Journal of Microelectromechanical Systems最新文献

{"title":"Zero-Rate-Output Instability Phenomena in MEMS Gyroscopes With and Without Quadrature Nulling","authors":"Luca Pileri;Luca Falorni;Gabriele Gattere;Giacomo Langfelder","doi":"10.1109/JMEMS.2026.3707658","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3707658","url":null,"abstract":"This work investigates instability phenomena in amplitude modulated gyroscopes with sub <inline-formula> <tex-math>$0.1~^{circ }$ </tex-math></inline-formula>/hr bias stability and <inline-formula> <tex-math>$0.03~^{circ }$ </tex-math></inline-formula>/<inline-formula> <tex-math>$surd $ </tex-math></inline-formula>hr angle random walk. A predictive model is developed for the dependence of the zero-rate output (ZRO) on temperature for both the condition of uncompensated quadrature, and, notably, also for the case of quadrature nulled by an automatic loop with electromechanical electrodes. The model verification requires an accurate calibration of various parameters: other than the usual ones (resonance, quality factor, split value...), the work also includes a temperature characterization of the feedthrough capacitances and of quadrature, on dozens of samples. The model predicts ZRO variations in closed-loop quadrature to depend more on scale-factor changes and drive-sense feedthrough, rather than on quadrature or phase changes, which are instead known main contributors in absence of quadrature null. Experiments are taken both as ZRO vs temperature curves and as Allan deviations in controlled conditions: results confirm some of the model suggestions, but highlight additional phenomena, not captured by the model, like stability dependence on drive amplitude, and Random Telegraph Noise (RTN).<p>[2026-0058]</p>","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"983-994"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097051","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Gear-Train-Enabled Ingestible Capsule System Toward Wireless Targeted Intestinal Biopsy","authors":"Michael A. Straker;Joshua A. Levy;Anika Prasanna;Patrick A. Sweeney;Justin M. Stine;Luke A. Beardslee;Reza Ghodssi","doi":"10.1109/JMEMS.2026.3701022","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3701022","url":null,"abstract":"Diagnosing gastrointestinal (GI) diseases affecting the small intestine is a prevalent healthcare challenge as traditional procedures require sedation and have limited small intestinal access. Ingestible capsule technologies have emerged as a promising minimally-invasive alternative to endoscopic procedures, offering access to the entire GI tract. However, biopsy capsules have yet to translate clinically due to their external stimulation or power requirements. Here, an ingestible low-power thermomechanical gear-train actuation system featuring a hybrid 3D-printed tissue scraper is demonstrated. The system easily interfaces with ingestible capsule-based electronics for on-command activation with a power requirement of 150-180 mW, a ~40-80% power reduction compared to previously demonstrated prototypes. The tissue scraper features a <inline-formula> <tex-math>$1~mu $ </tex-math></inline-formula>m blade requiring <inline-formula> <tex-math>$0.208pm 0.053$ </tex-math></inline-formula> N to penetrate phantom tumor tissue to a <inline-formula> <tex-math>$500~mu $ </tex-math></inline-formula>m depth. An average output force of <inline-formula> <tex-math>$2.5pm 0.8$ </tex-math></inline-formula> N was demonstrated by the system, surpassing the necessary penetration force. Testing on ex vivo tissue showed a collection volume of <inline-formula> <tex-math>$1.5pm 1.2$ </tex-math></inline-formula> mm³ which is relevant for histological and genetic analysis. The device was integrated with ingestible electronics which wirelessly initiate activation; a necessary capability for future feedback-driven sampling. Overall, the biopsy system represents an advance toward autonomous small intestinal tissue biopsy, introducing a new paradigm for GI disease diagnosis. [2026-0013]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"780-791"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097215","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Gas Leak Detection via Thin-Film Lithium Niobate pMUTs Integrating Optimized Acoustic Channels","authors":"Jiayi Liu;Yejia Wu;Bingjin Jue;Qing Wan;Xianhao Le","doi":"10.1109/JMEMS.2026.3709277","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3709277","url":null,"abstract":"This work presents a compact ultrasonic gas leak detection system utilizing a thin-film lithium niobate (LiNbO₃) piezoelectric micromachined ultrasonic transducer (pMUT) array, designed to exhibit enhanced sensitivity to gas leak-generated acoustic emissions within a specific frequency band. To realize high acoustic performance alongside fabrication feasibility, strategic device optimizations are implemented. A coplanar electrode configuration is adopted