A Hybrid MEMS Microphone Combining Piezoelectric and Capacitive Transduction Mechanisms

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2025-03-31 DOI:10.1109/JMEMS.2025.3548927

Yangyang Guan;Sina Sadeghpour;Chen Wang;Hemin Zhang;Sanjog Vilas Joshi;Milad Shojaeian;Xinyu Wu;Ruochen Ding;Christ Glorieux;Michael Kraft

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引用次数: 0

Abstract

This work describes a hybrid micro-electro-mechanical-systems (MEMS) microphone based on combined piezoelectric and capacitive transduction mechanisms to enhance the sensitivity. The fabrication process for the proposed hybrid MEMS microphone is presented. A lumped element model of the prototype is derived and employed for device design. The microphone is fabricated on a silicon-on-insulator (SOI) wafer. Piezoelectric transduction is realized by a piezoelectric diaphragm consisting of a stack of Si/SiO2/Pt/PZT/Pt layers. Capacitive transduction is realized by a variable capacitor composed of a silicon device layer and a silicon handle layer. The measured sensitivities of the piezoelectric and capacitive parts of the hybrid MEMS microphone are −51.18 dB (re: 1 V/Pa) and −57.59 dB at 1 kHz, respectively. The signal-to-noise ratios (SNR) of the piezoelectric and capacitive parts of the microphone are 49.21 dB (re: 1 V/Pa) and 60.71 dB at 1 kHz, respectively. By combining dual output signals from piezoelectric and capacitive transduction mechanisms, the measured sensitivities and SNR are −47.63 dB (re: 1 V/Pa) and 52.57 dB at 1 kHz, respectively. The experimental results demonstrate that the sensitivity of the hybrid transduction microphone is improved by 3.55 dB and 9.96 dB compared to individual piezoelectric and capacitive transduction modes, respectively.[2024-0218]

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一种结合压电和电容转导机制的混合式MEMS传声器

本文介绍了一种基于压电和电容组合转导机制的混合微机电系统（MEMS）传声器，以提高灵敏度。介绍了混合MEMS传声器的制作工艺。推导了原型的集总元模型，并将其用于器件设计。该麦克风是在绝缘体上硅（SOI）晶圆上制造的。压电转导是通过由Si/SiO2/Pt/PZT/Pt层堆叠而成的压电膜片实现的。电容转导是由硅器件层和硅手柄层组成的可变电容器实现的。该混合式MEMS传声器的压电和电容部分在1khz时的测量灵敏度分别为- 51.18 dB （re: 1 V/Pa）和- 57.59 dB。麦克风的压电和电容部分的信噪比（SNR）在1 kHz时分别为49.21 dB （re: 1 V/Pa）和60.71 dB。通过结合压电和电容转导机制的双输出信号，在1 kHz时测得的灵敏度和信噪比分别为- 47.63 dB （re: 1 V/Pa）和52.57 dB。实验结果表明，与单独的压电和电容转导模式相比，混合转导传声器的灵敏度分别提高了3.55 dB和9.96 dB。[2024-0218]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.