He Li;Li Sailei;He Qi;Sun Wenqi;Luo Wei;Shen Guiying
{"title":"Field-Emission Light Sources Based on Porous Silicon Planar Electron Emitter","authors":"He Li;Li Sailei;He Qi;Sun Wenqi;Luo Wei;Shen Guiying","doi":"10.1109/TED.2025.3562507","DOIUrl":"https://doi.org/10.1109/TED.2025.3562507","url":null,"abstract":"This article proposes a novel field-emission light source (FELS) with a simplified structure that can be operated under low-pressure conditions. The flat-format FELS, driven by a porous silicon (PS)-based planar electron emitter, exhibits bright luminescence at a low field emission current density of approximately <inline-formula> <tex-math>$5~mu $ </tex-math></inline-formula>A/cm2 even at the ambient pressure as high as <inline-formula> <tex-math>$10^{{2}}$ </tex-math></inline-formula> Pa. This suggests the favorable energy conversion efficiency for this FELS device. Moreover, this novel FELS achieves reduced thermal effects and power consumption due to its lower driving voltage and conduction current compared with the conventional device. The repeatability within 8% and the stability below 3% of the PS planar emitter further supports its potential for FELS applications. As a promising on-chip electron source, the PS-based cold cathode opens avenues for future high-performance, low cost, silicon-compatible FELS with large area and operation at ambient pressure.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3219-3224"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144190570","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Tanvir H. Pantha;Abhishek Khanna;Huacheng Ye;Shaila Niazi;Miriyala P. Kamal;Biswadeep Chakraborty;Shumiya Alam;Ethan Weinstock;Nithin Babu;Saibal Mukhopadhyay;Yun Chiu;Suman Datta;Kerem Y. Camsari;Sourav Dutta
{"title":"Addressing the Connectivity Bottleneck With BEOL FeFETs for 3-D CMOS + X Ising Machines","authors":"Tanvir H. Pantha;Abhishek Khanna;Huacheng Ye;Shaila Niazi;Miriyala P. Kamal;Biswadeep Chakraborty;Shumiya Alam;Ethan Weinstock;Nithin Babu;Saibal Mukhopadhyay;Yun Chiu;Suman Datta;Kerem Y. Camsari;Sourav Dutta","doi":"10.1109/TED.2025.3562510","DOIUrl":"https://doi.org/10.1109/TED.2025.3562510","url":null,"abstract":"Recent advancements in Ising machines present an exciting new paradigm for addressing computationally intensive problems with superior energy efficiency and speed compared to conventional digital computers. Despite these promising developments, many real-world problems demand high connectivity, a requirement that exceeds the capabilities of current CMOS-based Ising machine hardware. To overcome this connectivity bottleneck, we propose a novel approach leveraging programmable multibit back-end-of-line (BEOL) ferroelectric field-effect transistor (FeFETs) capable of monolithic 3-D stacking. We experimentally demonstrate a 10-node, 24-coupling Ising machine utilizing dual-gated BEOL FeFETs. This platform enables real-time reconfigurability and supports diverse computational workloads, including combinatorial optimization problems and energy-based learning. Our platform demonstrates robust error-resilient computation with minimal accuracy degradation, even under high endurance conditions of up to 10 billion read and write cycles. This resilience is critical for both read-intensive forward problems and write-intensive inverse or learning problems. To evaluate the performance and area gains, we benchmark the proposed FeFET-based architecture against traditional CMOS implementations. The results reveal significant advantages for FeFET technology, including an <inline-formula> <tex-math>$8.2times $ </tex-math></inline-formula> increase in coupling density, an <inline-formula> <tex-math>$11times $ </tex-math></inline-formula> improvement in energy efficiency, and a <inline-formula> <tex-math>$2.1times $ </tex-math></inline-formula> reduction in latency.