Journal of Microelectromechanical Systems最新文献_第4页

System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-11-05 DOI: 10.1109/JMEMS.2024.3485876

Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu

{"title":"System Packaged Cu@CuxO Micro Supercapacitor With Large Capacity for Ultra-Compact Power Module Application","authors":"Jianyou Dai;Jiyong Zhou;Zhanpeng Shi;Zhangshanhao Li;Minghao Xu;Siyao Jiang;Dongping Zheng;Lei Shan;Xiaohong Wang;Sixing Xu","doi":"10.1109/JMEMS.2024.3485876","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3485876","url":null,"abstract":"The on-chip micro supercapacitor (MSC), renowned for its exceptional capacitance and power density, holds great potential in compactifying micro systems by replacing bulky dielectric capacitors. However, traditional electrochemical materials and fabrication methods of MSC are incompatible with standard IC processes, posing a significant obstacle to its widespread application. In this paper, we report a novel strategy for fabricating an IC-compatible MSC with ultrahigh capacitance density on wafer-level. Specifically, we design a mesoporous Cu@CuxO material for MSC electrode, in which Cu is a common IC interconnection material with low cost and high conductivity, while CuxO covers Cu to provide large electrochemical capacity. This material is prepared by using standard co-sputtering, selective etching and in-situ oxidation processes sequentially. Subsequently, it is employed to construct high aspect ratio interdigital electrode (nearly <inline-formula> <tex-math>$20~mu $ </tex-math></inline-formula>m thickness) using developed ultra-thick peeling off technology. As a result, the MSC exhibits a superior capacitance density of 35.58 mF/cm2, surpassing commercial dielectric capacitors by 2 orders of magnitude. Furthermore, we propose a unique MSC packaging method based on 3D printing, which includes specially designed microchannels for liquid electrolyte injection and microgrooves for IC chip integration. This packaging method facilitates the integration of MSC with a power management integrated chip (PMIC), forming a System-in-Packaged (SiP) power module. This module, with dimensions of only <inline-formula> <tex-math>$3.2times 2.7times 1$ </tex-math></inline-formula> mm3, successfully manages the output of a triboelectric nanogenerator, demonstrating its practical application and vast potential.[2024-0073]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"24-31"},"PeriodicalIF":2.5,"publicationDate":"2024-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143106765","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-31 DOI: 10.1109/JMEMS.2024.3484226

Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel

{"title":"Disposable Piezoresistive MEMS Airflow Sensor for Chronic Respiratory Disease Detection","authors":"Beril Aygül;Sena Ulgaz;Berkay Yılmaz;Ömer Gökalp Akcan;Kuter Erdil;Yiğit Dağhan Gökdel","doi":"10.1109/JMEMS.2024.3484226","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3484226","url":null,"abstract":"This paper details the design, fabrication, and characterization of a novel disposable MEMS airflow sensor, employing Bare Conductive electric paint deposited on Whatman 3MM chromatography paper through silk screen printing. The sensor achieves rapid fabrication within 30 minutes. It demonstrates a sensitivity of 1.8 kPa−1, a resolution of 27.6 kPa, and a limit of detection (LoD) of 48.94 kPa, with an operational pressure range from 27.6 to 137.9 kPa. An electronic readout circuit transduces electrical resistance variations into voltage signals, which are monitored via a digital multimeter and analyzed on a PC. The sensor’s disposable nature mitigates nosocomial infection risks and enhances hygiene, making it ideal for monitoring respiratory conditions such as asthma and COPD. With a material cost of under <inline-formula> <tex-math>${$}0.1$ </tex-math></inline-formula>, the sensor is highly suitable for scalable, cost-sensitive biomedical applications. Experimental validation confirms the reliability and precision of this proof-of-concept device in airflow measurement. [2024-0148]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"34 1","pages":"100-107"},"PeriodicalIF":2.5,"publicationDate":"2024-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"143107139","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Fused Silica Micro Shell Resonators by a Wafer-Level Thermal Reflow Process

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3478842

Zhaoxi Su;Bin Luo;Linqian Zhu;Zelin Xu;Haoyang Li;Jintang Shang

引用次数: 0

Lateral Glow Discharge Ion Source for the Integrated MEMS Quadrupole Mass Spectrometer

