{"title":"在实验室规模的波峰焊炉中测量板翘曲","authors":"M.R. Stiteler, C. Ume, B. Leutz","doi":"10.1109/ECTC.1996.517399","DOIUrl":null,"url":null,"abstract":"An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behaviour of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"33","resultStr":"{\"title\":\"In-process board warpage measurement in a lab scale wave soldering oven\",\"authors\":\"M.R. Stiteler, C. Ume, B. Leutz\",\"doi\":\"10.1109/ECTC.1996.517399\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behaviour of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process.\",\"PeriodicalId\":143519,\"journal\":{\"name\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"volume\":\"41 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-28\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"33\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1996 Proceedings 46th Electronic Components and Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.1996.517399\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1996 Proceedings 46th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1996.517399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
In-process board warpage measurement in a lab scale wave soldering oven
An automated on-line warpage measurement system for printed wiring boards (PWBs) and printed wiring board assemblies (PWBAs) has been developed. The system is capable of simulating a variety of soldering processes, including the wave soldering process, and performing real-time PWB/PWBA warpage measurements using the shadow moire technique. The system can be used to characterize the warpage behaviour of virtually any PWB/PWBA during the soldering process. Using this system, warpage of PWB test vehicles was measured during simulated wave soldering. The measured warpage varied significantly during wave soldering from that observed both before and after wave soldering. These results help us to understand how the board deforms at every stage of the soldering process.
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