发布求助
文献互助 智能选刊 最新文献

2023 IEEE International Memory Workshop (IMW)最新文献

筛选
英文 中文
In-memory neural network accelerator based on phase change memory (PCM) with one-selector/one-resistor (1S1R) structure operated in the subthreshold regime 基于一选择器/一电阻(1S1R)结构的相变存储器(PCM)内存神经网络加速器工作在亚阈值区域
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145949
N. Lepri, P. Gibertini, P. Mannocci, A. Pirovano, I. Tortorelli, P. Fantini, D. Ielmini
{"title":"In-memory neural network accelerator based on phase change memory (PCM) with one-selector/one-resistor (1S1R) structure operated in the subthreshold regime","authors":"N. Lepri, P. Gibertini, P. Mannocci, A. Pirovano, I. Tortorelli, P. Fantini, D. Ielmini","doi":"10.1109/IMW56887.2023.10145949","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145949","url":null,"abstract":"In-memory computing (IMC) shows a disruptive potential for accelerating artificial intelligence (AI) in both inference and training tasks. Scalable IMC, however, requires novel memory technologies with extremely low current. Here we demonstrate ultra-low current matrix-vector multiplication (MVM) in a crosspoint array of phase change memory (PCM) and ovonic threshold switch (OTS) with one-selector/one-resistor (181R) structure operated in the subthreshold regime. Thanks to highly-uniform sub-$mu$A currents, the 181R PCM crosspoint array rejects parasitic IR drop across wires, enabling excellent scaling compared to other memory devices. Our simulation of a fullyconnected neural network (FCNN) with ternary weights indicates an accuracy of 98% for MNIST classification with an array size of 512x512, which strongly supports subthreshold-operated 181R crosspoint arrays for neural network inference accelerators.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122350721","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Memory Window in Si:HfO2 FeRAM arrays: Performance Improvement and Extrapolation at Advanced Nodes Si:HfO2 FeRAM阵列中的内存窗口:高级节点的性能改进和外推
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145972
J. Laguerre, M. Bocquet, O. Billoint, S. Martin, J. Coignus, C. Carabasse, T. Magis, T. Dewolf, F. Andrieu, L. Grenouillet
{"title":"Memory Window in Si:HfO2 FeRAM arrays: Performance Improvement and Extrapolation at Advanced Nodes","authors":"J. Laguerre, M. Bocquet, O. Billoint, S. Martin, J. Coignus, C. Carabasse, T. Magis, T. Dewolf, F. Andrieu, L. Grenouillet","doi":"10.1109/IMW56887.2023.10145972","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145972","url":null,"abstract":"The Memory Window (MW) of BEOL-integrated Si:HfO2-based 16kbit ITIC FeRAM arrays is shown to be significantly improved (×3) by etching the ferroelectric (FE) film of the Ferroelectric CAPacitor (FeCAP). To estimate the MW evolution in larger arrays at advanced technology nodes, a Preisach current-based compact model is developed, calibrated on measured FeCAP electrical characteristics and validated at various operating voltages. Electrical simulations of an elementary ITIC 16kbit FeRAM array-like structure using Siemens Eldo show that scaling the transistor (1T) at advanced technology nodes can be beneficial for the MW. FE film thickness reduction below 10nm will also be requested for low voltage applications.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115233467","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Vertical Channel Transistor (VCT) as Access Transistor for Future 4F2 DRAM Architecture 垂直通道晶体管(VCT)作为未来4F2 DRAM架构的接入晶体管
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145977
Daohuan Feng, Yi Jiang, Yunsong Qiu, Yuhong Zheng, Harry Kim, Jaewoo Kim, Jian Chu, Guangsu Shao, Yucheng Liao, Cheng-Jer Yang, Minrui Hu, Wenli Zhao, Linjiang Xia, Jianfeng Xiao, Di Ma, Yuan Cheng, Xiangbo Kong, Chao Lin, Tianming Li, Yongjie Li, Jingheng Meng, K. Shao, Yan Wang, Xiaoan Yang, Xiang Liu, Qinghua Han, Huiming Li, Yanzhe Tang, Mingde Liu, Eric Wu, Xiaopeng Li, Renrui Huang, Mingtang Zhang, Long Hou, Xuan Pan, Xinwen Jin, Shuiping Zhao, D. Han, Ted C. Park, Deyuan Xiao, Chao Zhao, A. Yoo
