Journal of Microelectromechanical Systems最新文献_第2页

TechRxiv: Share Your Preprint Research With the World! techxiv：与世界分享你的预印本研究！

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-12-03 DOI: 10.1109/JMEMS.2024.3496173

引用次数: 0

A Novel Inline Near-Zero Thermopile RF MEMS Power Sensor

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-28 DOI: 10.1109/JMEMS.2024.3501477

Zhiqiang Zhang;Runqi Gu;Zijie Yuan;Yuhao Xie;Tao Jiang;Feilong Lei;Chengxi Sun;Jianqiu Huang

{"title":"A Novel Inline Near-Zero Thermopile RF MEMS Power Sensor","authors":"Zhiqiang Zhang;Runqi Gu;Zijie Yuan;Yuhao Xie;Tao Jiang;Feilong Lei;Chengxi Sun;Jianqiu Huang","doi":"10.1109/JMEMS.2024.3501477","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3501477","url":null,"abstract":"This paper presents a novel single-chip integrated inline thermoelectric MEMS sensor for measuring the forward and reverse RF power. The sensor operates on the principle of RF power-heat-electricity. It utilizes all-passive structures for near-zero power consumption, with a wide bandwidth (22-30 GHz), high power detection capability (600 mW) and small chip size (<inline-formula> <tex-math>$1640times 910~mu $ </tex-math></inline-formula>m2). A MEMS coupling structure with suspended beams is designed to be broadband and miniaturized, while two MEMS sensing structures with optimized thermopiles are designed for high sensitivity and high power detection. This MEMS sensor is fabricated using the GaAs monolithic microwave integrated circuit (MMIC) process. Experiments show a reflection loss of less than −10.40 dB, and an insertion loss of better than −1.55 dB. Linearity of 98.8% is obtained. At 26, 27 and 28 GHz, measured sensitivities are about 4.10, 4.57 and 4.61 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>V/mW for the forward detection, and 0.32, 0.83 and 1.10 <inline-formula> <tex-math>$mu $ </tex-math></inline-formula>V/mW for the reverse detection, respectively. The ratios of these sensitivities produce a maximum at the center frequency of interest. [2024-0095]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"59-64"},"PeriodicalIF":2.5,"publicationDate":"2024-11-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107181","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Characterization of a Multi-Channel CMUT Gas Sensor

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-27 DOI: 10.1109/JMEMS.2024.3495539

Charles Boutonnet;Anurupa Shaw;Jean-Claude Bastien;François Blard;Adrien Vialletelle;Vincent Pinon;Christophe Le Blanc;Cyril Herrier;Thierry Livache;Bruno Fain

{"title":"Characterization of a Multi-Channel CMUT Gas Sensor","authors":"Charles Boutonnet;Anurupa Shaw;Jean-Claude Bastien;François Blard;Adrien Vialletelle;Vincent Pinon;Christophe Le Blanc;Cyril Herrier;Thierry Livache;Bruno Fain","doi":"10.1109/JMEMS.2024.3495539","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3495539","url":null,"abstract":"We report the design, the fabrication and the test of a multi-channel gas sensor based on Capacitive Micro-machined Ultrasonic Transducers (CMUT) functionalized with peptides as sensing material, dedicated to volatile organic compound (VOC) measurements in ambient air. The design, the fabrication and the electrical test of the CMUT device is reported, achieving a mass sensitivity per unit area of <inline-formula> <tex-math>$mathrm {5.9~Hz/(ag/{mu }m^{2})}$ </tex-math></inline-formula>. The corresponding electronics, ensuring self-sustained oscillations of the loops, is described. Experimental characterization of the loops using a Vector Network Analyser (VNA) and associated simulations using Eldo software highlight how the Barkhausen criteria are fulfilled. A gas flow setup is used to expose the sensors to different gases. The three channels of the device reveal different sensitivities to gas, ranging from <inline-formula> <tex-math>$mathrm {0.13~Hz/ppmv}$ </tex-math></inline-formula> to <inline-formula> <tex-math>$mathrm {0.41~Hz/ppmv}$ </tex-math></inline-formula> for nonane. This is attributed to different surface affinities towards nonane, confirming the potential of CMUT devices for electronic noses. [2024-0089]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"4-14"},"PeriodicalIF":2.5,"publicationDate":"2024-11-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106767","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Laser-Induced Forward Transfer of SU-8 Microdisks as Carriers of Metallic Microdevices