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3335-3342"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"One-Ferroelectric-Tunnel-FET-Based Reconfigurable Logic Gates","authors":"Jaemin Yeom;Minjeong Ryu;Jae Seung Woo;Jin Wook Lee;Seonggeun Kim;Seungwon Go;Sangwan Kim;Woo Young Choi","doi":"10.1109/TED.2025.3561710","DOIUrl":"https://doi.org/10.1109/TED.2025.3561710","url":null,"abstract":"A novel reconfigurable logic gate (RLG) utilizing one ferroelectric tunnel field-effect transistor (FeTFET) is proposed for the first time. By leveraging the symmetric ambipolar current of the TFET and the minor loop behavior of the ferroelectric, <sc>nand/or/xnor/imp/rimp</small> operations are performed within a single FeTFET, enabling logic-in-memory (LiM) with high area efficiency. It is demonstrated that two inputs can be programmed in two steps, and the type of logic operation can be changed by simply altering the read voltage. The proposed FeTFET-based RLGs consume >99% lower operation energy than FeFET-based ones.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3302-3306"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170936","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Nikolaos Mavredakis;Anibal Pacheco-Sanchez;Ramon Garcia Cortadella;Anton-Guimerà-Brunet;Jose A. Garrido;David Jiménez
{"title":"Physics-Based Compact Modeling for the Drain Current Variability in Single-Layer Graphene FETs","authors":"Nikolaos Mavredakis;Anibal Pacheco-Sanchez;Ramon Garcia Cortadella;Anton-Guimerà-Brunet;Jose A. Garrido;David Jiménez","doi":"10.1109/TED.2025.3560616","DOIUrl":"https://doi.org/10.1109/TED.2025.3560616","url":null,"abstract":"For the growth of emerging graphene field-effect transistor (GFET) technologies, a thorough characterization of on-wafer variability is required. Here, we report for the first time a physics-based compact model, which precisely describes the drain current (<inline-formula> <tex-math>${I}_{D}$ </tex-math></inline-formula>) fluctuations of monolayer GFETs. Physical mechanisms known to generate 1/f noise in transistors, such as carrier number and Coulomb scattering mobility fluctuations, are also revealed to cause <inline-formula> <tex-math>${I}_{D}$ </tex-math></inline-formula> variance. Such effects are considered in the model by being activated locally in the channel and the integration of their contributions from source to drain results in total variance. The proposed model is experimentally validated from a statistical population of three different-sized solution-gated (SG) GFETs from strong p- to strong n-type bias conditions. A series resistance <inline-formula> <tex-math>${I}_{D}$ </tex-math></inline-formula> variance model is also derived mainly contributing at high carrier densities.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3314-3321"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144170966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Yuesong Liang;Wei Wang;Genqiang Chen;Fei Wang;Yuxiang Du;Minghui Zhang;Yanfeng Wang;Hong-Xing Wang
{"title":"Monolithically Integrated Hydrogen-Terminated Diamond FET Logic Circuits","authors":"Yuesong Liang;Wei Wang;Genqiang Chen;Fei Wang;Yuxiang Du;Minghui Zhang;Yanfeng Wang;Hong-Xing Wang","doi":"10.1109/TED.2025.3563146","DOIUrl":"https://doi.org/10.1109/TED.2025.3563146","url":null,"abstract":"Logic circuits are the first step toward integrated circuits. Here, we fabricated the monolithically E/R logic, direct coupled E/E logic, and E/D inverter logic circuit with respective loads of resistor, enhancement field-effect transistor (FET), and depletion FET using hydrogenated diamond and observed the performance of these logic circuits. The gain and voltage swing of E/R logic circuits are strongly influenced by the value of the load resistance, which are commonly employed in separate components. E/E logic circuit exhibits small voltage swing, low gain, and low noise margin. E/D logic circuits present significant advantages in terms of voltage swing, gain, noise margins, and power consumption over E/R and E/E logic circuits. The E/D mode circuit shows a logic voltage swing of −9.44 V, a voltage gain of 15.5 V/V, low-/high-noise margins of 0.82/7.07 V, and static power consumption of <inline-formula> <tex-math>$10^{-{3}}$ </tex-math></inline-formula> W and proper functions up to at least <inline-formula> <tex-math>$200~^{circ }$ </tex-math></inline-formula>C at a supply voltage of −10 V. These results show great potential for diamond smart power integrated circuit application.