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-22 DOI: 10.1109/JMEMS.2024.3477620

Piotr Szyszka

引用次数: 0

Whisker Sensor With Extended Measurement Range Through Jamming Effects Using 3D-Printed Tetrapod Particles 须传感器与扩展的测量范围通过干扰效应使用3d打印四足粒子

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI: 10.1109/JMEMS.2024.3474010

Woojun Jung;Seonghyeon Lee;Deyi Zheng;Muhammad Hilal;Yongha Hwang

{"title":"Whisker Sensor With Extended Measurement Range Through Jamming Effects Using 3D-Printed Tetrapod Particles","authors":"Woojun Jung;Seonghyeon Lee;Deyi Zheng;Muhammad Hilal;Yongha Hwang","doi":"10.1109/JMEMS.2024.3474010","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3474010","url":null,"abstract":"Whisker sensors, typically fabricated by casting soft polymers, have a measurement range determined by the mechanical properties of the soft polymer used, specifically, its Young’s modulus. Traditional whisker sensors have fixed stiffness after fabrication, which limits their measurement range. However, this study introduced a sensor that integrates a jamming actuator with a whisker sensor, allowing for adjustable stiffness. This adjustment not only enables high sensitivity within a specific measurement range but also expands the measurable range. Moreover, to enhance the jamming effect, tetrapod-shaped particles, which exhibit the highest friction, were fabricated using 3D printing, significantly improving the measurement range. Additionally, four channels were strategically placed at the shell edges, within which materials with Young’s moduli higher than that of polydimethylsiloxane (PDMS) could be filled, allowing for an adjustable overall stiffness. When no vacuum pressure was applied, the whisker sensor filled with tetrapod particles was able to measure forces with a sensitivity of approximately 93 mm/N in the range of 0–70 mN. When a vacuum pressure of –50 kPa was applied, the sensor could measure forces with a sensitivity of around 82 mm/N in the range of 70–140 mN. Under a vacuum pressure of –100 kPa, the sensor could measure forces with a sensitivity of approximately 65 mm/N in the range of 140–220 mN. This innovation enables the selective expansion of the sensitivity and measurement range, which were previously difficult to achieve, showcasing new possibilities for jamming actuators and their potential use in exploration environments requiring a wide measurement range.[2024-0099]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"758-766"},"PeriodicalIF":2.5,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761466","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

A 0.017 ∘/h Rate-Integrating Micro-Shell Resonator Gyroscope Using Virtual Rotation Modulation 0.017°/h虚旋转调制积分速率微壳谐振陀螺仪

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI: 10.1109/JMEMS.2024.3474054

Sheng Yu;Jiangkun Sun;Yongmeng Zhang;Kun Lu;Yan Shi;Xuezhong Wu;Dingbang Xiao

引用次数: 0

Toward 120 dB CMOS-MEMS Arrayed Accelerometers Measuring Through kg Shock Events 120 dB CMOS-MEMS阵列加速度计测量千克冲击事件的研究

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-16 DOI: 10.1109/JMEMS.2024.3463406

Vincent P. J. Chung;Xiaoliang Li;Metin G. Guney;Jeyanandh Paramesh;Tamal Mukherjee;Gary K. Fedder

