1996 Proceedings 46th Electronic Components and Technology Conference最新文献_第10页

Moisture sensitivity evaluation of ball grid array packages 球栅阵列封装的水分敏感性评价

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550504

L. Yip, T. Massingill, H. Naini

引用次数: 8

Low-cost automated fiber pigtailing machine 低成本自动化光纤尾纤机

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517438

O. Strand

引用次数: 1

Simulation of frequency dependent conductor loss in interconnects 互连中频率相关导体损耗的仿真

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550514

D. Divekar, R. Raghuram, F. Balistreri, N. Matsui

引用次数: 2

Statistical methods for stress screen development 应力筛发展的统计方法

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550756

M. R. Cooper

{"title":"Statistical methods for stress screen development","authors":"M. R. Cooper","doi":"10.1109/ECTC.1996.550756","DOIUrl":"https://doi.org/10.1109/ECTC.1996.550756","url":null,"abstract":"Stress screening during design, development, and production of electronic hardware is a quality improvement technique which can be employed to reduce defects in a product. However, due to the variety of electronic hardware types which may be screened and the number of stresses which may be applied for screening, there are no commercial standards which describe how to develop an effective stress screen. This paper describes a non-product-specific screen development technique which utilizes statistical analysis methods to achieve an effective and efficient stress screen. Statistical applications for various aspects of stress screen development are suggested, including Pareto analysis, Exploratory Data Analysis (EDA), Weibull analysis of time-to-failure data, comparison of means, analysis of variance (ANOVA), use of statistical process control charts (CUSUM, X-bar R), Duane plots of reliability growth, and use of the Poisson distribution for determining sample screen sizes. The techniques outlined involve test and analytical activities applied throughout product development; from first prototypes through to volume production. The use of statistical methods allows for development of an effective screen to remove defects and for an effective risk assessment of the effect of defects through numerical quantification of defect probabilities.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"198 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113967053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 0

Parallel optical interconnections for future broad band systems, based on the "fibre in board technology" 基于“板中光纤技术”的未来宽带系统并行光互连

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517402

G. de Pestel, A. Picard, J. Vandewege, D. Morlion, Q. Tan, J. Van Koetsem, F. Migom, P. Vetter

{"title":"Parallel optical interconnections for future broad band systems, based on the \"fibre in board technology\"","authors":"G. de Pestel, A. Picard, J. Vandewege, D. Morlion, Q. Tan, J. Van Koetsem, F. Migom, P. Vetter","doi":"10.1109/ECTC.1996.517402","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517402","url":null,"abstract":"A novel interconnection technology based on the integration of glass optical fibres in a standard printed circuit board is presented to overcome the interconnection bottleneck in the nest generation of broad band switching fabrics. Within these systems, the parallel electro-optical modules will be: integrated on the switching board itself which has a switching capacity of 20 Gbit/s. A robust and automated technology is used for the realisation of optical interconnections between these electro-optical (E/O) modules and the off-board connectors at the edge of the board. Dedicated surface optical contacts have been developed, capable of handling 16 parallel channels. These surface optical contacts can be integrated everywhere on the board and can be used for mounting an electro-optical module or a multifibre connector compatible with this technology. Electro-optical modules (8 channel transmitters and 4 channel receivers) and multifibre optical back panel connectors have been integrated on an engineering prototype for the evaluation of the technology. Off-board links, over 200 m MM (graded index) fibre, and on-board links are operational at 622 Mbit/s. The boards have been subjected to reliability tests and preliminary results reveal no degradation of the board after thermal cycling. Precision moulding techniques are presented to make the proposed technology more cost-effective and suitable for volume production.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"59 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115898708","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 8

Fluxless no-clean assembly of solder bumped flip chips 无焊剂的无清洁组装焊凸倒装芯片

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517442

N. Koopman, S. Nangalia, V. Rogers

{"title":"Fluxless no-clean assembly of solder bumped flip chips","authors":"N. Koopman, S. Nangalia, V. Rogers","doi":"10.1109/ECTC.1996.517442","DOIUrl":"https://doi.org/10.1109/ECTC.1996.517442","url":null,"abstract":"MCNC has developed a radically new fluxless, no-clean process which has shown considerable success with assembly of a variety of flip chip configurations. The process, called PADS (Plasma Assisted Fluxless Soldering) relies on a pretreatment which enables the subsequent solder reflow in inert ambients. Conventional mass production soldering tools can be used, just eliminating the flux dispense and flux cleaning steps, and adding the pretreatment step. Highlights of the applications studies are presented. Examples include high lead (97Pb3Sn) bumped flip chips joined to multilayer ceramic substrates with Mo/Mi/Au microsockets at 350/spl deg/C in nitrogen, eutectic tin/lead solder bumped flip chips joined at 250/spl deg/C to bare copper, 95/5 lead/tin bumped flip chips joined to eutectic dipped FR4 printed circuit boards, joining of 90/10 lead tin bumps to each other at 350/spl deg/C, unique MEMS (Micro Electrical Mechanical Systems) devices joined with the dry fluxless process, and solder bumped flip chips joined to flexible circuits. Other related topics to be discussed include tacking, self alignment and its measurement, balling reflow, and rework operations including hot chip pull and site dress. Other areas of application of the fluxless process are highlighted including hermetic seal band attachment, joining of flexible circuit TAB leads to insulator substrates, and joining to solid solder deposits on FR4.","PeriodicalId":143519,"journal":{"name":"1996 Proceedings 46th Electronic Components and Technology Conference","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1996-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116839673","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}

引用次数: 10

Structure-dependent reliability assessment of 1.3 /spl mu/m InGaAsP/InP uncooled laser diodes by accelerated aging test 加速老化试验评估1.3 /spl mu/m InGaAsP/InP非冷却激光二极管的结构可靠性

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.550904

N. Hwang, G. Joo, Sang-Hwan Lee, Seong-Su Park, H. Cho, Min-Kyu Song, K. Pyun

引用次数: 0

Warpage study of glob top cavity-up EPBGA packages 球形顶空腔EPBGA封装翘曲研究

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517460

D. Liang

引用次数: 11

Moisture resistant aluminum nitride filler for high thermal conductivity microelectronic molding compounds 用于高导热微电子成型化合物的耐湿氮化铝填料

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517410

A. A. Gallo, C. Bischof, K. Howard, S. D. Dunmead, S. A. Anderson

引用次数: 10

Experimental evaluation of moisture-induced failures of surface mount plastic packages 表面贴装塑料封装受潮失效的实验评估

1996 Proceedings 46th Electronic Components and Technology Conference Pub Date : 1996-05-28 DOI: 10.1109/ECTC.1996.517375

Qazi Mudassar Ilyas, M. Potter

引用次数: 4