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"2834-2840"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144196794","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Studies on Traveling Wave Tubes With the Bunching Mechanism of Resistive Wall and the Circuit-Field Synchronous Interaction","authors":"Yue Ouyang;Hairong Yin;Jinchi Cai;Dongdong Jia;Pengcheng Yin;Wuyang Fan;Lingna Yue;Jin Xu;Yong Xu;Yanyu Wei;Jun He;Hailong Wang","doi":"10.1109/TED.2025.3560268","DOIUrl":"https://doi.org/10.1109/TED.2025.3560268","url":null,"abstract":"There is no interaction between the circuit wave and the electron beam in resistive wall amplifiers (RWAs), and the further bunching of the electron beam is caused by the interaction between the electron beam and the space charge field driven by the surface plasmons in the resistive wall. However, due to the inability of the resistive wall structure to excite space charge waves, a coupling system is necessary to pre-modulate the electron beam. Consequently, the tube length of RWAs is relatively longer for the same gain. This article aims to integrate the bunching mechanism of RWAs with the interaction mechanism of traditional traveling wave tubes (TWTs), so that there is both an aiding effect of the space charge field on bunching and a synchronous interaction between the circuit-field and the electron beam in a TWT. The calculation results suggest that this new integrated mechanism not only reduces the tube length but also improves the gain.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3192-3197"},"PeriodicalIF":2.9,"publicationDate":"2025-04-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144190538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
L. Donetti;C. Medina-Bailon;J. L. Padilla;C. Sampedro;F. Gamiz
{"title":"On the Capacitance of Nanosheet Transistors","authors":"L. Donetti;C. Medina-Bailon;J. L. Padilla;C. Sampedro;F. Gamiz","doi":"10.1109/TED.2025.3559482","DOIUrl":"https://doi.org/10.1109/TED.2025.3559482","url":null,"abstract":"The capacitance of the gate oxide is a crucial parameter to model the performance of MOSFETs. The traditional expression used to compute it stems from the parallel-plate capacitor formula. While its use is appropriate for planar devices, it has been naturally extended to 3-D devices such as those based on nanosheets even if the geometry is quite different. In this work, we compute numerically the gate oxide capacitance of nanosheet transistors and, observing a nonnegligible discrepancy with the planar model, we propose a simple model that better reproduces the computed capacitance. Then, we investigate the definition of equivalent oxide thickness (EOT), showing that it cannot be strictly used for nonplanar devices: however, our improved model allows us to obtain a useful expression valid for the most common cases. Finally, we generalize the capacitance model to nanosheets with rounded corners.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"2827-2833"},"PeriodicalIF":2.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10976443","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144196793","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Andreas Fuchsberger;Alexandra Dobler;Lukas Wind;Andreas Kramer;Julian Kulenkampff;Maximilian Reuter;Daniele Nazzari;Giulio Galderisi;Enrique Prado Navarrete;Johannes Aberl;Moritz Brehm;Thomas Mikolajick;Jens Trommer;Klaus Hofmann;Masiar Sistani;Walter M. Weber
{"title":"Reconfigurable Ge Transistors Enabling Adaptive Differential Amplifiers","authors":"Andreas Fuchsberger;Alexandra Dobler;Lukas Wind;Andreas Kramer;Julian Kulenkampff;Maximilian Reuter;Daniele Nazzari;Giulio Galderisi;Enrique Prado Navarrete;Johannes Aberl;Moritz Brehm;Thomas Mikolajick;Jens Trommer;Klaus Hofmann;Masiar Sistani;Walter M. Weber","doi":"10.1109/TED.2025.3559912","DOIUrl":"https://doi.org/10.1109/TED.2025.3559912","url":null,"abstract":"Exploiting the capabilities of multi-gated transistors is a promising strategy for adaptive and compensative analog circuits. Typically, reconfigurable transistors, which can be switched between n- and p-type operation at runtime, are used as universal transistors in fine grain programmable digital circuits. However, in the analog domain, by operating the transistors deliberately