{"title":"Toward 120 dB CMOS-MEMS Arrayed Accelerometers Measuring Through kg Shock Events","authors":"Vincent P. J. Chung;Xiaoliang Li;Metin G. Guney;Jeyanandh Paramesh;Tamal Mukherjee;Gary K. Fedder","doi":"10.1109/JMEMS.2024.3463406","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3463406","url":null,"abstract":"This paper reports on the development of a monolithic capacitive accelerometer array system that has a designed full-scale range of \u0000<inline-formula> <tex-math>$pm 5~{mathrm {text {k}{g} }}$ </tex-math></inline-formula>\u0000, a bandwidth larger than \u0000<inline-formula> <tex-math>$10~{mathrm {text {k}text {Hz} }}$ </tex-math></inline-formula>\u0000, with a minimum resolution of \u0000<inline-formula> <tex-math>$mathrm {5~text {m}{g} }$ </tex-math></inline-formula>\u0000 and a minimum bias instability of \u0000<inline-formula> <tex-math>$mathrm {700~mu {g} }$ </tex-math></inline-formula>\u0000. The resolution and full-scale range of the accelerometers correspond to a dynamic range of 120 dB that is on par with state-of-the-art low-\u0000<inline-formula> <tex-math>$mathrm {{g} }$ </tex-math></inline-formula>\u0000 accelerometers. High bandwidth and \u0000<inline-formula> <tex-math>$mathrm {text {k}{g} }$ </tex-math></inline-formula>\u0000 detectability are achieved by the nano-gram proof mass and relatively stiff folded-flexure transducer design. High dynamic range with \u0000<inline-formula> <tex-math>$mathrm {text {k}{g} }$ </tex-math></inline-formula>\u0000 input range is enabled by the hourglass-beam, interdigitated tapered comb-finger electrodes, and arrayed accelerometers. The accelerometer array design provides a potential path towards an emerging navigation through high-shock application.[2024-0091]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"685-696"},"PeriodicalIF":2.5,"publicationDate":"2024-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761482","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Polycrystalline LPCVD 3C-SiC Thin Films on SiO₂ Using Alternating Supply Deposition 用交变电源沉积法在sio2上制备多晶LPCVD 3C-SiC薄膜

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-15 DOI: 10.1109/JMEMS.2024.3472286

Philipp Moll;Georg Pfusterschmied;Sabine Schwarz;Werner Artner;Ulrich Schmid

{"title":"Polycrystalline LPCVD 3C-SiC Thin Films on SiO₂ Using Alternating Supply Deposition","authors":"Philipp Moll;Georg Pfusterschmied;Sabine Schwarz;Werner Artner;Ulrich Schmid","doi":"10.1109/JMEMS.2024.3472286","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3472286","url":null,"abstract":"In this paper, we demonstrate the deposition of 3C-SiC thin films on SiO2 using the alternating supply deposition (ASD) technique in a low-pressure chemical vapor deposition (LPCVD) furnace. We provide data of the thin film properties showing strong dependencies on the process gas flow rates of silane, propane and hydrogen. For comparative reasons all gas flow compositions were performed on <100> silicon and SiO2. A decreased rate of growth per cycle of ~37 % was discovered on SiO2. X-ray photoelectron spectroscopy (XPS) depth profiling revealed an oxygen content of 7.5 % ±2.5 % throughout the entire thin film when grown on SiO2. High resolution transmission electron microscopy (HRTEM) showed a 15 nm amorphous carbon layer at the 3C-SiC/Si interface. Conversely, on SiO2 a 10 nm graphite layer was determined as intermediate layer leading to prominent \u0000<inline-formula> <tex-math>$lt 111gt 3$ </tex-math></inline-formula>\u0000C-SiC X-ray diffraction (XRD) peaks. Independent of the substrate type a similar microstructure is observed in cross-sectional analyses. Atomic force microscopy (AFM) surface roughness measurements showed for all SiO2 thin films lower values with a minimum of 4.9 nm (RMS), compared to 7 nm on Si. The electrical film resistivity was determined on SiO2 with CTLM analysis, depending on the process gas composition. The gained knowledge is beneficial for MEMS applications, where tailored 3C-SiC-on-SiO2 structures are desired.[2024-0114]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"767-775"},"PeriodicalIF":2.5,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10718720","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

18 GHz Solidly Mounted Resonator in Scandium Aluminum Nitride on SiO₂/Ta₂O₅ Bragg Reflector 18 GHz固体安装在SiO₂/Ta₂O₅Bragg反射器上的氮化钪铝谐振器

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-15 DOI: 10.1109/JMEMS.2024.3472615

Omar Barrera;Nishanth Ravi;Kapil Saha;Supratik Dasgupta;Joshua Campbell;Jack Kramer;Eugene Kwon;Tzu-Hsuan Hsu;Sinwoo Cho;Ian Anderson;Pietro Simeoni;Jue Hou;Matteo Rinaldi;Mark S. Goorsky;Ruochen Lu