{"title":"Vertical Channel Transistor (VCT) as Access Transistor for Future 4F2 DRAM Architecture","authors":"Daohuan Feng, Yi Jiang, Yunsong Qiu, Yuhong Zheng, Harry Kim, Jaewoo Kim, Jian Chu, Guangsu Shao, Yucheng Liao, Cheng-Jer Yang, Minrui Hu, Wenli Zhao, Linjiang Xia, Jianfeng Xiao, Di Ma, Yuan Cheng, Xiangbo Kong, Chao Lin, Tianming Li, Yongjie Li, Jingheng Meng, K. Shao, Yan Wang, Xiaoan Yang, Xiang Liu, Qinghua Han, Huiming Li, Yanzhe Tang, Mingde Liu, Eric Wu, Xiaopeng Li, Renrui Huang, Mingtang Zhang, Long Hou, Xuan Pan, Xinwen Jin, Shuiping Zhao, D. Han, Ted C. Park, Deyuan Xiao, Chao Zhao, A. Yoo","doi":"10.1109/IMW56887.2023.10145977","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145977","url":null,"abstract":"In this work, a novel 4F2 VCT (vertical channel transistor) targeting for next generation of DRAM is proposed. We approached process feasibility and device performance of $mathbf{4 F}^{2}$ VCT by TCAD simulation. Detailed processes such as BL (bit line) and WL (word line) loop have also been discussed to achieve lx node VCT DRAM. For the first time, silicon demonstration for $8mathrm{~Gb}$ full array VCT with density as high as $198 mathrm{Mbit}/mathrm{mm}^{2}$ is successfully realized. Besides, we also demonstrated standard switching behavior of VCT access transistor with reasonable device performance.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126637414","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Distributed Cycling in Charge Trap-Based 3D NAND Arrays: Model and Qualification Tests Implications 基于电荷阱的3D NAND阵列中的分布式循环:模型和资格测试含义
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145969
G. Nicosia, Niccolò Righetti, Yingda Dong
{"title":"Distributed Cycling in Charge Trap-Based 3D NAND Arrays: Model and Qualification Tests Implications","authors":"G. Nicosia, Niccolò Righetti, Yingda Dong","doi":"10.1109/IMW56887.2023.10145969","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145969","url":null,"abstract":"In this work, we present the first electrical characterization and modeling of the impact on long-term data retention of distributed cycling in charge trap (CT) 3D NAND arrays. Dependence on Program/Erase cycling conditions of trapassisted tunneling (TAT), charge detrapping, and lateral charge migration (LCM) are experimentally evaluated and modeled. It is demonstrated that post-cycling TAT degradation depends only on the overall cycling dose and not on cycling temperature nor on the delays in-between each Program/Erase operation. On the other hand, charge detrapping follows the same time and temperature dynamics as the ones observed in floating-gate NAND arrays. Finally, LCM is observed to improve with increasing cycling dose and cycling temperature but to be negligibly dependent on the cycling duration. Results are a cornerstone in designing accelerated cycling tests for CT 3D NAND arrays qualification.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"99 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128386746","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Effect of High-Temperature Bake on RTN Statistics in Floating Gate Flash Memory Arrays 高温烘烤对浮栅闪存阵列RTN统计的影响
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145950
V. Markov, G. Festes, L. Schneider, S. Lemke, S. Jourba, A. Kotov
{"title":"Effect of High-Temperature Bake on RTN Statistics in Floating Gate Flash Memory Arrays","authors":"V. Markov, G. Festes, L. Schneider, S. Lemke, S. Jourba, A. Kotov","doi":"10.1109/IMW56887.2023.10145950","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145950","url":null,"abstract":"The impact of high-temperature (HT) bake on random telegraph noise (RTN) statistics in floating gate (FG) flash memory arrays was studied. It was found that HT bake of the memory array set in erase state can effectively suppress RTN previously induced by HT bake of the memory array set in program state. Since program and erase states are characterized by negatively and positively charged FG respectively, the FG potential plays a crucial role in the direction of the RTN intensification or alleviation. The effect of HT bake on RTN was extensively analyzed as a function of the FG potential, bake temperature, and bake duration. By alternating HT bakes of the memory arrays in program and erase states, we observed a reversible switching of the RTN traps between active and inactive modes. This behavior suggests that the RTN traps in our biastemperature stress experiments were not newly generated but rather originated ones from the pre-existed defect precursors in FG oxide.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116634378","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Simulation Study of Scaling Capability toward 10nm for the 3D Stackable Gate-Controlled Thyristor (GCT) DRAM Device 三维可堆叠门控晶闸管(GCT) DRAM器件向10nm缩放能力的仿真研究
