Thermal modelling of the emerging multi-chip packages

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464514

E. Monier-Vinard, V. Bissuel, Paul Murphy, O. Daniel, J. Dufrenne

引用次数: 11

Abstract

The thermal dissipation challenges that are seen today with single-chip components will only be magnified with the introduction of System in Package devices.

查看原文本刊更多论文

新兴多芯片封装的热建模

随着系统级封装器件的引入，目前单芯片组件的散热挑战只会被放大。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

自引率

0.00%

发文量