{"title":"18 GHz Solidly Mounted Resonator in Scandium Aluminum Nitride on SiO₂/Ta₂O₅ Bragg Reflector","authors":"Omar Barrera;Nishanth Ravi;Kapil Saha;Supratik Dasgupta;Joshua Campbell;Jack Kramer;Eugene Kwon;Tzu-Hsuan Hsu;Sinwoo Cho;Ian Anderson;Pietro Simeoni;Jue Hou;Matteo Rinaldi;Mark S. Goorsky;Ruochen Lu","doi":"10.1109/JMEMS.2024.3472615","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3472615","url":null,"abstract":"This work reports an acoustic solidly mounted resonator (SMR) at 18.64 GHz, among the highest operating frequencies reported. The device is built in scandium aluminum nitride (ScAlN) on top of silicon dioxide (SiO2) and tantalum pentoxide (Ta2O5) Bragg reflectors on silicon (Si) wafer. The stack is analyzed with X-ray reflectivity (XRR) and high-resolution X-ray diffraction (HRXRD). The resonator shows a coupling coefficient (\u0000<inline-formula> <tex-math>$k^{2}$ </tex-math></inline-formula>\u0000) of 2.0%, high series quality factor (\u0000<inline-formula> <tex-math>$Q_{s}$ </tex-math></inline-formula>\u0000) of 156, shunt quality factor (\u0000<inline-formula> <tex-math>$Q_{p}$ </tex-math></inline-formula>\u0000) of 142, and maximum Bode quality factor (\u0000<inline-formula> <tex-math>$Q_{max}$ </tex-math></inline-formula>\u0000) of 210. The third-order harmonics at 59.64 GHz is also observed with \u0000<inline-formula> <tex-math>$k^{2}$ </tex-math></inline-formula>\u0000 around 0.6% and Q around 40. Upon further development, the reported acoustic resonator platform can enable various front-end signal-processing functions, e.g., filters and oscillators, at future frequency range 3 (FR3) bands.[2024-0120]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"711-716"},"PeriodicalIF":2.5,"publicationDate":"2024-10-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761483","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Etching Evolutions and Surface Morphologies of Sapphire Hemispheres Under Different Etchant Concentration Conditions 不同蚀刻剂浓度条件下蓝宝石半球的蚀刻演化与表面形貌

IF 2.5 3区工程技术

Journal of Microelectromechanical Systems Pub Date : 2024-10-11 DOI: 10.1109/JMEMS.2024.3469192

Guorong Wu;Xiaokang Chen

{"title":"Etching Evolutions and Surface Morphologies of Sapphire Hemispheres Under Different Etchant Concentration Conditions","authors":"Guorong Wu;Xiaokang Chen","doi":"10.1109/JMEMS.2024.3469192","DOIUrl":"https://doi.org/10.1109/JMEMS.2024.3469192","url":null,"abstract":"In this paper, the etching evolution law and surface morphology characteristics of sapphire hemispheres under different etchant concentration conditions are analyzed comprehensively in the light of the atomic structure and etching rates of sapphire. Firstly, etching rate distributions of the sapphire hemispheres at various concentration conditions (volume ratios of H2SO4 and H3PO4 are 1/1, 3/1 and 6/1) with the C-plane as the rotation center is obtained through etching experiments of sapphire hemispherical specimens, and etching evolutions of hemispheres are simulated and analyzed by applying the Level-Set method. It helps to design the etching time of the hemisphere reasonably. Then, the influence of etchant concentrations on the etching of hemispheres is analyzed on the basis of the characteristics of the etching rate distributions under different concentration conditions. Finally, the formation and the characteristic variability of hemispherical etching morphologies at various concentration conditions are analyzed in the light of the etching rates of planes and their atomic structures. It helps to improve the etching process of sapphire and the processing quality of etched structures of sapphire.[2024-0139]","PeriodicalId":16621,"journal":{"name":"Journal of Microelectromechanical Systems","volume":"33 6","pages":"785-792"},"PeriodicalIF":2.5,"publicationDate":"2024-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142761484","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0