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-08 DOI: 10.1109/JMEMS.2024.3487248

Zhiwei Yang;Giovanni Boero;Remo Widmer;Johann Michler;Renato Pero;Juergen Brugger

{"title":"Laser-Induced Forward Transfer of SU-8 Microdisks as Carriers of Metallic Microdevices","authors":"Zhiwei Yang;Giovanni Boero;Remo Widmer;Johann Michler;Renato Pero;Juergen Brugger","doi":"10.1109/JMEMS.2024.3487248","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3487248","url":null,"abstract":"Laser-induced forward transfer (LIFT) is a digital additive manufacturing technique that uses a pulsed laser to transfer various materials from a donor film to a receiver substrate placed in close proximity. In this work, we investigate the transfer of SU-8 microdisks on which metallic microdevices have been patterned. These components are directly fabricated on the donor substrate and their performance was evaluated after the transfer by LIFT. The influence of laser fluence, SU-8 thickness and donor-to-receiver gap on the SU-8 microdisk transfer was investigated. Successful and damage-free transfer of SU-8 microdisks can be achieved with optimized parameter combinations. The adhesion between the transferred SU-8 microdisks and different receivers was also assessed. These tests indicate that the adhesion without additional glue between SU-8 and the receiver is adequate for standard applications. The assembly of SU-8 microdisks to form multi-layer structures was also demonstrated. Large-scale transfer of a <inline-formula> <tex-math>$40times 40$ </tex-math></inline-formula> SU-8 microdisk array within 20 minutes was achieved to assess the transfer scalability of the LIFT process. As an application example, we transferred a temperature sensor onto a receiver with pre-patterned contact electrodes and characterized its performance. Our work opens a route to directly manufacturing wafer-scale microdevices on the donor substrate and enables the heterogeneous integration of such devices onto numerous functional surfaces with deterministic distribution and scale.[2024-0134]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"32-42"},"PeriodicalIF":2.5,"publicationDate":"2024-11-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10747758","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-05 DOI: 10.1109/JMEMS.2024.3485876

Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu

{"title":"System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application","authors":"Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu","doi":"10.1109/JMEMS.2024.3485876","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3485876","url":null,"abstract":"The on-chip micro supercapacitor (MSC), renowned for its exceptional capacitance and power density, holds great potential in compactifying micro systems by replacing bulky dielectric capacitors. However, traditional electrochemical materials and fabrication methods of MSC are incompatible with standard IC processes, posing a significant obstacle to its widespread application. In this paper, we report a novel strategy for fabricating an IC-compatible MSC with ultrahigh capacitance density on wafer-level. Specifically, we design a mesoporous Cu@CuxO material for MSC electrode, in which Cu is a common IC interconnection material with low cost and high conductivity, while CuxO covers Cu to provide large electrochemical capacity. This material is prepared by using standard co-sputtering, selective etching and in-situ oxidation processes sequentially. Subsequently, it is employed to construct high aspect ratio interdigital electrode (nearly <inline-formula> <tex-math>$20~mu $ </tex-math></inline-formula>m thickness) using developed ultra-thick peeling off technology. As a result, the MSC exhibits a superior capacitance density of 35.58 mF/cm2, surpassing commercial dielectric capacitors by 2 orders of magnitude. Furthermore, we propose a unique MSC packaging method based on 3D printing, which includes specially designed microchannels for liquid electrolyte injection and microgrooves for IC chip integration. This packaging method facilitates the integration of MSC with a power management integrated chip (PMIC), forming a System-in-Packaged (SiP) power module. This module, with dimensions of only <inline-formula> <tex-math>$3.2times 2.7times 1$ </tex-math></inline-formula> mm3, successfully manages the output of a triboelectric nanogenerator, demonstrating its practical application and vast potential.[2024-0073]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"24-31"},"PeriodicalIF":2.5,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-31 DOI: 10.1109/JMEMS.2024.3484226

Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel

{"title":"Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection","authors":"Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel","doi":"10.1109/JMEMS.2024.3484226","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3484226","url":null,"abstract":"This paper details the design, fabrication, and characterization of a novel disposable MEMS airflow sensor, employing Bare Conductive electric paint deposited on Whatman 3MM chromatography paper through silk screen printing. The sensor achieves rapid fabrication within 30 minutes. It demonstrates a sensitivity of 1.8 kPa−1, a resolution of 27.6 kPa, and a limit of detection (LoD) of 48.94 kPa, with an operational pressure range from 27.6 to 137.9 kPa. An electronic readout circuit transduces electrical resistance variations into voltage signals, which are monitored via a digital multimeter and analyzed on a PC. The sensor’s disposable nature mitigates nosocomial infection risks and enhances hygiene, making it ideal for monitoring respiratory conditions such as asthma and COPD. With a material cost of under <inline-formula> <tex-math>${$}0.1$ </tex-math></inline-formula>, the sensor is highly suitable for scalable, cost-sensitive biomedical applications. Experimental validation confirms the reliability and precision of this proof-of-concept device in airflow measurement. [2024-0148]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"100-107"},"PeriodicalIF":2.5,"publicationDate":"2024-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fused Silica Micro Shell Resonators by a Wafer-Level Thermal Reflow Process

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3478842

Zhaoxi Su;Bin Luo;Linqian Zhu;Zelin Xu;Haoyang Li;Jintang Shang

引用次数: 0

Lateral Glow Discharge Ion Source for the Integrated MEMS Quadrupole Mass Spectrometer

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3477620

Piotr Szyszka

引用次数: 0

Whisker Sensor With Extended Measurement Range Through Jamming Effects Using 3D-Printed Tetrapod Particles 须传感器与扩展的测量范围通过干扰效应使用3d打印四足粒子

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI: 10.1109/JMEMS.2024.3474010

Woojun Jung;Seonghyeon Lee;Deyi Zheng;Muhammad Hilal;Yongha Hwang

{"title":"Whisker Sensor With Extended Measurement Range Through Jamming Effects Using 3D-Printed Tetrapod Particles","authors":"Woojun Jung;Seonghyeon Lee;Deyi Zheng;Muhammad Hilal;Yongha Hwang","doi":"10.1109/JMEMS.2024.3474010","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3474010","url":null,"abstract":"Whisker sensors, typically fabricated by casting soft polymers, have a measurement range determined by the mechanical properties of the soft polymer used, specifically, its Young’s modulus. Traditional whisker sensors have fixed stiffness after fabrication, which limits their measurement range. However, this study introduced a sensor that integrates a jamming actuator with a whisker sensor, allowing for adjustable stiffness. This adjustment not only enables high sensitivity within a specific measurement range but also expands the measurable range. Moreover, to enhance the jamming effect, tetrapod-shaped particles, which exhibit the highest friction, were fabricated using 3D printing, significantly improving the measurement range. Additionally, four channels were strategically placed at the shell edges, within which materials with Young’s moduli higher than that of polydimethylsiloxane (PDMS) could be filled, allowing for an adjustable overall stiffness. When no vacuum pressure was applied, the whisker sensor filled with tetrapod particles was able to measure forces with a sensitivity of approximately 93 mm/N in the range of 0–70 mN. When a vacuum pressure of –50 kPa was applied, the sensor could measure forces with a sensitivity of around 82 mm/N in the range of 70–140 mN. Under a vacuum pressure of –100 kPa, the sensor could measure forces with a sensitivity of approximately 65 mm/N in the range of 140–220 mN. This innovation enables the selective expansion of the sensitivity and measurement range, which were previously difficult to achieve, showcasing new possibilities for jamming actuators and their potential use in exploration environments requiring a wide measurement range.[2024-0099]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"758-766"},"PeriodicalIF":2.5,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A 0.017 ∘/h Rate-Integrating Micro-Shell Resonator Gyroscope Using Virtual Rotation Modulation 0.017°/h虚旋转调制积分速率微壳谐振陀螺仪

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI: 10.1109/JMEMS.2024.3474054

Sheng Yu;Jiangkun Sun;Yongmeng Zhang;Kun Lu;Yan Shi;Xuezhong Wu;Dingbang Xiao

引用次数: 0