2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)
发文信息
历年影响因子
历年发表
投稿信息

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) - 最新文献

Analytical and FEM simulations of the thermal spreading effect in LED modules and IR thermography validation

Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464567 A. Corfa, A. Gasse, S. Bernabé, H. Ribot

Thermo-mechanical analysis of flexible and stretchable systems

Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464566 Mario Gonzalez, B. Vandevelde, W. Christiaens, Y. Hsu, F. Iker, F. Bossuyt, J. Vanfleteren, O. van der Sluis, P. Timmermans

CFD assisted design evaluation and experimental verification of a logic controlled local PCB heater for humidity management in electronics enclosure

Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464561 I. Belov, M. Lindgren, J. Ryden, Zahra Alavizadeh, P. Leisner
查看全部
免责声明:
本页显示期刊或杂志信息,仅供参考学习,不是任何期刊杂志官网,不涉及出版事务,特此申明。如需出版一切事务需要用户自己向出版商联系核实。若本页展示内容有任何问题,请联系我们,邮箱:info@booksci.cn,我们会认真核实处理。
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信