SiP (System-in-a-Package) LGA (Land Grid Array)的热机械仿真:内部集成电路对二级焊点可靠性的影响

2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE) Pub Date : 2010-04-26 DOI:10.1109/ESIME.2010.5464579

A. Chaillot, C. Munier, O. Maire, M. Vigier, C. Chastanet

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引用次数: 0

摘要

系统级封装(SiP)旨在将功能子系统与一个或多个半导体芯片以及无源元件集成到基板上。SiP被模压到OEM，使用行业标准和大批量设备进行二级组装。在最近的应用(高I/O密度，改进的电气性能)中，LGA(陆地电网阵列)是第2焊点级别的非常实用的解决方案。LGA封装通过消除用于将BGA(球栅阵列)封装安装到系统电路板上的焊球来降低集成电路的安装高度。相反，LGA封装使用已应用到电路板上的焊料回流安装。

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Thermo-mechanical simulation of a SiP (System-in-a-Package) LGA (Land Grid Array): Impact of the internal IC (Integrated Circuits) on the 2nd level solder joint reliability

System-in-a-Package (SiP) aims to integrate a functional sub-system with one or more semiconductor chips along with passive components onto a substrate. SiP is transferred molded to the OEM for second level assembly using industry standards and high volume equipment. In most recent applications (high I/O density, improved electrical performance), LGA (Land Grid Array) is a very practical solution for the 2nd solder joint level. LGA packages reduce integrated circuit mounted height by eliminating the solder balls that are used for mounting BGA (Ball Grid Array) packages to system circuit boards. Instead, LGA packages are reflow-mounted using solder that has been applied to the board.

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2010 11th International Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE)

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