双面pcb的导电胶粘片

2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599) Pub Date : 2002-08-07 DOI:10.1109/POLYTR.2002.1020176

R. Kisiel, A. Markowski, Marcin Lubiak

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引用次数: 6

摘要

电子设备制造商对研究和开发生产生态友好型pcb的新材料和工艺感兴趣。无铅焊料或导电粘合剂是连接材料的可能解决方案。但多氯联苯仍然是通过化学工艺生产的焊盘和过孔金属化。我们研究的目的是分析在双面PCB应用中应用导电胶粘剂创建圆角的可能性。采用单组分，导电，银填充环氧酚醛基树脂。试验采用通孔直径0.6 mm的FR-4双面层压板。以回流焊1 ~ 5次后的粘接圆角电阻和圆角电阻变化作为估计标准。孔径0.6 mm的圆角电阻低于300 m/spl ω /，电流过载高于2.5 A。

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Conductive adhesive fillets for double sided PCBs

Electronic devices manufactures are interested in research and development of new materials and processes for producing ecologically friendly PCBs. Lead-free solders or conductive adhesives are possible solutions for joining materials. But PCBs are still produced by chemical processes for pads and vias metallization. The objective of our research was to analyse the possibility of applying conductive adhesives for creating fillets in double sided PCB application. Single component, electrically conductive, silver filled epoxy-phenolic base resins were applied. FR-4 double sided laminates with through hole diameter 0.6 mm were used for trials. Adhesive fillet resistance and variation of fillet resistance after 1 to 5 reflow soldering were used as estimation criteria. Fillets for hole diameter 0.6 mm have resistance below 300 m/spl Omega/ and current overloading above 2.5 A.

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2nd International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. POLYTRONIC 2002. Conference Proceedings (Cat. No.02EX599)

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