A Novel Three-State RF MEMS Switch Based on Origami Structure

IF 2.5 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2025-04-04 DOI:10.1109/JMEMS.2025.3553118

Lei Han;Yutang Pan;Saisai Liu;Chuyuan Gao;Lifan Cheng

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引用次数: 0

Abstract

In this paper, we report a novel three-state Radio Frequency Microelectromechanical Systems (RF MEMS) switch, which is based on origami structure for large tunable capability. Combined with the origami structure, the switch can achieve the deep-on state by raising the height of the origami beam. This switch has been designed and fabricated successfully with the silicon process. Experimental results show that the origami beam can be raised to

$76~\mu $

m at the deep-on state with an amplification factor of 12.6 compared to the on state. In the frequency range of 10-30 GHz, when the switch is at the on state, the insertion loss is better than −0.4 dB and the return loss is better than -18dB. At the deep-on state, the return loss achieves −31dB with the improvement of 13 dB. At the off state, the isolation of the switch is better than −20 dB. As a result, the presented switch based on origami structure can be a promising choice for low loss, high isolation, and large tunable range applications.[2024-0221]

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一种基于折纸结构的三态射频MEMS开关

本文报道了一种新颖的三态射频微机电系统（RF MEMS）开关，该开关基于折纸结构，具有较大的可调能力。结合折纸结构，开关可以通过提高折纸梁的高度来实现深插状态。该开关已成功地采用硅工艺设计和制造。实验结果表明，在深开状态下，折纸光束可以提高到$76~\mu $ m，比打开状态放大了12.6倍。在10-30 GHz频率范围内，开关处于导通状态时，插入损耗优于−0.4 dB，回波损耗优于-18dB。在深开状态下，回波损耗达到- 31dB，提高了13db。关断时，开关隔离度优于−20db。因此，所提出的基于折纸结构的开关可以成为低损耗、高隔离和大可调范围应用的有前途的选择。[2024-0221]

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.