微波应用中填料颗粒形状对粘接接头的影响

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI:10.1109/POLYTR.2002.1020174

J. Felba, K. Friedel, B. Guenther, A. Moscicki, H. Schafer

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引用次数: 3

摘要

粘接接头的导电是由金属含量提供的。高导电性要求高金属含量。在制造各向同性导电胶粘剂时，填料浓度通常大于渗透阈值，以保证在考虑制造公差的情况下具有低电阻。但我们发现，在微波应用的情况下，这是不够的。在此工作中，我们测量了频率为3.5 GHz的谐振电路的品质因子，并将其制作成包含被测接头的带状线电路。在两种树脂的基础上，用四种银填料配制了胶粘剂。填充材料在颗粒形状和尺寸方面各不相同。指出了银填料的种类、填料与树脂的相互作用以及粘接层表面的状态对微波电子学中导电胶粘剂替代焊料的影响。

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The influence of filler particle shapes on adhesive joints in microwave applications

Electrical conduction of adhesive joint is provided by the metal content. High conductivity requires high metallic content. Isotropic electrically conductive adhesives are usually manufactured with filler concentration sufficiently greater than percolation threshold to guarantee low resistance with allowance for manufacturing tolerances. But we have found that it is not sufficient in a case of microwave applications. In this work we have measured the quality factor of resonant circuit at the frequency of 3.5 GHz, which was made as stripline circuit including the measured joints. Adhesives were formulated on the base of two kinds of resin with four type of silver filler. Filler materials differ from each other as regards the shape of particles and their dimensions. It was stated that kind of silver filler, the interaction of filler/type of resin as well as the state of the surface of adhesive layer plays important role in the case of solder replacement with electrically conductive adhesives in microwave electronics.

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来源期刊

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

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