Minsang Ryu;Minki Suh;Jonghyeon Ha;Dabok Lee;Hojoon Lee;Hyunchul Sagong;Jungsik Kim
{"title":"不同温度下质子辐照对DDR4 DRAM的单事件扰动和总电离剂量效应","authors":"Minsang Ryu;Minki Suh;Jonghyeon Ha;Dabok Lee;Hojoon Lee;Hyunchul Sagong;Jungsik Kim","doi":"10.1109/TED.2025.3594607","DOIUrl":null,"url":null,"abstract":"In this study, single-event upset (SEU) and total ionizing dose (TID) effects on DDR4 dynamic random access memory (DRAM) under 48-MeV proton radiation and various temperatures (153–373 K) were investigated. The SEU-induced error density reached a maximum of <inline-formula> <tex-math>$5.59\\times 10^{-{6}}$ </tex-math></inline-formula> at 373 K and a minimum of <inline-formula> <tex-math>$9.77\\times 10^{-{10}}$ </tex-math></inline-formula> at 153 K, which correlates with the increase in gate-induced drain leakage (GIDL) as temperature rises. After the device under test (DUT) was irradiated at 153, 300, and 373 K, the TID-induced error density was estimated. The generation of interface traps was higher at 373 K than at 153 K, leading to an increase in the TID-induced error density. However, the error density at 300 K was 1.1 times as high as that at 373 K. This occurs because the DUT irradiated at 373 K is more favorable for defect recovery via annealing than at 300 K.","PeriodicalId":13092,"journal":{"name":"IEEE Transactions on Electron Devices","volume":"72 9","pages":"5243-5246"},"PeriodicalIF":3.2000,"publicationDate":"2025-08-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Single-Event Upset and Total Ionizing Dose Effects on DDR4 DRAM Due to Proton Irradiation Under Different Temperatures\",\"authors\":\"Minsang Ryu;Minki Suh;Jonghyeon Ha;Dabok Lee;Hojoon Lee;Hyunchul Sagong;Jungsik Kim\",\"doi\":\"10.1109/TED.2025.3594607\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this study, single-event upset (SEU) and total ionizing dose (TID) effects on DDR4 dynamic random access memory (DRAM) under 48-MeV proton radiation and various temperatures (153–373 K) were investigated. The SEU-induced error density reached a maximum of <inline-formula> <tex-math>$5.59\\\\times 10^{-{6}}$ </tex-math></inline-formula> at 373 K and a minimum of <inline-formula> <tex-math>$9.77\\\\times 10^{-{10}}$ </tex-math></inline-formula> at 153 K, which correlates with the increase in gate-induced drain leakage (GIDL) as temperature rises. After the device under test (DUT) was irradiated at 153, 300, and 373 K, the TID-induced error density was estimated. The generation of interface traps was higher at 373 K than at 153 K, leading to an increase in the TID-induced error density. However, the error density at 300 K was 1.1 times as high as that at 373 K. This occurs because the DUT irradiated at 373 K is more favorable for defect recovery via annealing than at 300 K.\",\"PeriodicalId\":13092,\"journal\":{\"name\":\"IEEE Transactions on Electron Devices\",\"volume\":\"72 9\",\"pages\":\"5243-5246\"},\"PeriodicalIF\":3.2000,\"publicationDate\":\"2025-08-05\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Electron Devices\",\"FirstCategoryId\":\"5\",\"ListUrlMain\":\"https://ieeexplore.ieee.org/document/11114080/\",\"RegionNum\":2,\"RegionCategory\":\"工程技术\",\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"Q2\",\"JCRName\":\"ENGINEERING, ELECTRICAL & ELECTRONIC\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Electron Devices","FirstCategoryId":"5","ListUrlMain":"https://ieeexplore.ieee.org/document/11114080/","RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
Single-Event Upset and Total Ionizing Dose Effects on DDR4 DRAM Due to Proton Irradiation Under Different Temperatures
In this study, single-event upset (SEU) and total ionizing dose (TID) effects on DDR4 dynamic random access memory (DRAM) under 48-MeV proton radiation and various temperatures (153–373 K) were investigated. The SEU-induced error density reached a maximum of $5.59\times 10^{-{6}}$ at 373 K and a minimum of $9.77\times 10^{-{10}}$ at 153 K, which correlates with the increase in gate-induced drain leakage (GIDL) as temperature rises. After the device under test (DUT) was irradiated at 153, 300, and 373 K, the TID-induced error density was estimated. The generation of interface traps was higher at 373 K than at 153 K, leading to an increase in the TID-induced error density. However, the error density at 300 K was 1.1 times as high as that at 373 K. This occurs because the DUT irradiated at 373 K is more favorable for defect recovery via annealing than at 300 K.
期刊介绍:
IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.