano, S. Sase, H. Negishi, T. Sugimura
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引用次数: 1

摘要

氰酸酯通过反应性氰酸官能团的环三聚化固化成具有三维和紧密交联结构的树脂。即三嗪树脂,它具有低介电常数和高玻璃化转变温度。氰酸芳酯作为低介电常数电路板的材料受到广泛关注;但是,它们的介电性能不能满足高速通信的要求。我们发现新型改性氰酸酯树脂具有更低的介电常数/损耗和与高分子量热塑性聚合物更好的相容性。从其化学结构分析结果和粘弹性研究得出的结构/性能关系来看,我们认为上述特点是由于树脂结构独特。将改性氰酸酯树脂与热塑性聚合物相结合,开发了半分子间穿透网络(semi-IPN)材料,该材料在GHz频率范围内具有较低的损耗因子。使用玻璃布和这些材料的电路板在高达30 GHz的频率范围内显示出较低的传输损耗。这些优异的微波性能将确保新型改性氰酸酯树脂作为高速通信技术电路板材料的优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-transmission-loss modified cyanate ester materials for high-frequency applications
Cyanate esters cure through cyclotrimerization of reactive cyanate functional groups into resins with three-dimensional and densely cross-linked structures. i.e. triazine resins, which have low dielectric constants and high glass transition temperatures. Aryl cyanate esters had been of great interest as materials for low-dielectric-constant circuit boards; however, their dielectric properties could not satisfy the demands for high-speed communication. We have found that novel modified cyanate ester resins will show much lower dielectric constant/loss and better compatibility with high molecular weight thermoplastic polymers. Judging from the structure/property relationships obtained through the analytical results of their chemical structures and the studies on their visco-elastic properties, we have concluded that the above characteristics were due to the unique resin structures. We developed semi-intermolecular-penetrating network (semi-IPN) materials by combining modified cyanate ester resins with thermoplastic polymers which provide low dissipation factor in GHz frequency range. Circuit boards with glass cloths and these materials demonstrated low transmission losses in the frequency range up to 30 GHz. These excellent microwave properties will ensure an advantage to the novel modified cyanate ester resins as materials for circuit boards in high-speed communications technology.
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