Journal of Microelectromechanical Systems最新文献

{"title":"SOI Inertial Switch Fabrication by Fusion Bonding: Case Study and Lessons Learned","authors":"Tamar Tepper-Faran;Limor Pasternak;Ronen Maimon;Slava Krylov","doi":"10.1109/JMEMS.2026.3717465","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3717465","url":null,"abstract":"In this work, we investigate the critical fabrication challenges of a vertically integrated inertial MEMS impact switch, uniquely implemented using fusion bonding, with a focus on the chemical stability of wafer-level bonds. While fusion bonding provides the sub-micron precision necessary for defining accurate contact air gaps, we demonstrate that mid-fabrication bonding strategies are highly susceptible to “unzipping” during the sacrificial release phase. Specifically, vapor-phase hydrofluoric acid (vHF), used to remove the buried oxide (BOX) layer, migrates into the fused oxide-to-oxide interface, leading to catastrophic delamination during die singulation. Through a multi-parameter refinement—including aggressive standard clean (SC1), surface activation, high-force thermal annealing, and a single-substrate oxide-bonding strategy—we achieved a stable silicon-to-oxide interface with an 84% dicing yield. These results establish a robust framework for device fabrication and demonstrate that interfacial chemical compatibility is a primary design constraint for high-precision MEMS integration using wafer-level fusion bonding.[2026-0088]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"873-881"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097302","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Journal of Microelectromechanical Systems Publication Information","authors":"","doi":"10.1109/JMEMS.2026.3728924","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3728924","url":null,"abstract":"","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"C2-C2"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11719926","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097514","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Long-Term Frequency Stability of a Dual-Oven MEMS Oscillator Based on a High-Q Lateral Extensional Resonator","authors":"Maliha Sultana;Hannaneh Mahdavi;Hamed Atashbar;Hakhamanesh Mansoorzare;Reza Abdolvand","doi":"10.1109/JMEMS.2026.3719600","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3719600","url":null,"abstract":"This work presents a 5 MHz microelectromechanical systems (MEMS) oscillator based on a high-quality factor (<inline-formula> <tex-math>$Q_{mathrm {unloaded}} gt 50$ </tex-math></inline-formula>,000) lateral extensional (LE) mode Aluminum Nitride (AlN)-on-silicon (Si) resonator for stable clock applications. The resonator is designed to have a turn-over temperature (ToT) above <inline-formula> <tex-math>$100~^{circ }$ </tex-math></inline-formula>C and is fabricated on a <inline-formula> <tex-math>$350~mu $ </tex-math></inline-formula>m thick single-crystal Si substrate to achieve high <inline-formula> <tex-math>$Q$ </tex-math></inline-formula> while its lateral dimensions are optimized to obtain a low motional impedance. To improve frequency stability, the oscillator is operated under high vacuum and evaluated using two thermal-control configurations. The single-oven configuration utilizes an integrated heater on the resonator and applies a fixed integrated-heater bias near the ToT, while the dual-oven configuration additionally stabilizes the environmental temperature fluctuations within the vacuum-chamber using controlled external heating. Both configurations reach an Allan deviation (ADEV) of approximately <inline-formula> <tex-math>$1.7times 10^{-10}$ </tex-math></inline-formula> at <inline-formula> <tex-math>$tau =1$ </tex-math></inline-formula> s, demonstrating strong short-term stability enabled by the high-<inline-formula> <tex-math>$Q$ </tex-math></inline-formula> resonator. However, the dual-oven configuration suppresses the increase in ADEV at long averaging times, maintaining an ADEV of approximately <inline-formula> <tex-math>$1.6times 10^{-10}$ </tex-math></inline-formula> at <inline-formula> <tex-math>$tau =1000$ </tex-math></inline-formula> s compared with <inline-formula> <tex-math>$9.5times 10^{-9}$ </tex-math></inline-formula> for the single-oven operation, and exhibiting an average net drift rate of 0.85 ppb/h over 32 h. The results distinguish the roles of the high-<inline-formula> <tex-math>$Q$ </tex-math></inline-formula> resonator and external chamber thermal stabilization in achieving short- and long-term frequency stability, respectively.[2026-0044]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"948-957"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097032","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Bandwidth Enhancement and SPL Flattening in MEMS Piezoelectric Speaker Array via Stiffness-Modulated Triangular Diaphragm Design","authors":"Xiaoming Huang;Haiyang Li;Qinwen Xu;Jiaqi Ding;Yuanhang Qu;Yao Cai;Yan Liu;Chengliang Sun;Shishang Guo","doi":"10.1109/JMEMS.2026.3716974","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3716974","url":null,"abstract":"To overcome the intrinsic narrowband limitation of high-Q MEMS piezoelectric speakers, a stiffness-modulated multi-resonant array strategy is proposed to broaden the effective acoustic bandwidth. By locally modifying the boundary stiffness of triangular cantilever diaphragms through etched grooves of different lengths, the resonant frequencies of individual speaker units are intentionally distributed within a target frequency band. A theoretical framework based on single-degree-of-freedom resonance modeling is established to analyze the phase–frequency behavior of each unit and to clarify how appropriate resonance spacing suppresses inter-unit phase mismatch. The analysis reveals that closely spaced resonances confine the phase transition regions, thereby preventing destructive interference of volume displacement between adjacent units and enabling constructive superposition over a wider frequency range. Finite element simulations incorporating an IEC 711 ear-coupler model validate the resonance allocation mechanism and predict broadened acoustic response. Experimental measurements under 1 V_rms AC excitation with 15 V DC bias demonstrate an SPL exceeding 120 dB across 12.5–18 kHz, confirming the effectiveness of the proposed resonance-dispersion design. This work provides a physically grounded strategy for rationally allocating resonant frequencies in multi-unit MEMS speaker arrays and offers a practical route toward wideband high-SPL acoustic transducers.