使用粘合剂在柔性显示基板上降低温度的倒装芯片技术

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI:10.1109/POLYTR.2002.1020189

J. Vanfleteren, B. Vandecasteele, Steven Raevens, J. Maattanen, Pasi Perttula

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引用次数: 2

摘要

本文研究了将硅驱动芯片倒装到柔性显示器上的可能性，该显示器将集成在智能卡中。芯片是Au或Ni/Au碰撞，衬底材料由PES(聚醚砜)与导电ITO衬垫组成。一种使用ICA和NCA的技术似乎相当简单，另一种使用ACA的技术则揭示了热压过程中ITO损伤的问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Reduced temperature flip-chip technologies on flexible display substrates using adhesives

The paper investigates the possibilities to flip-chip assemble Si driver chips onto a flexible display, which is to be integrated in a smart card. The chips are Au or Ni/Au bumped, the substrate material consists of PES (polyether sulphone) with conductive ITO pads. One technology, using ICA and NCA seems to be quite straightforward, another, using ACA, reveals the problem of ITO damage during thermocompression.

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2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

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