基于finfet的逻辑兼容低压线性注入模拟存储器

IF 3.2 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC
Hsin-Hung Yeh;Min-Hsun Chuang;Jiaw-Ren Shih;Chrong Jung Lin;Ya-Chin King
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引用次数: 0

摘要

本研究介绍了一种基于浮栅逆变器的先进模拟存储单元架构,并在FinFET技术节点上实现。该电池集成了一个CMOS逻辑门,其模拟电平直接受到存储在浮栅内的电荷量的影响。这种独特的共享浮动门配置允许对存储的模拟值进行精确控制,与传统设计相比,可以实现更宽范围的信号电平。互补的设计方法进一步增强了存储单元的灵活性和稳健性,使多功能读出方法能够适应过程和操作条件的变化。此外,模拟电平的脉冲控制调制,结合为该结构量身定制的创新读出技术,已在本研究中成功演示,展示了未来先进CMOS技术中高性能,低功耗和可扩展模拟存储器解决方案的潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
FinFET-Based Logic-Compatible Low-Voltage Linear-Injection Analog Memory
This research introduces an advanced analog memory cell architecture based on a floating-gate inverter, implemented in the FinFET technology node. The cell integrates a CMOS logic gate, where its analog levels are directly influenced by the amount of charge stored within the floating gate. This unique shared-floating-gate configuration allows precise control over the stored analog values, making it possible to achieve a wider range of signal levels compared to traditional designs. The complementary design approach further enhances the flexibility and robustness of the memory cell, enabling versatile readout methods that are resilient to variations in process and operating conditions. Additionally, the pulse-controlled modulation of the analog levels, combined with innovative readout techniques tailored to this structure, has been successfully demonstrated in this study, showcasing the potential for high-performance, low-power, and scalable analog memory solutions in future advanced CMOS technologies.
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来源期刊
IEEE Transactions on Electron Devices
IEEE Transactions on Electron Devices 工程技术-工程:电子与电气
CiteScore
5.80
自引率
16.10%
发文量
937
审稿时长
3.8 months
期刊介绍: IEEE Transactions on Electron Devices publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors. Tutorial and review papers on these subjects are also published and occasional special issues appear to present a collection of papers which treat particular areas in more depth and breadth.
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