Shita Guo, Tianzuo Xi, P. Gui, Jing Zhang, W. Choi, K. O. Kenneth, Yanli Fan, Daquan Huang, R. Gu, Mark Morgan
{"title":"54 GHz CMOS LNAs with 3.6 dB NF and 28.2 dB gain using transformer feedback Gm-boosting technique","authors":"Shita Guo, Tianzuo Xi, P. Gui, Jing Zhang, W. Choi, K. O. Kenneth, Yanli Fan, Daquan Huang, R. Gu, Mark Morgan","doi":"10.1109/ASSCC.2014.7008891","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008891","url":null,"abstract":"This paper presents a novel topology of low-noise amplifier (LNA) with noise reduction and gain improvement. A transformer feedback gm-boosting technique is proposed in a single-ended cascode LNA to reduce the noise figure (NF) and improve the gain simultaneously. Two 54 GHz single-ended cascode LNAs, with transformer and transmission-line for matching, respectively, are demonstrated to verify this technique. Fabricated in a 65 nm CMOS process, the transformer-based (TF-based) LNA exhibits a minimum noise figure (NF) of 3.6 dB at 53.5 GHz and a highest power gain of 28.2 dB at 54 GHz in measurement. To our best knowledge, this LNA has the best noise figure and power gain among all the published V-band CMOS LNAs. The transmission-line-based (TL-based) LNA exhibits a minimum noise figure of 3.8 dB at 53.9 GHz and a highest power gain of 25.4 dB at 54.2 GHz in measurement. Both the LNAs consume 18 mA from a power supply of 1.1 V.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115555586","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A. Athmanathan, M. Stanisavljevic, Junho Cheon, Seokjoon Kang, Changyong Ahn, Junghyuk Yoon, Min-Chul Shin, Taekseung Kim, N. Papandreou, H. Pozidis, E. Eleftheriou
{"title":"A 6-bit drift-resilient readout scheme for multi-level Phase-Change Memory","authors":"A. Athmanathan, M. Stanisavljevic, Junho Cheon, Seokjoon Kang, Changyong Ahn, Junghyuk Yoon, Min-Chul Shin, Taekseung Kim, N. Papandreou, H. Pozidis, E. Eleftheriou","doi":"10.1109/ASSCC.2014.7008879","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008879","url":null,"abstract":"Multiple-Level Cell (MLC) storage provides increased capacity and hence reduced cost-per-bit in memory technologies, thereby rendering such technologies suitable for big data applications. In Phase-Change Memory (PCM), however, MLC storage is seriously hampered by the phenomenon of resistance drift. We present a readout circuit for PCM specifically designed for drift resilience in MLC operation. Drift resilience is achieved through the use of specific non-resistance-based cell-state metrics which, in contrast to the traditional cell-state metric, i.e., the low-field electrical resistance, have built-in drift robustness. The circuit provides a fast and efficient implementation of drift-resilient metric, enabling, for the first time, the performance required by non volatile memory applications. In addition, by exploiting the non linear sub-threshold I-V characteristics of PCM cells, the readout architecture promises to increase the distinguishable signal range. The proposed read circuitry is designed and fabricated in 64-nm CMOS technology. Experimental results using an integrated test resistor array for readout circuit characterization are presented, demonstrating access time of 450 ns at 6-bit raw (5-bit effective) resolution. The circuit has low-noise characteristics and does not exhibit sensitivity to bit-line parasitics. The readout circuit is co-integrated with a 16 Mb 2x-nm PCM cell array and the necessary programming electronics.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"136 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124281593","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Semiconductor innovation into the next decade","authors":"Jack Sun","doi":"10.1109/ASSCC.2014.7008874","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008874","url":null,"abstract":"Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122643716","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Seong-Ho Lee, D. Tran, Tamer A. Ali, B. Çatli, Heng Zhang, Wei Zhang, Mohammed M. Abdul-Latif, Z. Huang, Guansheng Li, Mahmoud Reza Ahmadi, A. Momtaz
