Characterisation of the mechanical behaviour of SAC solder at high strain rates

The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology enables the FEM analysis of this kind of highly dynamic scenario and is therefore used for the evaluation of the recorded data. The material parameters of a material model covering the strain rate dependency of the solder behaviour are derived. Finally conclusions for the mechanical behaviour of the used SAC solder alloy under high strain rate loads will be drawn.