A Novel All-Fused Silica MEMS Gyroscope With an Aspect Ratio Exceeding 50:1

IF 3.1 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Maobo Wang;Qingsong Li;Kai Wu;Xinyu Wang;Zhanqiang Hou;Yan Shi;Xuezhong Wu;Dingbang Xiao
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引用次数: 0

Abstract

Fused silica, renowned for its excellent mechanical properties and thermal stability, has emerged as an ideal material for microelectromechanical system (MEMS) gyroscopes. However, the planar microfabrication of fused silica remains a widely recognized challenge that has long hindered the advancement of related devices. In this study, we present a novel planar processing technique for fused silica MEMS gyroscopes based on laser-induced assisted etching (LIAE). Using this method, we successfully fabricated a vibrating ring gyroscope (VRG) structure with an aspect ratio exceeding 50:1. Characterization results show that the device exhibits a resonant frequency of approximately 15.9 kHz and achieves a quality factor exceeding 200,000 under a vacuum condition of 0.1 Pa, indicating exceptional resonant performance. This technique enables the realization of high-performance fused silica MEMS gyroscopes and provides a promising fabrication pathway for other MEMS devices requiring ultra-high aspect ratio structures. [2025-0101]
一种长宽比超过50:1的新型全熔硅MEMS陀螺仪
熔融二氧化硅以其优异的机械性能和热稳定性而闻名,已成为微机电系统(MEMS)陀螺仪的理想材料。然而,熔融二氧化硅的平面微加工仍然是一个公认的挑战,长期以来一直阻碍着相关器件的发展。在这项研究中,我们提出了一种基于激光诱导辅助蚀刻(LIAE)的熔融二氧化硅MEMS陀螺仪的新型平面加工技术。利用这种方法,我们成功地制造了一个纵横比超过50:1的振动环陀螺仪(VRG)结构。表征结果表明,该器件在0.1 Pa的真空条件下,谐振频率约为15.9 kHz,品质因子超过20万,具有优异的谐振性能。该技术使高性能熔融硅MEMS陀螺仪得以实现,并为其他需要超高纵横比结构的MEMS器件提供了一条有前途的制造途径。(2025 - 0101)
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来源期刊
Journal of Microelectromechanical Systems
Journal of Microelectromechanical Systems 工程技术-工程:电子与电气
CiteScore
6.20
自引率
7.40%
发文量
115
审稿时长
7.5 months
期刊介绍: The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.
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