{"title":"A 23mW/lane 1.2–6.8Gb/s multi-standard transceiver in 28nm CMOS","authors":"Seong-Ho Lee, D. Tran, Tamer A. Ali, B. Çatli, Heng Zhang, Wei Zhang, Mohammed M. Abdul-Latif, Z. Huang, Guansheng Li, Mahmoud Reza Ahmadi, A. Momtaz","doi":"10.1109/ASSCC.2014.7008871","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008871","url":null,"abstract":"This paper describes the design of a low power multi-standard transceiver in 28nm CMOS technology. Using novel circuit techniques and implementation features, the transceiver can operate at data rates of 1.2-6.8Gb/s while supporting a wide range of communication standards, including SGMII, QSGMII, PCIE, SATA, USB3, XAUI and RXAUI. Power consumption per lane is 23mW at 0.9V for SATA3 at 6Gb/s, with an area of 0.265mm2 for a single-lane transceiver with PLL.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128923164","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A 1.44mm2 4-channel UWB beamforming receiver with Q-compensation in 65nm CMOS","authors":"Lei Wang, Y. Lian, C. Heng","doi":"10.1109/ASSCC.2014.7008908","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008908","url":null,"abstract":"A compact 4-channel UWB beamforming receiver is proposed by employing low-Q LC delay with Q-compensation technique. The delay chain achieves 224 ps delay range with 7 ps delay resolution. It occupies area of 1.44 mm2, which is 7 times smaller than other UWB beamformer with LC delay. To compensate the losses generated by low Q inductors and minimize the power consumption, current reuse LNA and buffers are adopted. The receiver covers scanning angle of ±48o with spatial resolution of 4o under antenna spacing of 3 cm while consuming 288 mW.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121604764","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A sub-threshold to super-threshold Level Conversion Flip Flop for sub/near-threshold dual-supply operation","authors":"","doi":"10.1109/ASSCC.2014.7008855","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008855","url":null,"abstract":"This paper presents a novel Current-Mirror (CM) based Master-Slave Level Conversion Flip Flop (MS-LCFF) to perform data latching and level shifting from sub-threshold voltage, to near-threshold voltage, and up to super-threshold voltage. The CM-based MS-LCFF enables energy-efficient ultra-low-voltage operation by applying dual-supply and multi-supply designs into sub/near-threshold regions. Simulation results show that with a 0.18-μm technology the proposed LCFF is able to conduct data latching and level shifting from 0.3 V to 0.5 V, and up to 1.8 V, with performance improved by 8×, power consumption decreased by 3×, and silicon area reduced by 13.3% over the conventional method, when performing conversion from 0.3 V to 0.5 V. The measurement results of applying the proposed LCFF-based dual-supply operation to a sub-threshold FIR filter operating at 300 kHz demonstrate that a 21.8% power reduction can be achieved without performance loss by dual-supply operation at 0.3V and 0.5V, compared to the single-supply operation at 0.5V.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"26 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126353041","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Xiaobao Yu, Meng Wei, Yun Yin, Ying Song, Siyang Han, Qiongbing Liu, Zongming Jin, Xiliang Liu, Zhihua Wang, B. Chi
{"title":"A fully-integrated reconfigurable dual-band transceiver for short range wireless communication in 180nm CMOS","authors":"Xiaobao Yu, Meng Wei, Yun Yin, Ying Song, Siyang Han, Qiongbing Liu, Zongming Jin, Xiliang Liu, Zhihua Wang, B. Chi","doi":"10.1109/ASSCC.2014.7008909","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008909","url":null,"abstract":"A fully-integrated reconfigurable dual-band transceiver (TRX) is presented for short range wireless communication. The TRX has two independent RF front-ends for each band with a shared analog baseband to achieve optimum power and cost. In Sub-GHz (760-960MHz) band, the maximum 75dBc 3rd harmonic rejection ratio (HRR) is achieved by inserting a RFA with notch filtering. In 2.4GHz band, a single-ended-to-differential (S2D) RFA with phase and gain error compensation is proposed. By optimizing two bands separately, the RX achieves a NF of 5.1dB and 4.2dB, respectively. A