探测工艺参数和PAD设计的评估:解决机械问题的实验和建模相关性

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464594

R. Roucou, V. Fiori, F. Cacho, K. Inal, X. Boddaert

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引用次数: 4

摘要

众所周知，电子晶片排序会在衬垫结构中引起应力，并可能导致机械故障。在本工作中，通过实际测试和有限元建模对EWS工艺(过驱动和通道数)和模垫设计(厚度和互连层架构)参数进行了评估。

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Evaluation of probing process parameters and PAD designs: Experiments and modelling correlations for solving mechanical issues

Electrical Wafer Sort is known to induce stress in the pad structure and can lead to mechanical failures. In the present work, both EWS process (over drive and number of passes) and die pad design (thicknesses and interconnect layer architectures) parameters are evaluated through actual tests and Finite Element Modelling.

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来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

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