2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)最新文献_第2页

Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via 可靠性设计:通过硅孔应力的热-机械分析

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464559

Samed Barnat, H. Frémont, A. Gracia, E. Cadalen, C. Bunel, F. Neuilly, J. Tenailleau

{"title":"Design for reliability: Thermo-mechanical analyses of stress in Through Silicon Via","authors":"Samed Barnat, H. Frémont, A. Gracia, E. Cadalen, C. Bunel, F. Neuilly, J. Tenailleau","doi":"10.1109/ESIME.2010.5464559","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464559","url":null,"abstract":"Increasing demand, regarding to advanced 3D packages and high performance applications, accelerates the development of 3D silicon integrated circuit, with the aim to miniaturize and reduce cost. The study of the reliability of the through silicon via and of most critical areas for the emergence of failure remains a major concern. This paper deals with the variation of stress and strain induced in a through silicon via. It exhibits different recommendations to improve the reliability through a screening of influential parameters. These studies are focused on a single Through Silicon Via (TSV). The stress and strain induced in a TSV depends on different materials and geometrical parameters. Simulation results of accumulated stress and plastic strain show that the interface between copper and silicon is an indicator for a potential failure such as delamination and die cracking. The stress in the TSV also depends on the variation of copper filling, the size of holes and the thickness of wafers. Increasing via diameter increases the stress in the TSV and the effect of thermal expansion mismatch between copper, silicon and silica.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"22 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131062096","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 13

Light degradation prediction of high-power light-emitting diode lighting modules 大功率发光二极管照明模块的光退化预测

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464613

Yen-Fu Su, Shin-Yueh Yang, W. Chi, K. Chiang

{"title":"Light degradation prediction of high-power light-emitting diode lighting modules","authors":"Yen-Fu Su, Shin-Yueh Yang, W. Chi, K. Chiang","doi":"10.1109/ESIME.2010.5464613","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464613","url":null,"abstract":"Light-emitting diode (LED), generally used for indicator light, has been developed for the past 50 years. Recently, LED has attracted many industries in the research and design of their products. However, its low electro-optical conversion efficiency causes redundant heat leading to increased junction temperature and decreased LED luminosity. In this research, a detailed finite element method (FEM) model of a LED module with a proper estimated thermal power and boundary conditions is established using an ANSYS® finite element analysis software. Electrical test method (ETM) and thermocouple measurement are utilized to estimate junction temperature and heat sink temperature, as well as to validate the simulation results. Results from simulation agree with experiment results at a 5% deviation. In the life test of high-power LED modules, the six tested devices had different junction temperatures were conducted in this experiment. Luminosity variations are measured by the integral sphere measurement system. Experiment results show different junction temperatures will influence the light degradation mode. Therefore, it is important to predict and control the junction temperature to improve the LED performance. A detailed FEM model of a LED module is established to simulate the junction temperature. Then, the light degradation mode of this LED module is predicted by the simulation result. This method could rapidly predict the light degradation mode of high power LED lighting modules.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132891532","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 11

A new iterative algorithm for the solution for the load deflection square membranes 一种求解载荷偏转方形膜的新迭代算法

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464523

H. Youssef, A. Ferrand, P. Pons, R. Plana

{"title":"A new iterative algorithm for the solution for the load deflection square membranes","authors":"H. Youssef, A. Ferrand, P. Pons, R. Plana","doi":"10.1109/ESIME.2010.5464523","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464523","url":null,"abstract":"The reliability of micro electromechanical systems depends directly on the mechanical behavior of microstructures and their performances are strongly associated with a good knowledge of materials mechanical properties that compose them. Thus, it is important to precisely determine these properties. There are various methods for micro-materials' characterization. In this work, we are interested in the bulge test technique in order to extract the mechanical properties of square shaped membranes. First, a FEM model has been realized with ABAQUS software. Then, an iterative algorithm has been developed and implemented in Matlab, it controls and optimizes the Finite Element simulation parameters. Secondly, a bulge test bench was set up to carry out experimental measurements. The iterative algorithm was then interfaced with the Abaqus software solver and used to fit the simulation results with the experimental measurements. The investigation reveals that the algorithm converges faster and gives good results. Besides, the proposed method allows us to find the mechanical properties of any membrane geometry and thickness.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133374585","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 2

Finite Element modelling of adhesion phenomena in MEMS MEMS中粘附现象的有限元建模

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464550

R. Ardito, A. Corigliano, A. Frangi

引用次数: 7

Virtual thermo-mechanical prototyping for high-temperature-application microelectronics 高温应用微电子的虚拟热机械原型

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464534

Daoguo Yang, W. V. van Driel, H. Scholten, L. Goumans, R. Faria

{"title":"Virtual thermo-mechanical prototyping for high-temperature-application microelectronics","authors":"Daoguo Yang, W. V. van Driel, H. Scholten, L. Goumans, R. Faria","doi":"10.1109/ESIME.2010.5464534","DOIUrl":"https://doi.org/10.1109/ESIME.2010.5464534","url":null,"abstract":"In this paper, an investigation on the reliability issues of the packages for high temperature applications is presented. First, experimental characterizations of aging effect on the packaging materials and the package were carried out. DMA, TMA and TGA were used to measure the moduli, coefficients of thermal expansion (CTE), and the shrinkage induced by the aging process. Construction analysis was performed to examine the aging effect on the microstructure of the aged samples. It is found that aging has significant influence on the rubbery modulus, the glass transition temperature (Tg) and the strength. Oxidation is believed to be one of the main mechanisms for the degradation of the material properties. In order to reduce cost and time-to-market, thermo-mechanical virtual prototyping is applied to investigate effect of aging on the reliability of the high temperature application packages. An aging-dependent elastic model has been established to describe the material property evolution caused by aging. 3D Finite Element models were established to simulate the impact of the aging effect on the stress/strain of the package. Aging-induced shrinkage was also considered in the model, which was applied to the surface layer. The modeling results indicate that the aging of the compounds have a significant impact on the stress/strain status in the package. And the aging-induced shrinkage can not be simply neglected. Further research work on the experimental aspects and improvement of the aging-related material models are needed.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114964822","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Molecular design of reliable epoxy-copper interface using molecular dynamic simulation 基于分子动力学模拟的可靠环氧-铜界面分子设计

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464557

Cell K. Y. Wong, H. Fan, G. Zhang, M. Yuen

引用次数: 2

Characterisation of the mechanical behaviour of SAC solder at high strain rates 高应变率下SAC焊料力学性能的表征

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464547

K. Meier, M. Roellig, S. Wiese, K. Wolter

引用次数: 6

Virtual prototyping advanced by statistic and stochastic methodologies 基于统计和随机方法的虚拟样机技术

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464571

S. Rzepka, A. Muller, B. Michel

引用次数: 5

Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues 探测工艺参数和PAD设计的评估:解决机械问题的实验和建模相关性

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464594

R. Roucou, V. Fiori, F. Cacho, K. Inal, X. Boddaert

引用次数: 4

Jets and rotary flows for single-phase liquid cooling: An overview of some recent experimental findings 射流和旋转流的单相液体冷却:一些最近的实验发现概述

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI: 10.1109/ESIME.2010.5464505

J. Punch, E. Walsh, R. Grimes, N. Jeffers, D. Kearney

引用次数: 3