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145823
Wei-Chen Chen, H. Lue, T. Hsu, Keh-Chung Wang, Chih-Yuan Lu
{"title":"A Simulation Study of Scaling Capability toward 10nm for the 3D Stackable Gate-Controlled Thyristor (GCT) DRAM Device","authors":"Wei-Chen Chen, H. Lue, T. Hsu, Keh-Chung Wang, Chih-Yuan Lu","doi":"10.1109/IMW56887.2023.10145823","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145823","url":null,"abstract":"Planar 1T1C DRAM has encountered numerous challenges as it reaches beyond $1 mathrm{z}-mathrm{nm}$ node. The daunting task of manufacturing a low-leakage access transistor and high aspectratio capacitor necessitates a disruptive technology to continue the relentless scaling path similar to the migration of $2 D$ to $3 D$ NAND. In this work, we will touch up on the scaling difficulties associated with 2D 1T1C DRAM and then examine the possible options of 3D DRAM, including flipped 1T1C DRAM, 2T0C gain-cell DRAM, and 3D stackable gate-controlled-thyristor (GCT) DRAM. We will show that the capacitor-less GCT DRAM, which shares the architectural features of CMOS nanosheet and 3D NAND, possesses good potential of realizing a truly 3D stackable structure. Furthermore, the scaling capability toward $10 mathrm{~nm}$ of such GCT device is verified by TCAD simulation when the channel length and width are downscaled simultaneously. Meanwhile, the gate oxide thickness thinning is unnecessary because the thyristor operation principles are different from the MOSFET. The simulated $mathrm{Lch} / mathrm{Wch}=10 mathrm{~nm}$ GCT device can well preserve $gt 2 mathrm{~V}$ hysteresis memory window, large read current ON/OFF ratio of $gt 1 E 8$, and $110 mu mathrm{A}$ sensing current window, paving a way for aggressive $X / Y$ pitch scaling for the $3 D$ stackable DRAM device.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124791963","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array smt -回流免疫和sca弹性PUF在28nm RRAM器件阵列上的演示
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145993
V. Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, G. Piccolboni, A. Bricalli, A. Regev, G. Pares, L. Grenouillet, J. Nodin, M. Suri
{"title":"Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array","authors":"V. Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, G. Piccolboni, A. Bricalli, A. Regev, G. Pares, L. Grenouillet, J. Nodin, M. Suri","doi":"10.1109/IMW56887.2023.10145993","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145993","url":null,"abstract":"We demonstrate 16kB RRAM PUF (Physically Un-clonable Function) arrays with excellent immunity to hightemperature SMT (surface mount technology) -reflow process and resilience against modern Machine-Learning (ML) based sidechannel attacks (SCA). Robust PUF operation is experimentally demonstrated on two optimized 2T-2R CMOS-RRAM designs (28 nm and 130 nm). We exploit forming voltage variability coupled with a dedicated novel programming scheme to extract unique PUF signatures. Fabricated arrays exhibit excellent performance in terms of speed, data retention and memory window. Extracted PUF signatures satisfy NIST (800-90B) tests showing extremely narrow distribution for hamming weight across multiple dies. Resilience against modern ML-SCA is achieved by introducing a secondary low energy HRS (high-resistance state) programming step and RRAM device stack-engineering. Proposed work is one of the first demonstrations for SMT-reflow immunity in context of PUF designs highlighting the high tolerance of the PUF signature to temperatures as high as 200 °C.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125262810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Benefits of Design Assist Techniques on Performances and Reliability of a RRAM Macro 设计辅助技术对RRAM宏的性能和可靠性的好处
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145984
