2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第6页

Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package 环氧成型胶的老化对塑料包装长期稳定性的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464615

Eric Nguegang, J. Franz, A. Kretschmann, H. Sandmaier

{"title":"Aging effects of Epoxy Moulding Compound on the long-term stability of plastic package","authors":"Eric Nguegang, J. Franz, A. Kretschmann, H. Sandmaier","doi":"10.1109/ESIME.2010.5464615","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464615","url":null,"abstract":"The typical approach to investigate the reliability of plastic packages is based on material characterizations. Thereby the material characterization is carried out using standard methods like Dynamic Mechanical Analysis (DMA) and Thermo-Mechanical Analysis (TMA). Based on these results the change of Epoxy Moulding Compounds (EMC) thermo-mechanical properties is used to predict long-term stress changes in the plastic package. Using this approach the effects of certain reactions, which occur when EMCs age in contact with other materials, are not considered in the prediction. In this work by using the bi-material specimens composed of EMC and copper, the way how these effects lead to a huge stress change in transfer moulded plastic packages is shown. EMC material has been characterized before and after thermal aging by means of DMA and TMA. The aging-induced warpage changes of the bimaterial specimens have been experimentally investigated. Using the warpage curves over temperatures, the impacts of these reaction effects on the second glass transition temperature of the aged EMC have been investigated. Since the investigated EMC shows two glass transition temperatures after thermal aging. The thermal storage of EMCs at certain high temperature leads to semi-carbonization of the EMC surfaces. The dependency of the thickness of the semi-carbonized layer on storage time has been carried out and the way how this layer impacts EMC warpage is shown. It has been shown, that not only the aged material properties but also the effects of these reactions must be taken into account during simulations to predict stress changes in plastic packages accurately.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123627150","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 14

Mechanical and thermal simulations of a microactuator for the Stimulation of the Perilymph 微致动器对近地轨道刺激的力学和热模拟

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464582

T. Creutzburg, H. Gatzen

引用次数: 2

Development of fast and easy methods for measuring the Young's modulus of molding compounds for IC packages 开发快速简便的测量IC封装成型化合物杨氏模量的方法

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464535

A. Ivankovic, K. Vanstreels, D. Vanderstraeten, G. Brizar, R. Gillon, E. Blansaer, B. Vandevelde

引用次数: 2

Vibration reliability of SMD Pb-free solder joints SMD无铅焊点的振动可靠性

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464536

M. Borras, R. Ratchev, O. Lanier, M. Guyenot, D. Coutellier

引用次数: 2

Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability SiP (System-in-a-Package) LGA (Land Grid Array)的热机械仿真:内部集成电路对二级焊点可靠性的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464579

A. Chaillot, C. Munier, O. Maire, M. Vigier, C. Chastanet

引用次数: 0

Control of a cantilever array by Periodic Networks of Resistances 基于周期电阻网络的悬臂阵列控制

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464558

H. Hui, Y. Yakoubi, M. Lenczner, N. Ratier

引用次数: 3

Local stress analysis in devices by FIB 用FIB分析装置局部应力

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464520

R. Kregting, S. Gielen, W. V. van Driel, P. Alkemade, H. Miro, J. Kamminga

引用次数: 1

Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders Norris-Landzberg方程的局限性及基于损伤累积的无铅焊料加速系数估算方法的应用

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464546

A. Syed

{"title":"Limitations of Norris-Landzberg equation and application of damage accumulation based methodology for estimating acceleration factors for Pb free solders","authors":"A. Syed","doi":"10.1109/ESIME.2010.5464546","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464546","url":null,"abstract":"With the increasing use of Pb free solder in Electronic assemblies the estimation of their reliability under field use conditions is becoming important. The acceleration factor for solder depends on delta T, dwell times, ramp rates, actual values of temperature extremes, and the type of package. During the last few years, a number of papers have been published to determine the acceleration factors using Norris-Landzberg equation by varying some of these parameters. However, no consistent Norris-Landzberg parameters have been found yet for SnAgCu solders. This paper seeks to relate the field life with accelerated life by using simulations and a damage accumulation methodology. It is shown that the damage accumulation process in solder joints is much more complex to be captured by a simplified equation, such as Norris-Landzberg equation. The data presented here also shows that the acceleration factors depend on the package type and basing reliability requirement on accelerated test conditions, e.g., 1000 cycles for −40 to 125°C, irrespective of package type might preclude a package for a certain application even though the package might pass field level reliability requirements.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131375548","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 25

Thermal modelling of the emerging multi-chip packages 新兴多芯片封装的热建模

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464514

E. Monier-Vinard, V. Bissuel, Paul Murphy, O. Daniel, J. Dufrenne

引用次数: 11

A linear analysis to overcome the numerical Cherenkov instability 克服数值切伦科夫不稳定性的线性分析

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464616

F. Assous, J. Segré

引用次数: 0