to ensure efficient electromechanical transduction, while simultaneously, the receiving sensitivity within the target band is further enhanced through an optimized acoustic channel integrated beneath the cavity-backed structure. Experimental validation demonstrates that miniaturizing the array to <inline-formula> <tex-math>$2times 2$ </tex-math></inline-formula> elements causes negligible performance degradation, confirming the system’s compactness. Finally, coupled with an external signal-processing module for signal-to-noise ratio improvement, the proposed LiNbO₃ pMUT device offers a promising solution for passive, low-power, and noncontact gas leak monitoring in acoustically noisy environments. [2026-0074]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"759-761"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097170","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A High-Temperature-Stability MEMS Resonant Accelerometer Using a Ring-Down Driving Scheme With Active Ripple Suppression","authors":"Yang Bo;Chencheng Yu;Yuchi Zou;Benhao Huang;Jing Zhang;Rui Feng;Qi Fan;Yuxiang Cheng;Wanliang Zhao;Jian Zhao","doi":"10.1109/JMEMS.2026.3719408","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3719408","url":null,"abstract":"The temperature field across MEMS resonant accelerometers exhibits nonuniform and dynamic distributions under practical operating conditions, which makes temperature monitoring and thermal drift compensation in silicon accelerometers challenging. The ring-down driving scheme enables real-time quality factor monitoring for accurate in-situ temperature measurement, while frequency ripple induced by the amplitude-stiffening (A-S) effect degrades frequency stability. Addressing this problem, we propose a ring-down driving scheme with active ripple suppression (ARS), where the real-time monitored quality factor serves as a virtual thermometer, and the resonant frequency ripple is suppressed through electrostatic stiffness modulation. During continuous ring-down operation, the amplitude of the sensing signal is utilized as a phase stamp to continuously adjust the bias voltage of the driving signal via the dual-LUT and employ a calibration circuit based on P-type iterative learning control (ILC) to calibrate the feedback compensation relationship. The results of the experiment demonstrate that the proposed technique reduced the peak-to-peak frequency ripple from 7.3 Hz to 0.8 Hz, a suppression of 89% and achieved a harmonic suppression ratio of 41.9 dB, representing an improvement of <inline-formula> <tex-math>$18.8times $ </tex-math></inline-formula>. The proposed technique in generalization experiments achieved an average harmonic suppression ratio of 36.1 dB with a standard deviation of 5.4 dB. Additionally, it enables near in-situ temperature monitoring with low hysteresis, with a temperature resolution better than 0.2 °C within 1 Hz bandwidth through quality measurement. For applications of resonant accelerometers, the proposed ARS method achieves an acceleration resolution of 2.3 mg within a 10 Hz bandwidth and a bias stability of 1.0 mg after temperature compensation over the temperature range of 0 °C to 45 °C. The proposed system enables both real-time and accurate in-situ temperature tracking while improving acceleration resolution.[2026-0068]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"938-947"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097632","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Toward Mem-Re-Sensors: Memristor-Like Pinched Hysteresis in an Open-Loop MEMS Resonator Using Third-Order Duffing Nonlinearity","authors":"Ryan Leatherbarrow;Erion Uka;Chun Zhao","doi":"10.1109/JMEMS.2026.3713050","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3713050","url":null,"abstract":"For the first time, it is shown that a pinched hysteresis response can be observed in a MEMS resonator when subject to parametric modulation and Duffing nonlinearity. The resultant memristor-like device operates in an open-loop configuration, without the need for a phase-locked loop based feedback control mechanism, to generate discontinuities in response to a stiffness perturbation. This simplifies the peripheral electronics needed to realize memristor-like operation using MEMS resonators, which is a key to realizing practical devices based on this approach. As alternatives to classical computing architectures begin to emerge, we see this work as providing a foundation towards integrated sense, memory, and compute functionality within a single device, which is essential for emerging computing paradigms such as neuromorphic and in-sensor computing.