B. Giraud, S. Ricavy, Yasser Moursy, C. Laffond, I. Sever, V. Gherman, M. Pezzin, F. Lepin, M. Diallo, K. Zenati, S. Dumas, M. Vershkov, A. Bricalli, G. Piccolboni, J. Noël, A. Samir, G. Pillonnet, Y. Thonnart, G. Molas
{"title":"Benefits of Design Assist Techniques on Performances and Reliability of a RRAM Macro","authors":"B. Giraud, S. Ricavy, Yasser Moursy, C. Laffond, I. Sever, V. Gherman, M. Pezzin, F. Lepin, M. Diallo, K. Zenati, S. Dumas, M. Vershkov, A. Bricalli, G. Piccolboni, J. Noël, A. Samir, G. Pillonnet, Y. Thonnart, G. Molas","doi":"10.1109/IMW56887.2023.10145984","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145984","url":null,"abstract":"This paper presents different design assist techniques and demonstrates their impact on enhancing the intrinsic RRAM performance. We show that the read-beforewrite, current-limitation and write-termination techniques reduce by -47%, -56% and-13% the power consumption during the writing process, respectively. Combined with write verification and error correction code, the overall improvements are 87% in energy saving and -55% on access time. Based on representative RRAM macro (130nm CMOS), statistic (128kb) and endurance (1M cycles) characterizations, this works contributes to accelerate RRAM industrial adoption by highlighting the design-technology co-optimization contribution.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115898415","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Demonstration of multilevel multiply accumulate operations for AiMC using engineered a-IGZO transistors-based 2T1C gain cell arrays 使用基于工程a-IGZO晶体管的2T1C增益单元阵列演示AiMC的多级乘法累积操作
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145946
S. Subhechha, S. Cosemans, A. Belmonte, N. Rassoul, S. H. Sharifi, P. Debacker, D. Verkest, R. Delhougne, G. Kar
{"title":"Demonstration of multilevel multiply accumulate operations for AiMC using engineered a-IGZO transistors-based 2T1C gain cell arrays","authors":"S. Subhechha, S. Cosemans, A. Belmonte, N. Rassoul, S. H. Sharifi, P. Debacker, D. Verkest, R. Delhougne, G. Kar","doi":"10.1109/IMW56887.2023.10145946","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145946","url":null,"abstract":"We report on the first demonstration of multilevel multiply accumulation operations in 2TlC cell arrays based on amorphous IGZO TFTs for efficient analog in memory compute (AiMC) implementation. Device designs for the read and write transistors to meet the target specifications are discussed and implemented. Multilevel operations are realized thanks to the long retention time enabled by the ultra-low offcurrent (<1.5× 1$0^{-19}$A/$mu$m) of the a-IGZO TFTs.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"126 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115641695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enabling 3D NAND Trench Cells for Scaled Flash Memories 为缩放闪存启用3D NAND沟槽单元
2023 IEEE International Memory Workshop (IMW) Pub Date : 2023-05-01 DOI: 10.1109/IMW56887.2023.10145992
S. Rachidi, S. Ramesh, L. Breuil, Z. Tao, D. Verreck, G. Donadio, A. Arreghini, G. V. D. Bosch, M. Rosmeulen
{"title":"Enabling 3D NAND Trench Cells for Scaled Flash Memories","authors":"S. Rachidi, S. Ramesh, L. Breuil, Z. Tao, D. Verreck, G. Donadio, A. Arreghini, G. V. D. Bosch, M. Rosmeulen","doi":"10.1109/IMW56887.2023.10145992","DOIUrl":"https://doi.org/10.1109/IMW56887.2023.10145992","url":null,"abstract":"3D Trench cells with a vertical flat channel have been proposed to increase the cell density over 3D NAND gate-all-around (GAA). In this work, we investigate the device characteristics of Trench cells. In absence of curvature, Trench cells exhibit inferior program and erase in comparison to a GAA reference. However, the memory window of Trench cells is significantly improved with channel width scaling, gate stack engineering and metal gate integration. This study also provides a basis for design and fabrication of future ultradense 3D NAND memories based on the Trench architecture.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122611420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
首页 上一页 下一页 尾页
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
请完成安全验证×
相关产品
×
本文献相关产品
联系我们：info@booksci.cn Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术官方微信