{"title":"Semiconductor innovation into the next decade","authors":"Jack Sun","doi":"10.1109/ASSCC.2014.7008874","DOIUrl":null,"url":null,"abstract":"Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.","PeriodicalId":161031,"journal":{"name":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","volume":"119 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE Asian Solid-State Circuits Conference (A-SSCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2014.7008874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Semiconductor innovation through a new paradigm of 3D×3D System Scaling can carry the industry into the next decade. Besides the internet of things (IoT), cloud computing, and big data analytics, we can imagine a bionic age emerging with digitally-enhanced or semiconductor-augmented vision, hearing, limbs, and many other capabilities, such as cognitive computing, universal translators, and brain wave interfaces/communications. It is important to leverage the silicon platform and be part of a symbiotic ecosystem, such as TSMC's Grand Alliance and OIP platform, to enjoy the benefits of the economies of scale and collective innovation power.