[2025-0173]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"855-864"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097098","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Low-Frequency Pressure-Gradient MEMS Vector Hydrophone Using AlN/ScAlN Composite Films","authors":"Zhenyao Shi;Rong Dang;Junyang Li;Chenghao Hu;Guojun Zhang;Renxin Wang;Wendong Zhang;Licheng Jia","doi":"10.1109/JMEMS.2026.3723452","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3723452","url":null,"abstract":"Low-frequency MEMS vector hydrophones are limited by the inherently weak pressure-gradient response and inefficient underwater acoustic coupling. This letter presents a low-frequency pressure-gradient MEMS vector hydrophone based on AlN/Sc_0.2Al_0.8N composite piezoelectric films. The device employs a hexagonal diaphragm fabricated on an SOI platform with silicone-oil-filled cavities, enabling a pressure gradient to develop across the sensing units, which is subsequently converted into electrical signals through the piezoelectric effect. Furthermore, two orthogonally arranged pairs of sensing units enable two-dimensional vector acoustic sensing. Measurements show a stable dipole directivity from 50 Hz to 1 kHz and a receiving sensitivity of −163 dB (re: 1 V/<inline-formula> <tex-math>$mu $ </tex-math></inline-formula>Pa) at 1 kHz. These results demonstrate the capability of the proposed hydrophone for high-precision low-frequency underwater vector acoustic sensing. [2026-0126]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"768-770"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097212","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Continuously Wearable Stethoscope Based on MEMS Resonant Microphone Array","authors":"Anik Sengupta;Akash Roy;Hongxiang Gao;Kianoush Sadeghian Esfahani;Yicheng Zhang;Eun Sok Kim","doi":"10.1109/JMEMS.2026.3708434","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3708434","url":null,"abstract":"This paper describes continuous wireless transmission of lung sound picked up by a wearable stethoscope over an extended period of approximately 30 hours under a single coin-cell battery. The wearable stethoscope is based on a piezoelectric resonant microphone array (RMA) integrated with a low-power preamp and electronic circuits for signal processing and low-power lung-sound data communication through Bluetooth Low Energy (BLE) 5.0. Given the targeted acoustic features of lung sounds spanning over 200 - 800 Hz, the RMA’s resonant frequencies are designed to be at 250, 400, 600, and 800 Hz, with unamplified sensitivities ranging from 47 to 230 mV/Pa. The RMA is mounted on a printed circuit board (PCB) that houses op-amp-based preamps and low-pass filters. Another PCB housing a coin-cell battery and a commercial wireless chipset (CYBLE-416045-02) with an integrated antenna is placed over the pre-amp PCB. The two PCBs are integrated into a 3D-printed package measuring <inline-formula> <tex-math>$3.6times 3.35 times 2.02$ </tex-math></inline-formula> cm³, resulting in a lightweight (approximately 23g), wireless, and wearable stethoscope. [2026-0070]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"1030-1040"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Non-Hermitian MEMS Disk Resonator Based on Thermoelastic Damping Regulation","authors":"Sen Zhang;Yangyu Huang;Lei Yu;Ning Zhou;Kaixuan He;Xin Zhou","doi":"10.1109/JMEMS.2026.3707227","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3707227","url":null,"abstract":"This paper demonstrates a non-Hermitian MEMS disk resonator gyroscope (DRG) by regulating thermoelastic damping and stiffness distribution. A segmented ring structure creates a substantial damping difference between frequency-matched wineglass modes, forming a passive PT-symmetric platform. Using electrostatic stiffness coupling, we directly observe eigenfrequency and linewidth Riemann surfaces and observe exceptional points. For frequency-mismatched devices, an anti-Stokes parametric pump enables dynamic coupling that produces the same topology in a Floquet frame. Measurements on vacuum-packaged DRG prototypes confirm large TED imbalance and electrically tunable Riemann surfaces. This work extends gyroscope theory into the non-Hermitian regime, establishes a practical pathway to exceptional-point-enhanced gyroscopes, and introduces dissipation contrast as a new design knob for sensor performance.