{"title":"A Novel All-Fused Silica MEMS Gyroscope With an Aspect Ratio Exceeding 50:1","authors":"Maobo Wang;Qingsong Li;Kai Wu;Xinyu Wang;Zhanqiang Hou;Yan Shi;Xuezhong Wu;Dingbang Xiao","doi":"10.1109/JMEMS.2025.3589803","DOIUrl":null,"url":null,"abstract":"Fused silica, renowned for its excellent mechanical properties and thermal stability, has emerged as an ideal material for microelectromechanical system (MEMS) gyroscopes. However, the planar microfabrication of fused silica remains a widely recognized challenge that has long hindered the advancement of related devices. In this study, we present a novel planar processing technique for fused silica MEMS gyroscopes based on laser-induced assisted etching (LIAE). Using this method, we successfully fabricated a vibrating ring gyroscope (VRG) structure with an aspect ratio exceeding 50:1. Characterization results show that the device exhibits a resonant frequency of approximately 15.9 kHz and achieves a quality factor exceeding 200,000 under a vacuum condition of 0.1 Pa, indicating exceptional resonant performance. This technique enables the realization of high-performance fused silica MEMS gyroscopes and provides a promising fabrication pathway for other MEMS devices requiring ultra-high aspect ratio structures. [2025-0101]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 5","pages":"516-518"},"PeriodicalIF":3.1000,"publicationDate":"2025-07-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Microelectromechanical Systems","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11096123/","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
Fused silica, renowned for its excellent mechanical properties and thermal stability, has emerged as an ideal material for microelectromechanical system (MEMS) gyroscopes. However, the planar microfabrication of fused silica remains a widely recognized challenge that has long hindered the advancement of related devices. In this study, we present a novel planar processing technique for fused silica MEMS gyroscopes based on laser-induced assisted etching (LIAE). Using this method, we successfully fabricated a vibrating ring gyroscope (VRG) structure with an aspect ratio exceeding 50:1. Characterization results show that the device exhibits a resonant frequency of approximately 15.9 kHz and achieves a quality factor exceeding 200,000 under a vacuum condition of 0.1 Pa, indicating exceptional resonant performance. This technique enables the realization of high-performance fused silica MEMS gyroscopes and provides a promising fabrication pathway for other MEMS devices requiring ultra-high aspect ratio structures. [2025-0101]
期刊介绍:
The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.