Thermo-mechanical modeling of a novel MCM-DL technology

Abstract

This paper presents parametric studies to assess the thermomechanical reliability of a novel "sandwich" substrate with integrated passives under thermal shock testing. A thermoelastic-plastic finite element analysis is done where FR4 is treated as elastic and orthotropic (with temperature-dependent material properties), and the dielectric polymer and Copper are treated as bilinear elastic-plastic materials. The effect of some geometric and material parameters-FR4 base layer height and insulating layer material-on board warpage and the thermal stress/strain field is discussed, and design guidelines for improved thermo-mechanical integrity of the substrate are suggested.