[2025-0200]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"995-1006"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097622","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Tilted Micro-Force Sensing Using a Dual-Port Surface Acoustic Wave Resonator Sensor","authors":"Ke Zhai;Wenya Xu;Ning Zhang","doi":"10.1109/JMEMS.2026.3709824","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3709824","url":null,"abstract":"Tilted micro-force sensing is of significant value for wafer contact testing, microindentation characterization, and precision machining. To investigate the response of surface acoustic wave (SAW) sensors under inclined loading conditions, this paper presents a miniaturized SAW micro-force sensor based on a dual-port resonator architecture. The sensor employs ST-X cut quartz as the piezoelectric substrate, and the dual-port resonator is formed by interdigital transducers and reflectors to convert strain variations induced by inclined loading into a frequency-shift response. A relationship between the applied inclined micro-force and the resonant frequency shift is established through finite-element simulations and subsequently validated experimentally. Experimental results show that, near an operating frequency of approximately 79 MHz, the sensor exhibits good linearity with respect to the applied force at inclination angles of 30°, 45°, and 60°. The experimentally characterized sensitivities are 91.14 kHz/N, 127.69 kHz/N, and 151.63 kHz/N, respectively. These results indicate that the proposed dual-port SAW sensor can provide a stable force-frequency response under inclined loading conditions, offering a feasible sensing approach for inclined micro-force detection. [2025-0251]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"908-914"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097241","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Laser Ablation of Polyimide Foil for Applications as Electrodes in the Micro-Pattern Gaseous Detectors","authors":"Tomas Klinavičius;Aušrinė Jurkevičiūtė;Tomas Tamulevičius;Andrius Vasiliauskas;Šarūnas Meškinis;Asta Tamulevičienė;Rimantas Gudaitis;Asta Guobienė;Erika Rajackaitė;Brigita Abakevičienė;Sigitas Tamulevičius","doi":"10.1109/JMEMS.2026.3712139","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3712139","url":null,"abstract":"New manufacturing routes and materials need to be constantly developed to improve the performance of a new type of gas detector–a high-gain and fast-timing micro-pattern gaseous detector (MPGD)–which works as a gas electron multiplier. The cylindrical symmetry of microholes in perforated electrodes is desired in such detectors to ensure denser electric field lines and higher sensitivity, as well as stability of the detector. On the other hand, the probability of discharge between the electrodes arises at high gains. The discharge issue can be solved using a resistive layer with controlled electrical conductivity. In this work, we developed an ultrashort pulse laser ablation route to produce electrodes based on microstructuring of polyimide (Kapton™) foil that allows avoiding the wet-etching process and opens another level of variability in hole diameters and distribution over the surface. Femtosecond laser ablation was used to micromachine multiple arrays of cone-shaped through holes with narrowing diameters in an area of <inline-formula> <tex-math>$3times 3$ </tex-math></inline-formula> mm² in polyimide foil. By employing an unbalanced direct current magnetron sputtering method obtained micropatterned polyimide surface was covered with a diamond-like carbon layer of 50 nm thickness and <inline-formula> <tex-math>$4.36~pm ~2.49$ </tex-math></inline-formula> M<inline-formula> <tex-math>$Omega $ </tex-math></inline-formula> /sq average sheet resistance (<inline-formula> <tex-math>$R_{mathbf {S}}$ </tex-math></inline-formula>) as a resistive layer, which would be reconcilable with the technologies used in the fast-timing MPGD detectors.[2025-0230]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"806-813"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Flexible Fishbone Waveguides Made of Single-Crystal Silicon for Terahertz-Wave Path Switching","authors":"Kohei Chiba;Yoshiaki Kanamori","doi":"10.1109/JMEMS.2026.3710220","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3710220","url":null,"abstract":"Integrated systems for signal control are essential for advancing terahertz applications including 6G communication systems, medical diagnosis, and security checks. Photonic integrated circuits (PICs) enable broadband and high efficiency control in the terahertz range. Optical switches are key components for signal routing. Among various approaches, direct-path-switching-type optical switches based on micro-mechanical systems (MEMS) offer superior modulation depth, bandwidth, and optical efficiency. However, conventional optical switches using ribbon waveguides are too large to be realized in the terahertz range, unlike in the infrared region. In this study, we propose a “fishbone” waveguide consisting of a subwavelength structure and a beam to achieve both high mechanical flexibility and sufficient optical confinement. We clarified the relationship between the waveguide parameters and its mechanical and optical characteristics. A <inline-formula> <tex-math>$1times 2$ </tex-math></inline-formula> optical switch incorporating a 10-mm-long fishbone waveguide was fabricated using micromachining processes. This footprint is equivalent to 1/88 that of a previously reported compact optical switch. Experimental results demonstrated a <inline-formula> <tex-math>$475~mu $ </tex-math></inline-formula>m displacement at a driving voltage of 65 V, and optical switching with an average crosstalk of −10 dB across the 270–320 GHz band. To the best of our knowledge, this is the first demonstration of a direct-path-switching-type optical switch in the terahertz range. This study contributes to further miniaturization and low-voltage operation of MEMS optical switches and enhances functionality in terahertz PICs. [2026-0061]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"831-841"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11609379","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097066","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}