Phononic Integrated Circuit Component Design and Analysis for Surface Acoustic Waves in ScAlN on Silicon Carbide

IF 3.1 3区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC

Journal of Microelectromechanical Systems Pub Date : 2025-04-28 DOI:10.1109/JMEMS.2025.3560854

Jack Guida;Siddhartha Ghosh

引用次数: 0

Abstract

This work presents a two-fold study on the numerical modeling and experimental demonstration of phononic components using surface acoustic waves (SAWs) in 30% scandium aluminum nitride (ScAlN) thin films on silicon carbide (SiC). Compact phononic integrated circuits (PnICs) enabled by focusing interdigitated transducers (FIDTs) in slow-on-fast piezoelectric platforms offer a promising approach for signal processing by exploiting acoustic wave manipulation. Key working principles, including acoustic waveguiding with three-dimensional confinement, bending, splitting, and coupling, are demonstrated to advance the development of PnICs, facilitating the creation of compact, efficient devices for signal processing applications. [2024-0205]

查看原文本刊更多论文

碳化硅ScAlN表面声波声子集成电路元件设计与分析

本研究提出了在碳化硅（SiC）上的30%氮化钪（ScAlN）薄膜中使用表面声波（saw）的声子成分的数值模拟和实验证明的双重研究。紧凑的声子集成电路（PnICs）通过聚焦交叉换能器（fidt）在慢速快压电平台上实现，为利用声波操纵进行信号处理提供了一种很有前途的方法。关键的工作原理，包括三维约束、弯曲、分裂和耦合的声波波导，被证明可以促进pnic的发展，促进创建紧凑、高效的信号处理应用设备。(2024 - 0205)

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Journal of Microelectromechanical Systems 工程技术-工程：电子与电气

CiteScore

6.20

自引率

7.40%

发文量

115

审稿时长

7.5 months

期刊介绍： The topics of interest include, but are not limited to: devices ranging in size from microns to millimeters, IC-compatible fabrication techniques, other fabrication techniques, measurement of micro phenomena, theoretical results, new materials and designs, micro actuators, micro robots, micro batteries, bearings, wear, reliability, electrical interconnections, micro telemanipulation, and standards appropriate to MEMS. Application examples and application oriented devices in fluidics, optics, bio-medical engineering, etc., are also of central interest.