[2026-0062]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"865-872"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"High-Speed Micromilling of Copper Microbeams: Dimensional Control and Fabrication Limits for MEMS Applications","authors":"Debottam Bhowmik;Ashish Kumar Verma;Nitesh Kumar;Rinku Kumar Mittal","doi":"10.1109/JMEMS.2026.3716706","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3716706","url":null,"abstract":"Copper microbeams are critical structural elements in microelectromechanical systems (MEMS), micro-sensors, and flexible electronic assemblies. However, their fabrication at microscales remains challenging due to copper’s high ductility and the dominance of size-effect phenomena. This study investigates the feasibility of high-speed micromilling for producing copper microbeams with widths ranging from <inline-formula> <tex-math>$30~upmu $ </tex-math></inline-formula>m down to <inline-formula> <tex-math>$10~upmu $ </tex-math></inline-formula>m. Experiments were conducted by varying feed per tooth and spindle speed to evaluate dimensional accuracy and burr formation mechanisms. Results show that <inline-formula> <tex-math>$20~upmu $ </tex-math></inline-formula>m microbeams fabricated at 20,000 rpm achieved dimensional deviations within 0.65–2.8%, demonstrating stable shearing-dominated cutting. In contrast, fabrication of <inline-formula> <tex-math>$10~upmu $ </tex-math></inline-formula>m beams was strongly influenced by the transition from shearing to ploughing, leading to pronounced burr formation and dimensional instability. Burr height decreased with an increase in feed rate from 1 to <inline-formula> <tex-math>$2~upmu $ </tex-math></inline-formula>m/tooth, but increased at <inline-formula> <tex-math>$3~upmu $ </tex-math></inline-formula>m/tooth, showing a narrow process window for burr-minimized fabrication. These findings establish the fabrication limits and process window for precision micromilling of copper microstructures and provide mechanistic insight into microscale material removal behavior relevant to MEMS device manufacturing. [2026-0034]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"915-922"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097729","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Wafer-Scale Self-Aligned Bilayer Hole Mold Fabrication and Pattern Replication via Nanoimprint Lithography","authors":"Yichi Zhang;Changliang Li;Ou Zhang;Yiming Liu;Xiang Gao;Feng Luo","doi":"10.1109/JMEMS.2026.3711122","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3711122","url":null,"abstract":"We present a wafer-scale fabrication strategy for three-dimensional (3D) bilayer high–aspect-ratio patterns based on nanoimprint lithography (NIL). The process integrates laser direct-writing grayscale lithography for precise definition of bilayer profiles, followed by two sequential cycles of pattern transfer into a chromium (Cr) hard mask and deep reactive ion etching (DRIE), thereby forming self-aligned 3D patterns on silicon. A flexible polydimethylsiloxane (PDMS) mold replicated from the etched silicon mold enables high-fidelity duplication of the 3D features through ultraviolet nanoimprint lithography (UV-NIL). This approach offers outstanding design flexibility and precise morphological control. Combining process stability, structural precision, and versatility, this approach establishes a reliable route for nanoimprint fabrication of multilayer high–aspect-ratio 3D structures. [2026-0038]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"849-854"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097089","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Interfacial Electrical and Microstructural Characterization of a Conductive Polysilicon Direct Bonding for MEMS Wafer-Level Packaging","authors":"Vincent Pares;Amrid Amnache;Khaled Belarbi;Simon Landry;Jose Francisco Ambia Campos;Romain Stricher;Nadi Braidy;Serge Ecoffey;Luc G. Fréchette","doi":"10.1109/JMEMS.2026.3708781","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3708781","url":null,"abstract":"Conductive direct bonding can simplify MEMS wafer level integration by creating electrical connections directly at the bonding plane, without adding dedicated metallization schemes or feedthrough modules. It also preserves a higher post bonding thermal budget, which is beneficial for devices requiring high temperatures steps such as resonator and piezoelectric film optimization. Achieving electrical conduction is difficult with hydrophilic direct bonding because the interfacial oxide is electrically insulating. In contrast, hydrophobic direct bonding can avoid forming a continuous oxide and enable direct Si-Si conduction paths, but is more challenging and requires tighter control of surface state and bonding conditions. This work electrically and structurally characterizes in situ doped polysilicon (ISDP) hydrophobic bonding interface. Dedicated electrical test structures show ohmic behavior with contact resistivities as low as <inline-formula> <tex-math>$rho _{c} = 4~Omega $ </tex-math></inline-formula>. <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>m² across multiple ISDP film variant (different thicknesses, with or without prebonding anneal). TEM reveals locally reconstructed regions where the interface behaves as a grain boundary and is fully closed. Across all ISDP thicknesses and thermal histories, the interfaces exhibit contact resistivities compatible with conductive wafer-level packaging, offering design flexibility for MEMS requiring an all-silicon solution.