Σ-Δ fractional-N PLL with two switchable Class-C VCOs is employed to provide the LOs. Moreover, the multi-mode CMOS PAs are integrated, which achieve the measured output P1dB (OP1dB) of 16.3dBm and 14.8dBm with 25% PAE for Sub-GHz and 2.4GHz bands. Furthermore, to optimize the PA's back-off efficiency, the power-control loop is proposed to detect the input signal PAPR in real time and flexibly reconfigure the PA's operation modes. With this proposed technique, the PAE in Sub-GHz band is improved by ×3.24 and ×1.41 at 9dB and 3dB back-off powers. In 2.4GHz band, the PAE is improved by ×2.17 at 6dB back-off power. The measured results have demonstrated that this presented transceiver has achieved comparable or even better performance in terms of noise, HRR, OP1dB and power efficiency compared with the-state-of-the-arts.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"27 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125797742","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Guan-Sing Chen, Chin-Yang Wu, Chen-Lun Lin, Hao-Wei Hung, Jri Lee
{"title":"Fully-integrated 40-Gb/s pulse pattern generator and bit-error-rate tester chipsets in 65-nm CMOS technology","authors":"Guan-Sing Chen, Chin-Yang Wu, Chen-Lun Lin, Hao-Wei Hung, Jri Lee","doi":"10.1109/ASSCC.2014.7008872","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008872","url":null,"abstract":"Fully-integrated 40-Gb/s pulse pattern generator (PPG) and bit-error-rate tester (BERT) chipsets has been presented in 65-nm CMOS technology. Using external clock inputs, the PPG and BERT achieve full operation with ultra-wide data range from 40 Mb/s to 40 Gb/s. Built-in PLL and CDR circuits are also included to provide robustness for standard specification testing.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127365064","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yi Zhang, Chia-Hung Chen, Tao He, Xin Meng, N. Qian, E. Liu, Phillip Elliott, G. Temes
{"title":"A 1 V 59 fJ/Step 15 MHz BW 74 dB SNDR continuous-time ΔΣ modulator with digital ELD compensation and multi-bit FIR feedback","authors":"Yi Zhang, Chia-Hung Chen, Tao He, Xin Meng, N. Qian, E. Liu, Phillip Elliott, G. Temes","doi":"10.1109/ASSCC.2014.7008925","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008925","url":null,"abstract":"A 3rd-order continuous-time ΔΣ modulator with a highly-digital excess loop delay compensation and multi-bit FIR feedback, to be used in an ultrasound beamformer, is presented. A digitally controlled reference switching matrix avoids the power-hungry adder, and allows a power-efficient design of the loop filter. A 2-bit 3-tap FIR feedback DAC optimally achieves lower sensitivity to clock jitter and applies reduced error signal to the loop filter, thus enhancing the loop filter linearity. The modulator operates at 1.2 GHz, and achieves 79.4 dB dynamic range, 77.3 dB SNR and 74.3 dB SNDR over a 15 MHz signal bandwidth. Fabricated in a 65 nm CMOS process, the core modulator occupies 0.16 mm2 and dissipates 6.96mW from a 1 V supply. A 58.6 fJ/conversion-step figure of merit is achieved.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130976228","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A 20MS/s buck/boost supply modulator for envelope tracking applications with direct digital interface","authors":"Shang-Hsien Yang, Chinder Wey, Ke-Horng Chen, Ying-Hsi Lin, Jing-Jia Chen, Tsung-Yen Tsai, Chao-Cheng Lee","doi":"10.1109/ASSCC.2014.7008863","DOIUrl":"https://doi.org/10.1109/ASSCC.2014.7008863","url":null,"abstract":"A buck/boost supply modulator (BBSM) is proposed for 4G LTE RF power amplifier (RF-PA) envelope tracking applications. The H-bridges used in non-inverting buck/boost converters are metamorphosed into the current sources and switches of a 4-bit current-steering DAC-like supply modulator. Fast tracking speed is achieved through its inherent open-loop topology, while the direct digital interface provides easy control and integration with digital LTE baseband SoCs. The proposed BBSM is capable of delivering peak power of 2.8W at 20MS/s, with a peak efficiency of 75 %.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132277966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}