新兴多芯片封装的热建模

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464514

E. Monier-Vinard, V. Bissuel, Paul Murphy, O. Daniel, J. Dufrenne

{"title":"新兴多芯片封装的热建模","authors":"E. Monier-Vinard, V. Bissuel, Paul Murphy, O. Daniel, J. Dufrenne","doi":"10.1109/ESIME.2010.5464514","DOIUrl":null,"url":null,"abstract":"The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices.","PeriodicalId":152004,"journal":{"name":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","volume":"180 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2010-04-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":"{\"title\":\"Thermal modelling of the emerging multi-chip packages\",\"authors\":\"E. Monier-Vinard, V. Bissuel, Paul Murphy, O. Daniel, J. Dufrenne\",\"doi\":\"10.1109/ESIME.2010.5464514\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices.\",\"PeriodicalId\":152004,\"journal\":{\"name\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"volume\":\"180 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-04-26\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"11\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2010.5464514\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2010.5464514","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 11

摘要

随着系统级封装器件的引入，目前单芯片组件的散热挑战只会被放大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Thermal modelling of the emerging multi-chip packages

The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量