1996 Proceedings 46th Electronic Components and Technology Conference最新文献_第2页

Multi-chip hybrid integration on PLC platform using passive alignment technique 采用无源对准技术在PLC平台上进行多芯片混合集成

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517370

Y. Nakasuga, T. Hashimoto, Y. Yamada, H. Terui, M. Yanagisawa, K. Moriwaki, Y. Akahori, Y. Tohmori, K. Kato, S. Sekine, M. Horiguchi

引用次数: 14

High frequency characteristics of MCM decoupling capacitors MCM去耦电容器的高频特性

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517414

L. Schaper, G. Morcan

引用次数: 17

Flip chip bonding using isotropically conductive adhesives 使用各向同性导电粘合剂的倒装芯片粘合

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.551419

B. Rosner, J. Liu, Z. Lai

引用次数: 15

Materials and mechanics issues in flip-chip organic packaging 倒装有机封装中的材料与力学问题

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517439

T. Wu, Y. Tsukada, W.T. Chen

{"title":"Materials and mechanics issues in flip-chip organic packaging","authors":"T. Wu, Y. Tsukada, W.T. Chen","doi":"10.1109/ECTC.1996.517439","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517439","url":null,"abstract":"The strength of flip chip organic packaging technology rests upon the knowledge and manufacturing base of C4 solder bump chip interconnection, and printed circuit technology infrastructure. The key innovation was the underfill encapsulation between the chip and the laminate which overcame the road-block of low cycle fatigue of C4 solder bump due to large CTE difference between silicon and laminate. The advent of SLC (surface laminar circuit) innovation extends the flip chip technology to higher solder bump density and larger chip I/O expected for future generations of semiconductors. The flip chip packages contain new materials, interfaces, and new processes which in turn govern the mechanical integrity of the packaging module and module card assembly. The increasing pervasiveness of electronic packages requires meeting new sets of environments. It is important to have a good understanding of materials, interface, metrology and mechanics issues related to organic packages, and how to apply this understanding in the modelling of design, process and reliability of flip chip. This paper will deliver an overview of some of the key technical challenges associated with materials and mechanics in FCA (flip-chip attach) assembly on organic carriers.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"137 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124316257","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 101

Analysis of electrical resistance monitoring of PCMCIA interconnection failures PCMCIA互连故障的电阻监测分析

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550501

D. Zheng, J. Constable

引用次数: 1

Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability 倒装芯片下填流量和固化速率的研究进展及其对制造工艺和元件可靠性的提高

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550808

D. Shi, J. Carbin

{"title":"Advances in flip-chip underfill flow and cure rates and their enhancement of manufacturing processes and component reliability","authors":"D. Shi, J. Carbin","doi":"10.1109/ECTC.1996.550808","DOIUrl":"https://doi.org/10.1109/ECTC.1996.550808","url":null,"abstract":"This paper focuses on significant advances in flip-chip underfill materials via a thorough characterization of the uncured and cured material properties. These characteristics are then translated into what amounts to substantial gains in productivity and reliability. A unique method for determining material flow rates is presented. The data demonstrate the critical relationship between viscosity and flow rate as a function of time and temperature. Material cure rates as a function of time and temperature are also presented using results derived from differential scanning calorimetry or DSC. In addition, the dielectric constant and dissipation factor during the cure process are also measured as an added, more sensitive gauge of the degree of cure. The data from both measurement tools demonstrates what the optimum cure time and temperature parameters are, so as to achieve the optimum glass transition temperature (Tg, generated using DSC). Another critical thermal mechanical property of the underfill material, the linear coefficient of thermal expansion, is characterized with results generated using thermomechanical analysis or TMA. The data is then summarized and translated in terms of its actual impact on manufacturing productivity and component reliability.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"114 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134027006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 12

A method to determine the frequency performance and noise margin of various interconnect technologies 确定各种互连技术的频率性能和噪声裕度的方法

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550499

J. Kar, R. Shukla, B. Bhattacharyya

引用次数: 0

Validation study of compact thermal resistance models of IC packages 集成电路封装紧凑热阻模型的验证研究

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517389

Zemo Yang, Young Kwon

{"title":"Validation study of compact thermal resistance models of IC packages","authors":"Zemo Yang, Young Kwon","doi":"10.1109/ECTC.1996.517389","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517389","url":null,"abstract":"Accurate estimation of the operating temperature of a semiconductor IC device encapsulated within an electronic package is necessary to ensure reliable performance over the life of the product. The common lumped constant Theata JA (/spl phi/ja) characterized in laboratory setups, was found to be too dependent on mounting and environmental conditions to be effective in practical system applications. Two improved compact models of electronic package thermal characteristics, the Bar-Cohen and Lasance, were analyzed for accuracy in particular situations. A further refinement of the Bar-Cohen and Lasance compact models proposed in this paper was found to be more robust and valid in complicated system applications. The less used but effective lumped constant, Theata JL (/spl phi/jl), which describes the junction to package lead relationship, was also studied. It was found to be useful for quick determination of junction temperature in equilibrium system mounted operating condition. Also covered in this work is a discussion from the theoretical network point of view as well as suggestions of modeling methodologies for board mounted plastic packages.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132195115","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 3

Thermo-mechanical modeling of a novel MCM-DL technology 一种新型MCM-DL技术的热力学建模

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550502

R. Dunne, S. Sitaraman

引用次数: 6

In-process board warpage measurement in a lab scale wave soldering oven 在实验室规模的波峰焊炉中测量板翘曲

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517399

M.R. Stiteler, C. Ume, B. Leutz

引用次数: 33