smt -回流免疫和sca弹性PUF在28nm RRAM器件阵列上的演示

V. Parmar, Sandeep Kaur Kingra, Deepak Verma, Digamber Pandey, G. Piccolboni, A. Bricalli, A. Regev, G. Pares, L. Grenouillet, J. Nodin, M. Suri
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引用次数: 0

摘要

我们展示了16kB RRAM PUF(物理不可克隆功能)阵列,具有对高温SMT(表面贴装技术)回流过程的优异免疫能力和对现代机器学习(ML)的侧通道攻击(SCA)的弹性。在两种优化的2T-2R CMOS-RRAM设计(28 nm和130 nm)上实验证明了稳健的PUF操作。我们利用形成电压的可变性以及专用的新颖编程方案来提取独特的PUF签名。合成阵列在速度、数据保留和内存窗口方面表现出优异的性能。提取的PUF特征满足NIST (800-90B)测试,显示多个模具的汉明重量分布非常窄。通过引入次级低能量HRS(高阻状态)编程步骤和RRAM器件堆栈工程,实现了对现代ML-SCA的弹性。提出的工作是PUF设计背景下smt回流抗抗性的首批演示之一,突出了PUF特征对高达200°C温度的高耐受性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Demonstration of SMT-reflow Immune and SCA-resilient PUF on 28nm RRAM device array
We demonstrate 16kB RRAM PUF (Physically Un-clonable Function) arrays with excellent immunity to hightemperature SMT (surface mount technology) -reflow process and resilience against modern Machine-Learning (ML) based sidechannel attacks (SCA). Robust PUF operation is experimentally demonstrated on two optimized 2T-2R CMOS-RRAM designs (28 nm and 130 nm). We exploit forming voltage variability coupled with a dedicated novel programming scheme to extract unique PUF signatures. Fabricated arrays exhibit excellent performance in terms of speed, data retention and memory window. Extracted PUF signatures satisfy NIST (800-90B) tests showing extremely narrow distribution for hamming weight across multiple dies. Resilience against modern ML-SCA is achieved by introducing a secondary low energy HRS (high-resistance state) programming step and RRAM device stack-engineering. Proposed work is one of the first demonstrations for SMT-reflow immunity in context of PUF designs highlighting the high tolerance of the PUF signature to temperatures as high as 200 °C.
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