[2026-0053]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"1007-1018"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"Novel cmWave A1-Mode Filter Design Based on Lithium Niobate On-Chip Capacitors","authors":"Fuhong Lin;Kai Yang;Yiming Wang;Juan Wang;Zhongbin Dai;Jiming Fang;Jie Chen;Anping Zhang;Jialin Long;Chengjie Zuo","doi":"10.1109/JMEMS.2026.3710591","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3710591","url":null,"abstract":"In this work, a novel design scheme of on-chip frequency shifting is proposed and applied to acoustic resonators for the first time. On the same chip with first-order antisymmetric mode (A1-mode) resonators on 128° Y-cut lithium niobate (LiNbO₃ or LN) thin film, LN based capacitors are proposed and realized by rotating the in-plane periodic direction of interdigitated transducer (IDT) electrodes to align the electric field direction at 90° relative to the +X axis. In a ladder-type topology, the series branch achieves an upward shift of the series resonant frequency by connecting an A1-mode resonator in series with an on-chip LN capacitor, while the shunt branch realizes a downward shift of the parallel resonant frequency by connecting an A1-mode resonator in parallel with a capacitor or rotating the IDT electrodes to a specific angle. By aligning these two frequencies through careful design, an acoustic filter is successfully implemented. Compared to traditional A1-mode filters, which rely on differentially localized etching to achieve frequency shifts in the series branch, the proposed novel design scheme reduces at least one photolithography and etching step, thereby greatly lowering process complexity and improving yield. Through this approach, this work demonstrates a high frequency (in the centimeter-wave or cmWave band) filter operating at 14.3 GHz with an insertion loss (<italic>IL</i>) of 3.6 dB, a bandwidth of 961 MHz (<italic>FBW</i> of 6.7%), and an out-of-band rejection (<italic>OoB</i>) of 14 dB. This proves the validity of the pure layout-design based frequency shifting mechanism and enables the Lamb wave resonator technology with better manufacturability for 6G cmWave wireless communications.[2026-0082]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"842-848"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097384","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

{"title":"A Thermal Convection Tilt Sensor With Synergistic Thermal Control and Adaptive Filtering for Long-Term Drift Suppression","authors":"Tingfeng Peng;Mengqi Zheng;Yixuan Zhang;Yuan Wang;Michael Kraft;Huahuang Luo","doi":"10.1109/JMEMS.2026.3723938","DOIUrl":"https://doi.org/10.1109/JMEMS.2026.3723938","url":null,"abstract":"This paper presents a thermal convection tilt sensor with synergistic thermal control and adaptive filtering for long-term drift suppression. Experimental investigations reveal that the baseline drift of the sensor primarily originates from the instability of the internally generated thermal convection field. To address this limitation, a closed-loop temperature control (CTC) circuit is developed to actively regulate the microheater through continuous negative feedback, stabilizing the thermal excitation source and reducing the temperature-induced drift by approximately 90%. Based on this source-level stabilization, a three-mode adaptive fusion filter is proposed to further suppress residual ultra-low-frequency baseline wander and high-frequency noise, achieving an additional 70% reduction in fluctuation amplitude while preserving the dynamic step response. Together, the two complementary mechanisms establish a unified stabilization framework across both physical and signal domains, which achieves a minimum detectable angle (MDA) of 0.0698° and an output standard deviation of 0.601 mV. Allan deviation analysis further confirms the substantial improvements in long-term stability, with the acceleration random walk (ARW) reduced to <inline-formula> <tex-math>$2.399times 10 ^{-7circ }$ </tex-math></inline-formula>/<inline-formula> <tex-math>$surd $ </tex-math></inline-formula>Hz and the bias instability (BI) reduced to <inline-formula> <tex-math>$5.317times 10 ^{mathrm {-9}circ }$ </tex-math></inline-formula>. These results demonstrate that the proposed dual-stage stabilization framework provides an effective solution for achieving highly stable thermal convection tilt sensing in precision measurement applications.[2026-0102]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"35 5","pages":"974-982"},"PeriodicalIF":3.5,"publicationDate":"2026-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"149097623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}