2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 1900-01-01 DOI:10.1109/POLYTR.2002.1020173

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Abstract

The following topics are dealt with: adhesive joints in microwave applications; electrical conductivity of anisotropic chemical adhesives; conductive adhesive fillets for double sided PCBs; solderable conductive pastes; application of adhesives in MEMS, and MOEMS assembly; isotropically conductive adhesives; reliability; epoxy resins for UV laser cure; double-layer no-flow underfill materials and process; encapsulant characterization tools for process setup and failure analysis; low temperature processable core material for embedded inductor; triazine containing polymers for use in integrated optics; fine pitch flip chip on flex interconnection process; stackable package using chip in polymer technology; high volume printing technologies; lamination technique for electronic packaging; laser processing of flexible substrates; all-polymer field effect transistors and organic thin film transistors; ultra-high dielectric constant polymer based composite; and vacuum molded flip chip packaging technology.

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第二届国际IEEE微电子和光子学聚合物和粘合剂会议。POLYTRONIC 2002。会议记录(Cat.)No.02EX599)

讨论了以下主题:微波应用中的粘合接头;各向异性化学粘合剂的电导率;双面pcb用导电胶粘片;可焊导电浆料;胶粘剂在MEMS中的应用，以及MEMS组装;各向同性导电胶粘剂;可靠性;紫外激光固化环氧树脂;双层无流底填材料及工艺;用于工艺设置和失效分析的封装剂表征工具;一种用于嵌入式电感器的低温可加工芯材;集成光学用含三嗪的聚合物;基于柔性互连工艺的小间距倒装芯片采用聚合物芯片技术的可堆叠封装;大批量印刷技术;电子封装的层压技术;柔性基板的激光加工;全聚合物场效应晶体管和有机薄膜晶体管;超高介电常数聚合物基复合材料;以及真空模制倒装芯片封装技术。

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2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

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