{"title":"Virtual prototyping advanced by statistic and stochastic methodologies","authors":"S. Rzepka, A. Muller, B. Michel","doi":"10.1109/ESIME.2010.5464571","DOIUrl":null,"url":null,"abstract":"The paper reports three examples of best industrial practice showing the substantial benefits gained in terms of time-to-market reduction when virtual prototyping is enhanced by statistical and stochastic methodologies. These examples from a microelectronics setting of high volume component and module manufacturing deal with different fields: i) ball grid array (BGA) design optimization based on sophisticated design-of-experiments (DoE) and response surface (RS) schemes, ii) material modeling based on stochastic parameter identification and optimization, and iii) process pre-qualification by involving a stochastic robustness analysis.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"270 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464571","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The paper reports three examples of best industrial practice showing the substantial benefits gained in terms of time-to-market reduction when virtual prototyping is enhanced by statistical and stochastic methodologies. These examples from a microelectronics setting of high volume component and module manufacturing deal with different fields: i) ball grid array (BGA) design optimization based on sophisticated design-of-experiments (DoE) and response surface (RS) schemes, ii) material modeling based on stochastic parameter identification and optimization, and iii) process pre-qualification by involving a stochastic robustness analysis.