2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献

Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation LED模组热扩散效应的分析与有限元模拟及红外热成像验证

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464567

A. Corfa, A. Gasse, S. Bernabé, H. Ribot

{"title":"Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation","authors":"A. Corfa, A. Gasse, S. Bernabé, H. Ribot","doi":"10.1109/ESIME.2010.5464567","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464567","url":null,"abstract":"Thermal management is a key issue in LED packaging. To keep the LED junction temperature as low as possible, one has to address the spreading effect from a localised heat source into a bigger substrate as it is the case in the Chip On Board configuration (COB). We performed a benchmark of the existing analytical models for the spreading effect and derived a new model that allows a better prediction of the thermal resistance in such LED COB modules. This new analytical model, implemented in a Scilab application, was first assessed in different cases with the Finite Element Method (FEM) software Ansys®. Besides, IR thermography was performed on different kind of modules allowing a direct comparison with the analytical and FEM predictions. In addition to correctly fit the the predictions, IR thermography measurements enabled to give rise to the important thermal effect of the die attach material used to bond the LED to the substrate. We demonstrated that AuSn solder exhibit higher performances than other low melting point solders and Ag-based adhesive.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115613876","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Thermo-mechanical analysis of flexible and stretchable systems 柔性和可拉伸系统的热力学分析

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464566

Mario Gonzalez, B. Vandevelde, W. Christiaens, Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis, P. Timmermans

{"title":"Thermo-mechanical analysis of flexible and stretchable systems","authors":"Mario Gonzalez, B. Vandevelde, W. Christiaens, Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis, P. Timmermans","doi":"10.1109/ESIME.2010.5464566","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464566","url":null,"abstract":"This paper presents a summary of the modeling and technology developed for flexible and stretchable electronics. The integration of ultra thin dies at package level, with thickness in the range of 20 to 30 ¿m, into flexible and/or stretchable materials are demonstrated as well as the design and reliability test of stretchable metal interconnections at board level are analyzed by both experiments and finite element modeling. These technologies can achieve mechanically bendable and stretchable subsystems. The base substrate used for the fabrication of flexible circuits is a uniform polyimide layer, while silicones materials are preferred for the stretchable circuits. The method developed for chip embedding and interconnections is named Ultra Thin Chip Package (UTCP). Extensions of this technology can be achieved by stacking and embedding thin dies in polyimide, providing large benefits in electrical performance and still allowing some mechanical flexibility. These flexible circuits can be converted into stretchable circuits by replacing the relatively rigid polyimide by a soft and elastic silicone material. We have shown through finite element modeling and experimental validation that an appropriate thermo mechanical design is necessary to achieve mechanically reliable circuits and thermally optimized packages.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117134631","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 7

CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure 用于电子设备外壳湿度管理的逻辑控制局部 PCB 加热器的 CFD 辅助设计评估和实验验证

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464561

I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner

{"title":"CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure","authors":"I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner","doi":"10.1109/ESIME.2010.5464561","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464561","url":null,"abstract":"Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126114194","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 4

BGA lifetime prediction in JEDEC drop tests accounting for copper trace routing effects JEDEC跌落试验中考虑铜迹路由效应的BGA寿命预测

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464560

F. Kraemer, S. Wiese, S. Rzepka, J. Lienig

引用次数: 8

Modeling the effects of the PCB motion on the response of microstructures under mechanical shock 模拟PCB运动对机械冲击下微结构响应的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464602

A. Ramini, M. Younis, R. Miles

{"title":"Modeling the effects of the PCB motion on the response of microstructures under mechanical shock","authors":"A. Ramini, M. Younis, R. Miles","doi":"10.1109/ESIME.2010.5464602","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464602","url":null,"abstract":"Microelectomechanical systems (MEMS) are often used in portable electronic products that can be subjected to mechanical shock or impact due to being dropped accidentally. This work presents a modeling and simulation effort to investigate the effect of the vibration of a printed circuit board (PCB) on the dynamics of MEMS microstructures when subjected to shock. Two models are presented. In the first approach, the PCB is modeled as an Euler-Bernoulli beam to which a lumped model of a MEMS device is attached. In the second approach, a special case of a cantilever microbeam is modeled as a distributed-parameter system, which is attached to the PCB. These lumped-distributed and distributed-distributed models are solved numerically by integration of the equation of motion over time using the Galerkin procedure. Results of the two models are compared against each other for the case of a cantilever microbeam and also compared to the predictions of a finite-element model using ANSYS. The influence of the higher order vibration modes of the PCB, the location of the MEMS device on the PCB, the electrostatic forces, damping, and shock pulse duration are presented. It is found that neglecting the effects of the higher order modes of the PCB and the location of the MEMS device can cause incorrect predictions of the response of the microstructure and may lead to failure of the MEMS device. It is observed from the results that in some cases, depending on the different parameters of the problem, the response of the microstructure can be amplified causing early dynamic pull-in and hence possibly failure of the device.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122062920","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Electro-thermal investigations on silicon inverters operating at low frequency 低频硅逆变器的电热特性研究

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464511

J. Antonios, N. Ginot, C. Batard, Y. Scudeller, M. Machmoum

引用次数: 5

Virtual prototyping of PoP interconnections regarding electrically activated mechanisms 关于电激活机制的PoP互连的虚拟原型

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464618

L. Meinshausen, K. Weide-Zaage, H. Frémont, W. Feng

引用次数: 8

New methodology on electro-thermal characterization and modeling of large power drivers using lateral PNP BJTs 采用横向PNP BJTs的大功率驱动器电热表征和建模新方法

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464596

J. Rhayem, A. Vrbický, R. Blečić, P. Malena, S. Bychikhin, D. Pogany, A. Wieers, A. Barić, M. Tack

引用次数: 5

Thermo-mechanical challenges in the longevity of micro-electronics 微电子产品寿命中的热机械挑战

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464507

A. Gielen

引用次数: 0

Multiple Environment Overstress Testing and modelling of solar cells 太阳能电池的多环境超应力测试与建模

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464524

E. Veninga, A. Gielen

引用次数: 0