Compact Multi-Point Quantum Magnetometer With a Molded Foaming 3D MEMS Vapor Cell for Magnetic Localization

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Jianfeng Zhang;Jintang Shang
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引用次数: 0

Abstract

Currently, medical magnetic localization necessitates complex and costly gradient coil systems, primarily due to the limited sensitivity of the magnetic sensors in use. This article presents a highly sensitive, compact multipoint quantum magnetometer (CMQM) characterized by a straightforward design and low cost. The core of the sensor is a MEMS 3D Rubidium (Rb) atomic cell with an optical path of 3.0 cm, which is manufactured through a mold foaming process. The size of the compact sensor head is less than 11.5 cm3. The CMQM obtains magnetic field magnitude at six points by measuring Larmor frequency of rubidium atoms within corresponding positions. A uniform magnetic field coils is calibrated with the CMQM within a ferromagnetic shield. The vector synthesis method is used to enhance the accuracy by reducing interference from remanent magnetic field. The deviation between the measured magnetic field and those predicted using closed cylinder approximation (CCA) is less than 1.1%. The magnetic noise density at different points varies between 2.289 pT/Hz1/2 and 6.015 pT/Hz1/2. The effective magnetic resolution of the CMQM is ~0.65 nT. Theoretical spatial resolution of the CMQM can reach to $17.5~\mu $ m with a simple circular coil. [2024-0230]
紧凑型多点量子磁力计与模制发泡3D MEMS蒸汽电池磁定位
目前,医疗磁定位需要复杂和昂贵的梯度线圈系统,主要是由于使用的磁传感器的灵敏度有限。本文介绍了一种设计简单、成本低、灵敏度高、结构紧凑的多点量子磁强计。该传感器的核心是一个MEMS 3D铷(Rb)原子电池,光程为3.0 cm,通过模具发泡工艺制造。紧凑型传感器头的尺寸小于11.5 cm3。CMQM通过测量铷原子在相应位置的拉莫尔频率,得到6点处的磁场大小。在铁磁屏蔽内,用CMQM对均匀磁场线圈进行校准。采用矢量合成方法,通过减小残余磁场的干扰来提高精度。实测磁场与封闭圆柱近似(CCA)预测磁场的偏差小于1.1%。各测点磁噪声密度在2.289 pT/Hz1/2 ~ 6.015 pT/Hz1/2之间变化。CMQM的有效磁分辨率为~0.65 nT,理论空间分辨率可达17.5~\mu $ m。(2024 - 0230)
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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