in intermediate states, they enable adjustments to application-specific requirements and allow for compensation of undesired deviations. Here, we propose a Ge-on-SOI transistor circuit primitive that enables an adaptable circuit design featuring n- and p-type common source (CS) and drain circuits, with electrostatically tuneable output-to-input ratio. Most notably, combined experimental and simulation studies promote verification and scalability assessment. Finally, the first experimental evidence of the electrostatic compensation of transistor/circuitpath-related device-to-device inequalities is shown in a differential amplifier featuring adaptable gain.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"2868-2873"},"PeriodicalIF":2.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10975300","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144196869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Fabrication and Dark Current Analysis of InAsSb-Based nBn Structures for High-Performance Mid-Infrared Applications","authors":"Bingfeng Liu;Lianqing Zhu;Lidan Lu;Weiqiang Chen;Ruixin Gong;Yang Chen;Mingli Dong","doi":"10.1109/TED.2025.3560265","DOIUrl":"https://doi.org/10.1109/TED.2025.3560265","url":null,"abstract":"This study presents a comprehensive characterization and dark current analysis of InAsSb-based nBn structures for high operating temperature (HOT) mid-wavelength infrared (MWIR) applications. InAsSb layers with varying Sb compositions were grown by molecular beam epitaxy (MBE) to achieve lattice match and minimize dislocation density. High-resolution X-ray diffraction (HRXRD), atomic force microscopy (AFM), and reciprocal space mapping (RSM) were employed to assess crystal quality, strain relaxation, and surface morphology, demonstrating significant improvements with optimized growth conditions. The fabricated nBn photodetectors, featuring a lattice-matched AlAsSb barrier, exhibited a low dark current density of <inline-formula> <tex-math>$4.5times 10^{-{5}}$ </tex-math></inline-formula> A/cm2 at 130 K and <inline-formula> <tex-math>$2.6times 10^{-{4}}$ </tex-math></inline-formula> A/cm2 at 190 K. Blackbody-calibrated photocurrent spectroscopy confirmed that the InAsSb MWIR photodetectors exhibited excellent performance at 160 K, achieving peak quantum efficiency (QE) of 58%, a responsivity of 1.69 A/W, and a detectivity of <inline-formula> <tex-math>$2.13times 10^{{11}}$ </tex-math></inline-formula> cm Hz1/2/W at <inline-formula> <tex-math>$3.58~mu $ </tex-math></inline-formula>m, demonstrating their potential for high-temperature infrared detection applications.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"3029-3034"},"PeriodicalIF":2.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144185798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Enhanced Writability of 4P4N CFET SRAM Cell With Transmission Gates","authors":"Seung-Woo Jung;In Ki Kim;Sung-Min Hong","doi":"10.1109/TED.2025.3560269","DOIUrl":"https://doi.org/10.1109/TED.2025.3560269","url":null,"abstract":"The conventional complementary field-effect transistor (CFET) static random access memory (SRAM) cell with a 4P2N configuration features two access pMOSFETs, leaving spaces for two nMOSFETs above the access transistors intentionally unused, resulting in suboptimal utilization of available space. To address this, we introduce a split-gate process enabling the fabrication of transmission gates. We propose a novel 4P4N SRAM structure with backside contacts (BCs) that significantly enhances writability while maintaining readability. Compared with 4P2N and 4N2P with BCs, 4P4N has higher read delay and energy consumption but shows 54.7% improvement in write performance over 4P2N and 48.1% over 4N2P. In the case of fast NMOS/slow PMOS (FNSP) under <inline-formula> <tex-math>${V}_{T}$ </tex-math></inline-formula> variation at process corners, 4P4N enhances read static noise margin (RSNM) while maintaining strong write static noise margin (WSNM).","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 6","pages":"2949-2955"},"PeriodicalIF":2.9,"publicationDate":"2025-04-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"144185828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}