Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability

Abstract

System-in-a-Package (SiP) aims to integrate a functional sub-system with one or more semiconductor chips along with passive components onto a substrate. SiP is transferred molded to the OEM for second level assembly using industry standards and high volume equipment. In most recent applications (high I/O density, improved electrical performance), LGA (Land Grid Array) is a very practical solution for the 2nd solder joint level. LGA packages reduce integrated circuit mounted height by eliminating the solder balls that are used for mounting BGA (Ball Grid Array) packages to system circuit boards. Instead, LGA packages are reflow-mounted using solder that has been applied to the board.