用于电子设备外壳湿度管理的逻辑控制局部 PCB 加热器的 CFD 辅助设计评估和实验验证

I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner
{"title":"用于电子设备外壳湿度管理的逻辑控制局部 PCB 加热器的 CFD 辅助设计评估和实验验证","authors":"I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner","doi":"10.1109/ESIME.2010.5464561","DOIUrl":null,"url":null,"abstract":"Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"106 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure\",\"authors\":\"I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner\",\"doi\":\"10.1109/ESIME.2010.5464561\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"106 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464561\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

摘要

在不受控制的气候环境中,商用电子元件的湿度管理可以通过引入本地印刷电路板加热器来实现。通过在关键电子封装附近选择合适的加热板尺寸和位置,并利用逻辑控制功能,可以提高局部湿度管理的质量,降低加热器的功耗,这对于电池驱动的便携式或车载设备尤为重要。采用计算流体动力学辅助方法确定了加热器的最佳可行设计,并对所构建的逻辑控制加热器进行了实验验证。实验在温度+33℃~ +40℃,相对湿度54% ~ 80%的恶劣气候环境下进行。通过对实验%RH和温度曲线以及加热器功率分布的分析,证实了所选方法的可行性,即通过施加振幅小于6 W的离散功率脉冲,使电子封装表面温度与局部露点温度之间的差值保持在9°C以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure
Humidity management of commercial-of-the-shelf electronic components in non-controlled climatic environments can be realized e.g. by introducing a local printed circuit board heater. By choosing appropriate size and location of the heater plate in the vicinity of the critical electronic packages, and utilizing logic control function, it is possible to improve the quality of local humidity management and reduce power consumption of the heater, which is important especially in case of battery driven portable or vehicle mounted devices. A computational fluid dynamics assisted methodology has been developed to determine the best feasible design of the heater, followed by experimental verification of the constructed logic controlled heater. The experiment has been performed in a harsh climatic environment including temperature variation from +33°C to +40°C, and relative humidity variation from 54% to 80%. Analysis of the experimental %RH and temperature curves as well as power profile of the heater has confirmed the feasibility of the chosen approach to maintain greater than 9°C difference between the electronics package surface temperature and the local dew point temperature, by applying discrete power pulses with the amplitude less than 6 W.
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